Abstract: A lead-bond type chip package includes a multilayer substrate for supporting and electrical interconnecting a semiconductor chip. The multilayer substrate has a slot defined therein. The multilayer substrate comprises an interlayer circuit board having prepregs disposed thereon, a plurality of leads on the prepreg on the upper surface of the interlayer circuit board, and a plurality of solder pads for making external electrical connection on the prepreg on the lower surface of the interlayer circuit board. The leads of the multilayer substrate are bonded to corresponding bonding pads formed on the semiconductor chip. A package body is formed on the multilayer substrate around the semiconductor chip and in the slot of the multilayer substrate. The multilayer substrate is capable of providing a power or ground plane formed therein for enhancing the electrical performance of the package, and providing a high wiring density for packaging a chip with high I/O connections.

Abstract: In a flip chip process, a wafer is provided with a plurality of chips therein. Each chip has an active surface on which are formed a plurality of bonding pads. A bump is formed on each bonding pad. A plurality of substrates respectively includes at least a package unit, wherein each package unit has a plurality of contact pads. The substrates are respectively mounted onto the wafer such that each package unit corresponds to one chip and the contact pads of the package unit are respectively connected to the corresponding bumps, wherein two neighboring substrates are separated by a gap. An underfill material fills between the wafer and the substrates, the underfill material being introduced through the gaps between the substrates and from the boundary of the wafer. The underfill material then is solidified. The substrates and the wafer are diced to form individualized packages.

Abstract: A thermal enhanced ball grid array package is provided. The substrate for the package includes a metal core layer and at least a first patterned wiring layer provided thereon. A first insulating layer is provided between the first patterned wiring layer and the metal core layer. At least a second patterned wiring layer is provided on the substrate, opposite to the surface having the first patterned wiring layer. A second insulating layer having solder balls between the second patterned wiring layer and the metal core layer. The second patterned wiring layer is electrically connected to the first patterned wiring layer. Blind vias are provided in the second patterned wiring layer and the second insulating layer. A heat conductive material or solder material is filled into the blind vias to form thermal balls. The heat from the chip to the metal core layer is transferred directly through the thermal balls.

Abstract: A flexible substrate includes a substrate constructed in a form of a tape, the substrate including patterns formed on at least one of an upper side and a bottom side thereof. The tape includes sprocket holes defied in each of two lateral edges thereof. A supporting layer is applied to at least one of the upper side and the bottom side of the substrate at an area not covered by the patterns to reinforce the substrate.

Abstract: The substrate of the present invention mainly includes a plurality of bonding pads, a plurality of ball pads, a plurality of traces, a plurality of holes, a first wire and a second wire. The bonding pads and ball pads are located on a first surface of the substrate and are connected to one another by the traces. The first wire is arranged at the edge of the first surface of the substrate, the second wire is arranged at a slot area of a second surface of the substrate which is adhesively covered by a solder mask and further has two ends connecting to the first wire. The holes connect the first surface to the second surface. The traces are connected the bonding pads and ball pads of the first surface by passing through the corresponding holes and a slot area to the second wire of the second surface to form closed loops. In the slot area, the solder mask adhesively covers the traces.

Abstract: A BGA package includes a chip with an array pad design disposed on the upper surface of a substrate. The chip has a plurality of bonding pads located about the periphery thereof, and the bonding pads of the chip are positioned in three rows, an inner row, a middle row, and an outer row along the sides of the chip. Only power supply pads and ground pads are designed to be located in the outer row of bonding pads, and all of the I/O pads are designed to be located in the middle row of the bonding pads and the inner row of the bonding pads.

Abstract: A packaged semi-conductor substrate includes a package encapsulant pouring area, a layout provided on the substrate, a layer of solder mask deposited on the layout, and a film provided on the solder mask. When the package encapsulant is pouted into the package encapsulant pouring area, the package encapsulant is isolated from the solder mask by the film. An adhering force between the film and the package encapsulant is greater than an adhering force between the film and the mask such that the film is degated along with the package encapsulant in the pouring channel during a degating procedure of the pouring channel after a pouring procedure of the package encapsulant. Thus, the film and the package encapsulant are not residual on the substrate.

Abstract: The background grey-level of a document is determined based on the gain of the document. A histogram is generated and compressed. The standard deviation of the distribution curve of the compressed histogram is determined. A gain factor is determined using the mean and standard deviation. Using the background grey-level, the dynamic range of the document is adjusted.

Abstract: A semiconductor packaging device includes a printed circuit board substrate, a mold gate formed on a periphery of the printed circuit board substrate through which a package encapsulant is poured to enclose electric elements mounted on a side of the printed circuit board, and a layer of non-metallic material covered on the side of the printed circuit board substrate in the mold gate area. The package encapsulant, after hardened, is bonded with the layer of non-metallic material, and the bonded package encapsulant/the layer of non-metallic material is degatable from the mold gate.

Abstract: The invention relates to a movable Christmas tree moving mechanism, particularly to one comprising a foundation, a connecting rod set, a U-shaped support, a cover plate, a mouth movement and an eye movement, whereby the coordination of an overlapped round cam on the foundation, and a short rod, low rod and a high rod in the connecting rod set, along with the configuration of a moving block of a U-shaped support, a mouth movement and an eye movement enables the movement of the jaw, eyes and head on a toy face.

