Abstract: Described herein are stackable semiconductor device packages and related stacked package assemblies and methods. In one embodiment, a manufacturing method includes: (1) providing a substrate including contact pads disposed adjacent to an upper surface of the substrate; (2) applying an electrically conductive material to form conductive bumps disposed adjacent to respective ones of the contact pads; (3) electrically connecting a semiconductor device to the upper surface of the substrate; (4) applying a molding material to form a molded structure covering the conductive bumps and the semiconductor device; (5) forming a set of cutting slits extending partially through the molded structure and the conductive bumps to form truncated conductive bumps; and (6) reflowing the truncated conductive bumps to form reflowed conductive bumps.

Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.

Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.

Abstract: In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate.

Abstract: The present invention relates to a semiconductor package. The semiconductor package includes a substrate, at least one chip, a plurality of conductive elements, a plurality of first conductors and a molding compound. The substrate has a plurality of first pads and a solder mask. The first pads are exposed to a first surface of the substrate, and the material of the first pads is copper. The solder mask is disposed on the first surface, contacts the first pads directly, and has at least one opening so as to expose part of the first pads. The chip is mounted on the first surface of the substrate. The conductive elements electrically connect the chip and the substrate. The first conductors are disposed on the first pads. The molding compound is disposed on the first surface of the substrate, and encapsulates the chip, the conductive elements and part of the first conductors.

Abstract: Described herein are stackable semiconductor device packages and related stacked package assemblies and methods. In one embodiment, a manufacturing method includes: (1) providing a substrate including contact pads disposed adjacent to an upper surface of the substrate; (2) applying an electrically conductive material to form conductive bumps disposed adjacent to respective ones of the contact pads; (3) electrically connecting a semiconductor device to the upper surface of the substrate; (4) applying a molding material to form a molded structure covering the conductive bumps and the semiconductor device; (5) forming a set of cutting slits extending partially through the molded structure and the conductive bumps to form truncated conductive bumps; and (6) reflowing the truncated conductive bumps to form reflowed conductive bumps.

Abstract: The present invention discloses a backlight module having replaceable light apparatus. The backlight module includes the replaceable light apparatus, a back plate and a frame body. The replaceable light apparatus includes a light control circuit, a securing device and conducting wires. The light control circuit is adapted to a frame body and a back plate of the backlight module. Additionally, the light control circuit has a plurality of light sources, a first end portion and a second end portion. The securing device has a supporting housing which has a position protrusion and a clamping portion for supporting the first end portion of the light control circuit along a first direction (X) and a third direction (Z). The clamping portion clamps the first end portion of the light control circuit along a second direction (Y) and the third direction (Z).

Abstract: A wireless mouse includes a wireless receiver and a mouse main body. The mouse main body includes an upper cover, a base, a receiving part and a withdrawing part. The base includes a first sidewall and a second sidewall. The receiving part is defined at an end of the first sidewall. The withdrawing part is defined at an end of the second sidewall. The wireless receiver is stored within the mouse main body through the receiving part, and the wireless receiver having been stored within the mouse main body is partially detached from the mouse main body through the withdrawing part.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a packaging substrate, a chip, an interposer substrate, a wire and an adhesive layer. The packaging substrate has an upper packaging surface. The chip is disposed on the upper packaging surface. The wire connects the packaging substrate and the interposer substrate. The adhesive layer is disposed between the packaging substrate and the interposer substrate, and covers the entire chip and part of the upper packaging surface. The adhesive layer includes a first adhesive part and a second adhesive part. The first adhesive part adheres the interposer substrate and the chip. The second adhesive part surrounds the first adhesive part, adheres the interposer substrate and the packaging substrate, and supports a periphery of the interposer substrate.

