Abstract: A type of combined electrical connector is at least made by combining an outer shell component and a joining component. The joining component at least consists of a joining major conductive terminal assembly and a joining minor conductive terminal assembly. Therefore, after the electrical connector design is completed, customization of the quantity, structure, and electrical connection relationships of the conductive terminals can still be achieved by adjusting the outer shell component and the joining component to meet the specific requirements and advancements in electronic devices.

Abstract: A type of combined electrical connector is at least made by combining an outer shell component and a tongue component. The tongue component at least consists of a tongue major conductive terminal assembly and a tongue minor conductive terminal assembly. Therefore, after the electrical connector design is completed, customization of the quantity, structure, and electrical connection relationships of the conductive terminals can still be achieved by adjusting the outer shell component and the tongue component to meet the specific requirements and advancements in electronic devices.

Abstract: A voltage conversion device includes a filter circuit, a first inductor, a second inductor a first conversion module, a second conversion module, and a control circuit. The filter circuit is electrically connected to a first AC terminal and a second AC terminal. The first inductor is electrically connected to the first AC terminal and a first conversion terminal. The second inductor is electrically connected to the second AC terminal and a second conversion terminal. The first conversion module is electrically connected to a first DC voltage terminal, a second DC voltage terminal, and the first conversion terminal. The second conversion module is electrically connected to the first DC voltage terminal, the second DC voltage terminal, and the second conversion terminal. The control circuit transmits switch-control signals to the first conversion module and the second conversion module. A voltage conversion method is used with the voltage conversion device.

Abstract: A semiconductor device includes a substrate, an interfacial layer formed on the semiconductor substrate, and a high-k dielectric layer formed on the interfacial layer. At least one of the high-k dielectric layer and the interfacial layer is doped with: a first dopant species, a second dopant species, and a third dopant species. The first dopant species and the second dopant species form a plurality of first dipole elements having a first polarity. The third dopant species forms a plurality of second dipole elements having a second polarity. A first concentration ratio of the first concentration of the first dopant species to the second concentration of the second dopant species of the p-type transistor is different from a second concentration ratio of the first concentration of the first dopant species to the second concentration of the second dopant species of the n-type transistor.

Abstract: An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.

Abstract: A semiconductor device includes a substrate having a first conductivity type, an epitaxial layer formed on the substrate, a well region extending from a top surface of the epitaxial layer into the epitaxial layer, a drift region formed in the epitaxial layer and in contact with the bottom surface of the well region, a gate structure and a conductive structure. The epitaxial layer has the first conductivity type, the well region has the second conductivity type, and the drift region has the first conductivity type. The gate structure that extends from the top surface of the epitaxial layer penetrates the well region and is in contact with the drift region. The conductive structure is formed in the drift region and disposed below the gate structure. A gate electrode of the gate structure is separated from the underlying conductive structure by the gate dielectric layer of the gate structure.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: An optical sensing apparatus includes a first photo-detecting layer having a first absorption region configured to absorb light in at least a visible spectrum; a second photo-detecting layer formed over the first photo-detecting layer, the second photo-detecting layer having a second absorption region configured to absorb light in at least a mid-infrared spectrum; a first buffer layer formed over the second photo-detecting layer; and a second buffer layer formed over the first photo-detecting layer and under the second photo-detecting layer.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A battery pack mounting structure of a vehicle includes: a frame side member of a chassis frame provided so that an upper end portion thereof is located at a position spaced downward by a predetermined reference downward distance from a step height set in consideration of ease of boarding of passengers; a battery case provided so that a battery accommodated in the battery case overlaps the frame side member in a horizontal direction thereof; a case side portion forming a side surface of the battery case, coupled to a lower side of the frame side member, and including a lower end portion aligned with a lowest ground height of the vehicle; and a case lower plate forming the battery case while supporting a lower side of the battery and disposed at a position spaced upwards from the lowest ground height.

