Abstract: A liquid cosmetics container has a brushing device, which includes an applying component joined to a container body, and a clipping component around the applying component; the applying component is positioned over an opening of the container body, and has a passage therein for liquid cosmetics to flow through; the applying component has an applying portion at a tail, which is around a tail end of the passage; the clipping element has an opening end, and two gaps extending through the opening end, therefore the opening end is compressible; the clipping component has two opposing clipping portions on an inner side of the opening end; a cap is used to cover the opening of the container body; the cap has a squeezing portion on an inner side to compress the opening end of the clipping component so as to block the passage of the applying component.

Abstract: The present invention provides an electronic packaging process. The surface of the chip carrier includes at least a chip attachment region and a film attachment region adjacent to the chip attachment region. At least a baffle is formed on the surface of the chip carrier, between the chip attachment region and the film attachment region. After attaching the thin film to the film attachment region of the chip carrier through an affixture layer, the chip is electrically and physically connected to the chip attachment region of the chip carrier through an adhesive layer. The baffle can effectively prevent the gas that is released from the adhesive layer from damaging the bonding between the thin film and the affixture layer. Therefore, almost no bubbles are formed and good electrical connection between the thin film and the affixture layer is maintained.

Abstract: A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the periphery area and partially exposing the surface of the solder pads. The solder mask includes at least a void therein.

Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.

Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.

Abstract: A system-in-package structure for preventing a solder ball pad from being polluted and a method of fabricating the same are disclosed. The package structure includes a first package and a second package welded with each other. The first package has a carrier with plural solder ball pads and at least one integrated circuits (ICs) electrically connected to the carrier. A groove is formed around each solder ball pad and used to contain the overflowed sealing compound when the ICs are packaged on the first package by a sealing compound, so that the solder ball pad can avoid being polluted by the sealing compound. Thereby, the first package and second package are exactly electrical connected to each other and form a stacking structure.

Abstract: The present invention relates to a substrate structure having a solder mask and a process for making the same. The process comprises: (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. Whereby, the substrate structure of the invention can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.

Abstract: A method for preparing a gate oxide layer is described. First, a trench surrounding an active area is formed in a substrate, and a dielectric block is then formed in the trench such that an upper surface of the dielectric block is not aligned with that of the substrate. Subsequently, an ion implantation process is performed to implant nitrogen-containing dopants into the substrate in the active area, and a thermal oxidation process is then performed to form a gate oxide layer on the surface of the substrate in the active area. Particularly, the concentration of the nitrogen-containing dopants at the center of the active area is higher than that at the edge of the active area. The nitrogen-containing dopants inhibit the reaction rate of the thermal oxidation process, so as to prevent the gate oxide layer from thinning at the edge near the trench.

Abstract: A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the periphery area and partially exposing the surface of the solder pads. The solder mask includes at least a void therein.

Abstract: A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. The stud bumps are formed on the back surface. Each stud bump has a bump body and a protruding trail by wire-bonding and cutting. Bumps of another package are bonded on the stub bumps for replacing known intermediate substrate in conventional stacked package module.

Abstract: A wireless mouse includes a wireless receiver and a mouse main body. The mouse main body includes an upper cover, a base, a receiving part and a withdrawing part. The base includes a first sidewall and a second sidewall. The receiving part is defined at an end of the first sidewall. The withdrawing part is defined at an end of the second sidewall. The wireless receiver is stored within the mouse main body through the receiving part, and the wireless receiver having been stored within the mouse main body is partially detached from the mouse main body through the withdrawing part.

Abstract: A semiconductor package comprising a substrate and a semiconductor device disposed on the substrate by flip-chip bonding. The present invention is characterized by a connection structure disposed between the semiconductor device and the substrate that extends along the periphery of the bottom surface of the semiconductor device. As a result, it can preferably provide additional mounting support between the two. The connection structure can be formed from cured adhesive. The present invention also provides a method of manufacturing the semiconductor package.