Abstract: A system and process prints a high resolution image on a high addressable image output terminal by converting an image at one resolution to an image having a lower resolution in a fast-scan direction and a higher resolution in a pixel depth direction. The converted image is then processed and binarized prior to being printed on a high addressable printer. The system or process utilizes a conversion circuit which includes a two-bit per pixel packing circuit, a scanline buffer circuit, a logic circuit, and a look-up table. The conversion circuit initially converts the image into an image having a lower resolution in the fast-scan direction and a higher pixel depth resolution. Thereafter, the image is further converted to an image having a lower resolution in the slow-scan direction and a higher pixel depth resolution. This conversion of a high resolution image to a lower resolution is carried without any substantial lost to the image content data.

Abstract: There is provided an image data shifting system for a document processing system including a scanning device for reading a document including one or more hardcopy pages and converting the hardcopy pages to corresponding electronic pages with each electronic page being represented by image data. Each hardcopy page is scanned as a series of scanlines and the scanner generates a signal prior to scanning each scanline. Each scanline read by the scanner is stored in memory as image data representative of one of the electronic pages. The image shifting system includes a detector for detecting a first signal generated by the scanner and a second signal generated by the scanner.

Abstract: An apparatus for processing an input image, represented by an input bit stream including a plurality of first bit sets, is provided. The apparatus includes a device for processing the input bit stream in such a manner that each of the first bit sets is represented by a second bit set with each of the second bit sets having less bits than each of the first bit sets and a selected number of bits in the input bit stream, corresponding to image-related information, being discarded as a result of the encoding. The apparatus is provided with an electronic volatile memory for storing a resulting encoded bit stream and a bit stream analyzer for analyzing the stored encoded bit stream to generate positional signals. The apparatus is further provided with a reconstruction circuit for reconstructing the stored encoded bit stream, by reference to the positional signals.

Abstract: A system electronically registers an image on an input document. The system includes a scanner for generating an image data stream representing an electronic image of the image on the input document and an edge detecting circuit for detecting edge data within the image data stream. A circuit calculates a skew angle of the input document based on the detected edge data and rotates the electronic image based on the calculated skew angle to register the electronic image with an output medium. The system also includes a non-image area generating circuit for generating areas in the electronic image which correspond to non-image areas based on the calculated skew and detected edge data. The skew calculation, rotation operation and the non-image area generation is based the electronic detection of the corners and center of the leading edge of the document being scanned.

Abstract: There is provided a control apparatus for a printing machine located in a building with a portion of the building being characterized by an environmental state. The printing machine includes a print machine component, while the control apparatus includes a communication line, operatively coupled with the printing machine, across which signals are transmitted. A sensing arrangement, communicating with the communication line, transmits a signal, representative of the environmental state of the building portion, across the communication line. An interface receives and converts the signal to a control signal, the control signal being used to control the print machine component.

Abstract: A system controls a transformer having a primary coil. A pulse is applied to an inverter associated with the primary coil, whereby a leading edge of the pulse creates in the primary coil a tank circuit current of an initial polarity in a tank circuit inherent to the transformer. The tank circuit is seen from an effective inductance in series with the primary coil, the effective inductance including a leakage inductance of the primary coil, and an effective capacitance in parallel with the primary coil, the effective capacitance including a parasitic capacitance of the transformer. A trailing edge of the pulse occurs when the tank circuit current is different from the initial polarity.

Abstract: A charging device for producing a voltage potential on a photoconductive member including a corona generator for charging a portion of the image receptor to a substantially uniform potential; a corona generating potential source electrically connected to the corona generator; a sensor for determining the potential on the image receptor; and a microprocessor including an analog to digital converter interconnected to the corona generating potential source; the sensor; and the controller for regulation of the potential on the image receptor.

Abstract: A hinge for joining surfaces of sheet material comprises a strip of film/foam laminate positioned with a foam layer across the surfaces to be joined. The foam layer is tackified by heating and pressure is applied to the strip, thus heat sealing the strip to the surfaces. The hinge strip is preferably polyethylene film laminated to polyethylene foam and the surfaces to be joined may be polyethylene foam or a film/foam laminate.The joined surfaces are not damaged or destroyed by the heat lamination. The foam layer of the hinge sealing strip is partially or substantially melted and the film upper layer of the heat sealing strip forms a permanent waterproof bond with the surfaces which it joins.

Abstract: An apparatus is provided for programmably silencing a telephone ringer for one or more predetermined periods of time on a daily basis. In accordance with the time set by a user, the apparatus places the telephone ringer under the control of the data stored in the read only memory and the random access memory of the central processing unit, whereby the ringer can be automatically set at predetermined sounding condition.

Abstract: Isopropyl acetate cannot be completely removed from isopropyl acetate--isopropanol--water mixtures by distillation because of the presence of the minimum ternary azeotrope. Isopropyl acetate can be readily removed from mixtures containing it, isopropanol and water by using extractive distillation in which the extractive agent is a mixture of a polyol and one or higher boiling oxygenated, nitrogenous and/or sulfur containing organic compounds. Typical examples of effective agents are 1,3-butanediol and dimethylsulfoxide; 1,2,6-hexanetriol, dimethylsulfoxide and dimethylformamide.