Abstract: According to the present exemplary embodiments, provided are a traffic signal system and a vehicle which estimate a position and a moving direction of a vehicle in accordance with a driving status of the vehicle at an intersection and improve a positioning accuracy based on wired or wireless communication.

Abstract: An electrostatic discharge (ESD) circuit is used to protect an internal circuit. The ESD circuit includes: an ESD clamp, having a first terminal connected to a power and a second terminal connected to a ground voltage; and a first switch, connected between an ESD terminal of the ESD clamp and the internal circuit. A gate of the first switch is controlled by a state signal in the ESD clamp to turn off the first switch when an ESD event occurs on the first terminal of the ESD clamp and turn on the first switch when the ESD event does not occur.

Abstract: A method of manufacturing a semiconductor device includes forming a first dielectric layer over a substrate, forming a metal layer in the first dielectric layer, forming an etch stop layer on a surface of the first dielectric layer and the metal layer, removing portions of the metal layer and the etch stop layer to form a recess in the metal layer, and forming a tungsten plug in the recess. The recess is spaced apart from a bottom surface of the etch stop layer.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes memory cells connected to word lines and bit lines and configured to retain a threshold voltage corresponding to one of a plurality of data states following a program operation. A control circuit is coupled to the word lines and the bit lines. The control circuit is configured to count a bit-scan quantity of the memory cells during a bit-scan of the program operation. The control circuit determines whether the bit-scan quantity of the plurality of memory cells is greater than at least one predetermined bit-scan threshold. In response to the bit-scan quantity of the memory cells being greater than the at least one predetermined bit-scan threshold, the control circuit is configured to adjust a word line ramp rate of a word line voltage applied to the word lines during the program operation.

Abstract: A device for measuring repeated positioning precision of a robotic arm is introduced. Using an optical speckle three-dimensional displacement sensor developed by the inventor, and with collaboration of an optical speckle image three-dimensional positioning base built with an optical speckle coordinate database and having low thermal expansion, an optical speckle three-dimensional absolute positioning space is established. The optical speckle three-dimensional displacement sensor is installed on an end effector of a robotic arm, the robotic arm is moved to have the optical speckle three-dimensional displacement sensor enter an optical speckle three-dimensional absolute positioning space, an optical speckle image of a positioning point is captured and compared with a coordinate optical speckle image in the optical speckle coordinate database, and current three-dimensional absolute positioning coordinates of the end effector of the robotic arm can be obtained.

Abstract: An amphibious caterpillar vehicle includes a central body of a second buoyancy material of a track shoe is disposed between a pair of wheels. An engagement body of the second buoyancy material of the track shoe is inserted into a buoyancy material engagement groove of each of the wheels so that a driving force is transferred from a driving sprocket to a caterpillar track. A coupling force between driving sprockets and track shoes forming a caterpillar track increases so that the caterpillar track is able to stably receive the driving force without slipping from the driving sprockets.

Abstract: A fin transistor structure is provided. The fin transistor structure includes a first substrate. An insulation layer is disposed on the first substrate. A plurality of fin structures are disposed on the insulation layer. A supporting dielectric layer fixes the fin structures at the fin structures at waist parts thereof. A gate structure layer is disposed on the supporting dielectric layer and covers a portion of the fin structures.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: A polishing pad adapted for polishing an object and having a polishing track region is provided. The polishing pad includes a polishing layer and an adhesive layer. The polishing layer has a polishing surface and a rough bottom surface opposite to each other, and the rough bottom surface includes a plurality of discontinuous dents. The adhesive layer is adhered to the rough bottom surface.

Abstract: Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.

Abstract: A semiconductor device is provided. The semiconductor device includes first channel nanostructures in a first device region and second channel nanostructures in a second device region. The first channel nanostructures are disposed between first and second dielectric fins. The second channel nanostructures are disposed between first and third dielectric fins. A gate dielectric layer is formed to surround each of the first and the second channel nanostructures and over the first, the second and the third dielectric fins. A first work function layer is formed to surround each of the first channel nanostructures. A second work function layer is formed to surround each of the second channel nanostructures. A first gap is present between every adjacent first channel nanostructures and a second gap present is between every adjacent second channel nanostructures.

