Patents by Inventor An-Chi Yeh

An-Chi Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200083182
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first conductive interconnect wire extending in a first direction over a substrate. A second conductive interconnect wire is arranged over the first conductive interconnect wire. A via rail is configured to electrically couple the first conductive interconnect wire and the second conductive interconnect wire. The first conductive interconnect wire and the second conductive interconnect wire extend as continuous structures past one or more sides of the via rail.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 12, 2020
    Inventors: Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young, Chi-Yeh Yu, Jiann-Tyng Tzeng, Ru-Gun Liu, Wen-Hao Chen
  • Publication number: 20200079044
    Abstract: A method of reclaiming a used seal includes boiling the used seal in a liquid, and after boiling the used seal in the liquid, baking the used seal. The boiling the used seal may include boiling for a predetermined boiling time in the liquid, and the baking the used seal may include baking the used seal for a predetermined bake time at a predetermined temperature.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 12, 2020
    Inventors: Shagun P. MAHESHWARI, Yao-Hung YANG, Tom K. CHO, Yu-Chi YEH, Andrew YU, Aniruddha PAL, Siamak SALIMIAN
  • Publication number: 20190391679
    Abstract: A metal mesh touch electrode for a touch panel comprises a plurality of breakpoint regions, a plurality of first metal mesh electrodes and a plurality of second metal mesh electrodes. The breakpoint regions are disposed between the first and second metal mesh electrodes. The first metal mesh electrodes comprises a first metal mesh layout formed by a plurality of first metal lines and a plurality of second metal lines that mutually intersect. The second metal mesh electrodes include a second metal mesh layout formed by the plurality of first metal lines and the plurality of second metal lines that mutually intersect. The plurality of first metal lines and the plurality of second metal lines intersect to form a plurality of intersections creating a mesh spacing. Widths of the first and second metal mesh electrodes and the breakpoint region comprise a sensing spacing.
    Type: Application
    Filed: July 19, 2018
    Publication date: December 26, 2019
    Inventors: Hsuan-Man CHANG, Po-Lin CHEN, Ya-Yin CHENG, Chia-Chi YEH
  • Publication number: 20190385944
    Abstract: An electronic device includes a substrate, first signal lines, pixel structures, first pads, transmission pads, a first combination circuit board, and a transmission circuit board. The first pads are electrically connected to some of a plurality of first signal lines. The transmission pads are electrically connected to some of the first signal lines. The first combination circuit board is disposed between a first side and a second side of the substrate opposite to each other. The transmission circuit board is disposed between the first combination circuit board and the second side of the substrate. The first combination circuit board is electrically connected to at least some of the first pads, and a first pitch exists between the adjacent first pads. The transmission pads are electrically connected to the transmission circuit board, and a transmission-pad pitch exists between the adjacent transmission pads. The transmission-pad pitch is greater than the first pitch.
    Type: Application
    Filed: November 13, 2018
    Publication date: December 19, 2019
    Applicant: Au Optronics Corporation
    Inventors: Chih-Hao Wang, Po-Fu Huang, Shang-Lin Chiang, Tsai-Chi Yeh, Chih-Hung Chen
  • Patent number: 10510688
    Abstract: The present disclosure relates to an integrated circuit having a via rail that prevents reliability concerns such as electro-migration. In some embodiments, the integrated circuit has a first plurality of conductive contacts arranged over a semiconductor substrate. A first metal interconnect wire is arranged over the first plurality of conductive contacts, and a second metal interconnect wire is arranged over the first metal interconnect wire. A via rail is arranged over the first metal interconnect wire and electrically couples the first metal interconnect wire and the second metal interconnect wire. The via rail has a length that continuously extends over two or more of the plurality of conductive contacts. The length of via rail provides for an increased cross-sectional area both between the first metal interconnect wire and the second metal interconnect wire and along a length of the via rail, thereby mitigating electro-migration within the integrated circuit.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young, Chi-Yeh Yu, Jiann-Tyng Tzeng, Ru-Gun Liu, Wen-Hao Chen
  • Publication number: 20190377444
    Abstract: A metal mesh touch module that alters the position of at least one auxiliary line disposed at the periphery of mesh units and conceals the auxiliary line by an ink layer that hides the auxiliary line. The display module is partitioned by a first partition line into a function zone and a border zone, the border zone having an ink layer. A touch electrode is disposed on the display module and comprises a plurality of mesh units. A protective covering is disposed on the touch electrode and partitioned by a second partition line into a visible zone and a bezel ink zone, the bezel ink zone comprising a light-blocking material. At least one auxiliary line is disposed on the periphery of the mesh units, electrically connected to the mesh units, and disposed on the touch electrode between the first partition line and the second partition line.