Abstract: There are provided a laser irradiation apparatus, a laser irradiation method, and a semiconductor device manufacturing method that reduce irradiation unevenness of a laser beam. A laser irradiation apparatus includes a waveform shaping device (20). The waveform shaping device (20) includes a laser beam source (11), a first waveform shaping unit (30) that shapes the pulse waveform of a pulse laser beam by applying a delay according to an optical path length difference between two light beams (L11 and L12) branched by a first beam splitter (31), a wave plate that changes the polarization state of the pulse laser beam from the first waveform shaping unit (30), and a second waveform shaping unit (40) that shapes the pulse waveform of the pulse laser beam by applying a delay according to an optical path length difference between two light beams (L15 and L16) branched by a second beam splitter (41).

Abstract: Methods and systems are provided herein for selecting an affinity reagent which binds a desired peptide epitope in a plurality of sequence contexts. The method relies on obtaining a peptide library, each peptide having the sequence ?X?, wherein X is the desired peptide epitope, wherein each of ? and ? comprise an amino acid, using the peptide library to select an affinity reagent.

Abstract: A light irradiation device includes a light source unit emitting a light to a wounded are of a skin and a controller controlling the light source unit. The light source unit includes a substrate, at least one first light source disposed on the substrate and emitting a first light in a blue wavelength band, and at least one second light source disposed on the substrate and emitting a second light in a red wavelength band to a near-infrared wavelength band. The first and second lights have different skin penetration depths from each other depending on a wavelength.

Abstract: The present invention relates to a ubiquitin-specific peptidase 24 inhibitor, a medicinal composition and a method of delaying or reversing multidrug resistance in cancers using the same. The USP24 inhibitor, which includes a shUSP24 RNA and/or a carbonyl substituted phenyl compound, can serve as a chemosensitizing agent for inhibiting the drug pump out, cancer stemness and genomic instability of cancer cells, thereby being applied to a medicinal composition and a method for delaying or reversing multidrug resistance in cancers.

Abstract: The disclosure relates to a flexible display device including: a display panel including a touch sensor, where the display panel is foldable with respect to a folding axis; a cover window disposed on a front surface of the display panel; and a front surface film disposed on a front surface of the cover window, where the front surface film includes a protection film, and a base film having a transverse direction, and the transverse direction is perpendicular to a direction of the folding axis.

Abstract: An electronic device includes a display and at least one processor operatively connected to the display. The at least one processor is configured to receive a request to modify how to select an interactive element that is displayed at a first location on the display. The interactive element is configured to launch an operation when selected. The at least one processor is also configured to associate an input mechanism with the interactive element for launching the operation based on the request. The at least one processor is further configured to perform the operation associated with the interactive element in response to receiving the input mechanism.

Abstract: An apparatus and method of manufacture for a modular seamless touchpad assembly comprising a seamless glass layer extending to a plurality of palm rest surfaces formed over a touchpad support bracket that extends across a top cover of a base chassis of an information handling system and including a touchpad printed circuit board assembly (PCBA) and a haptic actuator array coupled between the touchpad PCBA and the touchpad support bracket for generating haptic user feedback. The touchpad support bracket is formed under the haptic actuator array to support the modular seamless touchpad assembly as an installable hardware module to modularly fit within a touchpad opening formed in the top cover of the base chassis and a connector port to operatively couple a haptic touchpad controller with a reciprocal connector in the touchpad opening such that the modular seamless touchpad assembly is testable via the connector port before installation.

Abstract: A method for touchless gesture recognition is provided. The method includes transmitting ultrasonic signals via a speaker. The method includes generating ultrasonic signals. The method includes receiving the reflected ultrasonic signals from an object via two or more microphones. The method includes computing a frequency shift according to the reflected ultrasonic signals. The method includes identifying a gesture that corresponds to a movement of the object according to the frequency shift. The method includes performing a function that corresponds to the gesture.

Abstract: A walk-behind electric gardening device, comprising: a base unit arranged to move on a surface; a handle assembly connected to the base unit; a tool connected to the base unit for performing gardening operation; a first drive unit operable to propel the base unit; a second drive unit operable to drive the tool; and a switch assembly operable by a user to selectively activate and deactivate the first drive unit.