Abstract: A frame including a first edge and a second edge, wherein on outer surfaces of the first edge, first hooks are formed to protrude outwardly, and on outer surfaces of the second edge, first holes are formed. A bezel has a first sidewall and a second sidewall, wherein on the first sidewall, second holes are formed, and on outer surfaces of the second sidewall, second hooks are formed to protrude outwardly. When the frame is mounted onto the bezel, the first edge is disposed onto inside surfaces of the first sidewall, and the first hooks are inserted and engaged in the second holes for fastening the frame and bezel, simultaneously the second edge is disposed onto the outside surfaces of the second sidewall, and the second hooks are inserted and engaged in the first holes for fastening the frame and the bezel.

Abstract: A semiconductor package comprising a substrate and a semiconductor device disposed on the substrate by flip-chip bonding. The present invention is characterized by a connection structure disposed between the semiconductor device and the substrate that extends along the periphery of the bottom surface of the semiconductor device. As a result, it can preferably provide additional mounting support between the two. The connection structure can be formed from cured adhesive. The present invention also provides a method of manufacturing the semiconductor package.

Abstract: A direct backlight module and assembly method thereof. The direct light type backlight module has a light diffusing plate, a frame, a reflective back plate, and a light source. The light diffusing plate has a first positioning portion on an edge of the light diffusing plate. The frame has a groove corresponding to the light diffusing plate, and a second positioning portion corresponding to the first positioning portion is provided in the groove. The reflective back plate is provided on a side of the frame, forming a cavity between the reflective back plate and the light diffusing plate for disposition of the light source. In assembly, the light diffusing plate is slotted in the groove of the frame to form a light diffusing module, and the light diffusing module is assembled with the reflective back plate and the light source to form the direct backlight module.

Abstract: The present invention provides an electronic packaging process. The surface of the chip carrier includes at least a chip attachment region and a film attachment region adjacent to the chip attachment region. At least a baffle is formed on the surface of the chip carrier, between the chip attachment region and the film attachment region. After attaching the thin film to the film attachment region of the chip carrier through an affixture layer, the chip is electrically and physically connected to the chip attachment region of the chip carrier through an adhesive layer. The baffle can effectively prevent the gas that is released from the adhesive layer from damaging the bonding between the thin film and the affixture layer. Therefore, almost no bubbles are formed and good electrical connection between the thin film and the affixture layer is maintained.

Abstract: A leading wire arrangement in a lighting fixture with back light module provides a set of connecting wire led from the lighting fixture to a rear side of the back light module via a lateral wall of the back light module.

Abstract: A universal entertainment system includes an entertainment unit, a universal mounting stand, and a folding joint. The entertainment unit includes an entertainment housing having a multimedia compartment, a display screen provided on a screen side, and a multi-functional multimedia circuitry disposed in the multimedia compartment for reading digital data of a multimedia. The universal mounting stand is adapted for supporting at a fixture surface. The folding joint pivotally connects the entertainment unit with the universal mounting stand in a rotatably movable manner, wherein the entertainment unit is adapted to pivotally fold with respect to the universal mounting stand to selectively adjust a tilt angle of the display screen with respect to the fixture surface and is adapted to rotatably fold with respect to the universal mounting stand to selectively adjust a revolving angle with respect to the universal mounting stand.

Abstract: A lever corkscrew has a body and a central spindle received inside the body. A transport assembly is slidably mounted inside the body, and two anchors securely are mounted on the one side of the transport assembly. Two arms with tooth-like protrusions are pivoted with the body and the protrusions are engaged with the central spindle. The central spindle is securely mounted on the transport assembly on the one side different with the side mounted with the anchors. When turning up the arms or turning down the arms, the central spindle will be driven up or down and also drive the transport assembly with the anchors to pull out the cork.

Abstract: An assembling structure of a backlight module for containing and fabricating components of the backlight module comprises following components. A frame has a first edge and a second edge, wherein on outer surfaces of the first edge first hooks are fabricated and protruding outwardly, and on outer surfaces of the second edge first holes are formed. A bezel has a first sidewall and a second sidewall, wherein on the first sidewall second holes are formed, and on outer surfaces of the second sidewall second hooks are formed and protruding outwardly. When the frame is mounted onto the bezel, the first edge is disposed onto inside surfaces of the first sidewall, and the first hooks are inserted and engaged in the second holes for fastening the frame and bezel, simultaneously the second edge is disposed onto outside surfaces of the second sidewall, and the second hooks are inserted and engaged in the first holes for fastening the frame and the bezel.