    Type: Application
    Filed: July 18, 2018
    Publication date: December 12, 2019
    Inventors: Chia-Chi YEH, Yue-Feng Yang, Po-Lin Chen, Ya-Yin Cheng, Yen-Heng Huang
  • Publication number: 20190284833
    Abstract: A combinative fence assembly includes two posts (1), a plurality of heighteners (2) and a rail (3). Each of the posts (1) has a combining side (10). The two combining sides (10) of the two posts are arranged at an interval and face each other. Each combining side (10) is formed with an inward trough. The heighteners (2) are separately embedded in the troughs (11). The rail (3) is connected between the two combining sides (10) of the two posts (1). Two ends of each rail (3) are separately embedded in the two troughs (11) of the two posts (1) and superposed on at least one of the heighteners (2). Thereby, a fence can be constructed depending on actual requirements.
    Type: Application
    Filed: March 15, 2018
    Publication date: September 19, 2019
    Inventors: Chang-Chi YEH, Hai-Ping SHI
  • Publication number: 20190288465
    Abstract: A receptacle connector assembly includes an outer housing and a terminal module. The terminals module includes an insulator having a base and a mating tongue extending from the base and equipped with a plurality of contacts. The contacts include front contacting sections exposed upon the mating tongue and tail sections extending out of the base. The outer housing is of an insulative molding part or a metallic die cast, the terminal module is assembled in the outer housing, and thus a mating cavity is directly defined between the mating tongue and the outer housing.
    Type: Application
    Filed: June 3, 2019
    Publication date: September 19, 2019
    Inventors: TERRANCE F. LITTLE, CHIH-PI CHENG, WEI-HAO SU, CHENG-CHI YEH, YUAN ZHANG, STEPHEN SEDIO, Hendrikus P.G. Van der Steen
  • Publication number: 20190221492
    Abstract: A processor socket assembly includes a processor socket, a base frame, a guide member and a carrier. The processor socket is located on a circuit board. The base frame surrounds the processor socket. The guide member is pivoted to an edge of the bottom frame to be rotatable relative to the processor socket, and the guide member has a slot. The carrier detachably engages the slot of the guide member after being combined with a processor and is capable of being rotated with the guide member.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 18, 2019
    Inventors: Chang-Chi YEH, Wei-Han HUANG
  • Publication number: 20190177435
    Abstract: Pharmaceutical composition comprising antibodies or antigen binding fragments thereof that bind to globo H, SSEA3, and SSEA-4 are disclosed herein, as well as methods of use thereof. Methods of use include, without limitation, cancer therapies and diagnostics. The antibodies of the disclosure can bind to certain cancer cell surfaces. Exemplary targets of the antibodies disclosed herein can include carcinomas, such as those in brain, skin, bone, lungs, breast, esophagus, stomach, liver, bile duct, pancreas, colon, kidney, cervical, ovarian, and/or prostate cancer.
    Type: Application
    Filed: November 8, 2018
    Publication date: June 13, 2019
    Inventors: Chi-Huey Wong, Tsui-Ling Hsu, Yi-Wei Lou, Chih-Wei Lin, Shih-Chi Yeh, Chung-Yi Wu, Han-Chung Wu
  • Patent number: 10312646
    Abstract: A receptacle connector assembly includes an outer housing and a terminal module. The terminals module includes an insulator having a base and a mating tongue extending from the base and equipped with a plurality of contacts and a shielding plate. The contacts include front contacting sections exposed upon the mating tongue and tail sections extending out of the base. The shielding plate is embedded within the mating tongue and includes a pair of rigid notches in two opposite lateral sides for locking to a pair of corresponding latches of a complementary plug connector. The outer housing is of an insulative molding part or a metallic die cast, the terminal module is assembled in the outer housing, and thus a mating cavity is directly defined between the mating tongue and the outer housing.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: June 4, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Chih-Pi Cheng, Wei-Hao Su, Cheng-Chi Yeh, Yuan Zhang, Stephen Sedio, Hendrikus P. G. Van der Steen
  • Patent number: 10276993
    Abstract: A receptacle connector assembly includes an outer housing and a terminal module. The terminals module includes an insulator having a base and a mating tongue extending from the base and equipped with a plurality of contacts and a shielding plate. The contacts include front contacting sections exposed upon the mating tongue and tail sections extending out of the base. The shielding plate is embedded within the mating tongue and includes a pair of rigid notches in two opposite lateral sides for locking to a pair of corresponding latches of a complementary plug connector. The outer housing is of an insulative molding part or a metallic die cast, the terminal module is assembled in the outer housing, and thus a mating cavity is directly defined between the mating tongue and the outer housing.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: April 30, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Chih-Pi Cheng, Wei-Hao Su, Cheng-Chi Yeh, Yuan Zhang, Stephen Sedio, Hendrikus P. G. Van der Steen
  • Publication number: 20190122987
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a source region and a drain region separated by a channel region within a substrate. A middle-end-of-the-line (MEOL) structure is over the drain region and a gate structure is over the channel region. The MEOL structure is vertically disposed between the drain region and a plane extending along an upper surface of the gate structure. A first interconnect wire is connected to the MEOL structure by a first conductive contact that is directly over the drain region and that extends between the first interconnect wire and the MEOL structure. A conductive strap is located over the first interconnect wire. The conductive strap connects the first interconnect wire to a power rail having a larger width than the first interconnect wire.