Abstract: A semiconductor package includes: (1) a substrate including an upper surface and a lower surface opposite to the upper surface; (2) a chip mounted and electrically connected to the upper surface of the substrate; (3) an interposer mounted on the chip and electrically connected to the upper surface of the substrate, the interposer including an upper surface and a lower surface that is opposite to the upper surface and facing the chip, the interposer including a plurality of electrical contacts located on the upper surface of the interposer; and (4) a molding compound sealing the substrate, the interposer, and the chip, and exposing the lower surface of the substrate, the molding compound defining a plurality of holes that enclose and expose respective ones of the electrical contacts.

Abstract: In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate.

Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.

Abstract: A direct current (DC) drive includes a voltage input unit, a comparing unit, a latch unit and a voltage output unit. The voltage input unit has at least one input terminal and at least one output terminal provides a DC voltage. The comparing unit receives the DC voltage and generates a comparison control signal according to a comparison result obtained by comparing a voltage of a positive voltage terminal with a voltage of a negative voltage terminal. The latch unit is connected to the comparing unit and the voltage input unit. The voltage output unit connected to the latch unit receives the DC voltage from the voltage input unit. The latch unit selectively provides the DC voltage to the voltage output unit according to the comparison control signal.

Abstract: A backlight module and a display panel device using the same are provided. The backlight module includes a light source module, an open frame, and a reflector sheet. The open frame is disposed around the light source module and has a first free-end and a second free-end. A space interval exists between the first and second free-ends. The reflector sheet is disposed on a rear side of the light source module and has a body and a sidewall. The sidewall corresponds to the space interval between the first and second free-ends and extends over the light source module. The display panel further includes a liquid crystal display panel (LCD panel) on the light source module and a front frame which is disposed on the LCD panel enclosing a lateral side of the LCD panel. The sidewall of the reflector sheet extends between the lateral side of the LCD panel and the front frame to provide insulation.

Abstract: The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.

Abstract: The present invention discloses a backlight module having replaceable light apparatus. The backlight module includes the replaceable light apparatus, a back plate and a frame body. The replaceable light apparatus includes a light control circuit, a securing device and conducting wires. The light control circuit is adapted to a frame body and a back plate of the backlight module. Additionally, the light control circuit has a plurality of light sources, a first end portion and a second end portion. The securing device has a supporting housing which has a position protrusion and a clamping portion for supporting the first end portion of the light control circuit along a first direction (X) and a third direction (Z). The clamping portion clamps the first end portion of the light control circuit along a second direction (Y) and the third direction (Z).

Abstract: A coating composition comprises a resin, an antistatic agent and an antistatic aid, wherein the antistatic aid is selected from a group consisting of a siloxane compound, a fluoro-compound and a combination thereof. The antistatic aid can generate a synergy effect with the antistatic agent, and carry the antistatic agent out of the coating surface, thus can obviously reduce the amount of antistatic agent to achieve the desired antistatic effect by using a small amount of antistatic aid. The coating composition can be applied to various products with antistatic needs.

Abstract: A liquid cosmetics container has a brushing device, which includes an applying component joined to a container body, and a clipping component around the applying component; the applying component is positioned over an opening of the container body, and has a passage therein for liquid cosmetics to flow through; the applying component has an applying portion at a tail, which is around a tail end of the passage; the clipping element has an opening end, and two gaps extending through the opening end, therefore the opening end is compressible; the clipping component has two opposing clipping portions on an inner side of the opening end; a cap is used to cover the opening of the container body; the cap has a squeezing portion on an inner side to compress the opening end of the clipping component so as to block the passage of the applying component.

Abstract: A substrate structure having a solder mask and a process for making the same, including (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. The substrate structure can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.

Abstract: A make-up container includes a containing body, a soft application device, a rigid reinforcement element for the soft application device, and a cap; the containing body has an opening, and the reinforcement element is positioned on the opening of the containing body; the application device surrounds and covers an annular portion of the reinforcement element at a base portion thereof therefore the base portion of the application device can't change shape easily even if it is subjected to pressure; the application device and the containing body are joined together so as to be inseparable; the application device has a through hole on one end thereof, which communicates with an inside of the containing body; the cap serves to cover the application device.