Abstract: A wireless communication method, by a first apparatus, includes receiving a first Physical Layer Protocol Data Unit (PPDU) from a second apparatus, extracting a first field from a first signal field included in the first PPDU, and identifying the number of symbols in the second signal field included in the first PPDU based on a value of the first field, wherein, when the first field has a first value, the identifying the number of symbols in the second signal field includes identifying that the number of symbols in the second signal field is equal to or greater than a first number.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a resistive element over the substrate. The semiconductor device structure also includes a thermal conductive element over the substrate. A direct projection of the thermal conductive element on a main surface of the resistive element extends across a portion of a first imaginary line and a portion of a second imaginary line of the main surface. The first imaginary line is perpendicular to the second imaginary line, and the first imaginary line and the second imaginary line intersect at a center of the main surface.

Abstract: Example electronic devices with adjustable antennas as disclosed. In an example, the electronic device includes a housing, and an antenna disposed within the housing. The antenna includes a slot extending between a first conductive surface and a second conductive surface, and a contact clip coupled to the first conductive surface and the second conductive surface so that the first conductive surface is coupled to the second conductive surface through the contact clip. The contact clip is to move along the slot to adjust an operating frequency of the antenna.

Abstract: A power supply system includes an output terminal, a power supply control chip, a power supply switch and a detection device. The power supply control chip is configured to adjust the amount of an input power providing to an electronic device by the power supply device. The power supply switch is configured to control the connection between the power supply device and the power supply control chip. The detection device is configured to detect whether the power supply control chip operates normally. When the power supply control chip operates abnormally, the detection device controls the connection between the power supply device and the power supply control chip through the power supply switch for restarting the power supply control chip. The power supply control chip, the power supply switch and the detection device are disposed in an enclosed space.

Abstract: The disclosure provides a light cabinet, including multiple light boards and multiple light-board controllers. The light boards form a first light-board array of the light cabinet. The light-board controllers are arranged one-to-one on the light boards. The light-board controllers of the light boards in a first column of the first light-board array are connected in series to form a first controller string. The output terminal of the first controller string is connected electrically to an input terminal of a second controller string in a corresponding column of a second light-board array of another light cabinet. The input terminal of the first controller string is connected electrically to a first output terminal of a video data splitter (or an output terminal of a third controller string in a corresponding column of a third light-board array of yet another light cabinet).

Abstract: A redriver chip comprising: pre-stage transmission pin sets, pre-stage reception pin sets, post-stage transmission pin sets, post-stage reception pin sets and selectors. The pre-stage transmission pin sets and the pre-stage reception pin sets are disposed in alternating arrangement, and the post-stage transmission pin sets and the post-stage reception pin sets are disposed in alternating arrangement. The amount of the post-stage transmission pin sets is an integral multiple of the amount of pre-stage reception pin sets, and the amount of the pre-stage reception pin sets is an integral multiple of the pre-stage transmission pin sets. Each of the selectors is connected to one of the pre-stage reception pin sets and integral multiple amount of the post-stage transmission pin sets, or is connected to one of the pre-stage transmission pin sets and integral multiple amount of the post-stage reception pin sets.

Abstract: An endoprosthesis delivery system includes a branched endoprosthesis having a long leg and a short leg, each leg having an end, the short leg including a tail that extends beyond the end of the short leg, a constraint attached to at least a portion of the long leg prior to deployment. The constraint also retains at least a portion of the tail. The constraint is configured to release both the long leg and the tail when the branched endoprosthesis is fully deployed.

Abstract: In some embodiments, the present disclosure relates to a method of forming an integrated chip. The method includes forming a bottom electrode layer over a substrate and forming a seed layer over the bottom electrode layer. A ferroelectric switching layer is formed over the bottom electrode layer and to contact the seed layer. The ferroelectric switching layer is formed to have a first region with a first crystal phase and a second region with a different crystal phase. A top electrode layer is formed over the ferroelectric switching layer. One or more patterning processes are performed on the bottom electrode layer, the seed layer, the ferroelectric switching layer, and the top electrode layer to form a ferroelectric random access memory (FeRAM) device.

Abstract: Some embodiments of the present application disclose a polishing liquid supply system. In the present application, the polishing liquid supply system includes: a polishing liquid preparation device, a cleaning liquid supply device and a filtering device, and further includes a supply pipeline connected with the polishing liquid preparation device and the filtering device and a cleaning pipeline connected with the cleaning liquid supply device and the filtering device. The polishing liquid preparation device is configured to prepare a polishing liquid and convey the prepared polishing liquid to the filtering device through the supply pipeline. The filtering device is configured to filter the polishing liquid and convey the filtered polishing liquid to a polishing device connected with the filtering device. The cleaning liquid supply device is configured to convey a cleaning liquid to the filtering device through the cleaning pipeline.