    Type: Application
    Filed: December 11, 2018
    Publication date: April 25, 2019
    Inventors: Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chi-Yeh Yu, Jiann-Tyng Tzeng, Kam-Tou Sio, Pin-Dai Sue, Ru-Gun Liu, Shih-Wei Peng, Wen-Hao Chen, Yung-Sung Yen, Chun-Kuang Chen
  • Publication number: 20190105275
    Abstract: Described herein are pharmaceutical compositions for the oral administration of mesalazine, as well as methods of making such pharmaceutical compositions, and therapeutic methods for using them. The compositions comprise delayed-immediate release and delayed-extended release formulation of mesalazine.
    Type: Application
    Filed: April 18, 2017
    Publication date: April 11, 2019
    Applicant: Ferring B.V.
    Inventors: Alfred Chi Yeh LIANG, Venkataramana DINGARI
  • Publication number: 20190085062
    Abstract: Pharmaceutical composition comprising antibodies or antigen binding fragments thereof that bind to SSEA-4 are disclosed herein, as well as methods of use thereof. Methods of use include, without limitation, cancer therapies and diagnostics. The antibodies of the disclosure can bind to certain cancer cell surfaces. Exemplary targets of the antibodies disclosed herein can include carcinomas, such as those in brain, lung, breast, mouse, esophagus, stomach, liver, bile duct, pancreas, colon, kidney, cervix, ovary, and/or prostate cancer.
    Type: Application
    Filed: May 25, 2018
    Publication date: March 21, 2019
    Inventors: Chi-Huey Wong, Tsui-Ling Hsu, Yi-Wei Lou, Chih-Wei Lin, Shih-Chi Yeh, Chung-Yi Wu, Han-Chung Wu
  • Patent number: 10217398
    Abstract: A temperature sensing module for a display device includes a temperature sensing routing, configured on a panel of the display device; and a temperature sensing unit, able to sense a resistance of the temperature sensing routing and generate a temperature indicating information according to the resistance; wherein the temperature indicating information indicates an operating temperature of an active area of the panel and is utilized to adjust at least one driving signal that controls the active area to display images.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: February 26, 2019
    Assignee: Sitronix Technology Corp.
    Inventors: Chun-Chi Yeh, Chih-Te Hung
  • Publication number: 20190025605
    Abstract: A light redirecting film and a method for manufacturing the same are provided. The light redirecting film comprises a substrate, a first diffraction grating layer of a first curable resin on the substrate and a second diffraction grating layer of a second curable resin on the first diffraction grating layer. Wherein the grating directions of the first diffraction grating layer and the second diffraction grating layer cross each other at an angle of 90±10°, and the difference of the refractive index of the first curable resin and the second curable resin is no less than 0.1 and no more than 0.3.
    Type: Application
    Filed: November 21, 2017
    Publication date: January 24, 2019
    Inventors: Chen-Kuan Kuo, Cyun-Tai Hong, Chuen-Nan Shen, Chung-Hung Chien, Hung-Jiun Shieh, Tsung-Chi Yeh, Fung-Hsu Wu
  • Patent number: 10170422
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method is performed by forming gate structures and middle-end-of-the-line (MEOL) structures extending in a first direction over an active area of a substrate. The MEOL structures are interleaved between the gate structures along a second direction. The method further forms a power rail and a first metal wire extending in the second direction. The first metal wire is over the MEOL structures. A double patterning process is performed to form second and third metal wires extending in the first direction over the first metal wire and separated in the second direction. The second metal wire is cut according to a first cut region of a first cut mask to define a first metal strap connecting a first one of the MEOL structures to the power rail.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: January 1, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chi-Yeh Yu, Jiann-Tyng Tzeng, Kam-Tou Sio, Pin-Dai Sue, Ru-Gun Liu, Shih-Wei Peng, Wen-Hao Chen, Yung-Sung Yen, Chun-Kuang Chen
  • Patent number: RE47419
    Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding wall extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: June 4, 2019
    Assignee: Wistron Corporation
    Inventors: Ching-Fu Hsu, Tzu-Wei Lin, Lien-Te Kao, Chi-Yeh Lu, Ming-Hung Pan, Ming-Chen Lin, Min-Wei Lin, Ting-Feng Chen, Wan-Bing Xia, Kai-Cheng Yen, Meng Zhang
  • Patent number: D878449
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: March 17, 2020
    Assignee: AVER INFORMATION INC.
    Inventors: Hong-Chi Yeh, Bo-Ching Chiou, Chih-Chung Su, Chun-Yen Yu