Abstract: Systems and methods are provided for modifying or selecting processing conditions for bright stock formation based on compositional characterization of the feedstock and/or bright stock products. In some aspects, the compositional information can include Z-class characterization of the components of a feed and/or bright stock product, optionally in combination with carbon number and/or molecular weight for the components. The compositional information can be used to select processing conditions to allow for removal and/or modification of selected components within a bright stock in order to improve throughput and/or provide desirable cold flow properties.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: A semiconductor device package includes a first redistribution layer (RDL), a first die, a second die, a second RDL and an encapsulant. The first die is disposed on the first RDL and is electrically connected to the first RDL. The first die has a first electrical contact. The second die is disposed on the first RDL and is electrically connected to the first RDL. The second die has a first electrical contact. The second RDL is surrounded by the first RDL. The second RDL has a first electrical contact electrically connected to the first electrical contact of the first die and a second electrical contact electrically connected to the first electrical contact of the second die. A size of the first electrical contact of the second RDL is greater than a size of the second electrical contact of the second RDL.

Abstract: A data storage device utilized for storing a plurality of data includes a memory and a controller. The memory includes a plurality of blocks, and each of the blocks includes a plurality of physical pages. The controller is coupled to the memory and maps the logical pages to the physical pages of the memory. When the controller detects that a first logical page of the logical pages is a currently-used logical page, it detects whether or not the second logical page which belongs to the last logical page of the first logical page is a currently-used logical page in order to find what is truly the last currently-used logical page.

Abstract: The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.

Abstract: A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (UBM) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first UBM layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.

Abstract: A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (UBM) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first UBM layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.

Abstract: Disclosed herein are methods for treating an angiogenesis-related condition or disease in a subject in need thereof. Said method includes administering to the subject a peptide having at least 90% sequence identity of the sequence of SEQ ID NO: 1 or SEQ ID NO:3 in a therapeutically effective amount.

Abstract: The invention relates to a use of an aurantiamide dipepetide derivative in the treatment or prevention of angiogenesis-related diseases. Accordingly, aurantiamide dipeptide derivatives can be used as angiogenesis inhibitor, whereby preventing or treating invasive and metastatic cancer and ocular neovascularization (particularly macular degeneration such as pathological neovascularization of age-related macular degeneration (AMD)).

Abstract: A data storage device utilized for storing a plurality of data includes a memory and a controller. The memory includes a plurality of blocks, and each of the blocks includes a plurality of physical pages. The controller is coupled to the memory and maps the logical pages to the physical pages of the memory. When the controller detects that a first logical page of the logical pages is a currently-used logical page, it detects whether or not the second logical page which belongs to the last logical page of the first logical page is a currently-used logical page in order to find what is truly the last currently-used logical page.

Abstract: A data storage device utilized for storing a plurality of data includes a memory and a controller. The memory includes a plurality of blocks, and each of the blocks includes a plurality of physical pages. The controller is coupled to the memory. When the data storage device is initiated, or when the data size read by a host is greater than a threshold value, the controller inspects the status of the data stored by the physical pages of the memory.

Abstract: An evaluation system for determination of cardiovascular function parameters is provided. The evaluation system includes a data reading module, an image generating module, a contour determination module, an active contour module, a geometric center axis computing module, a view angle selection module and a function evaluation module. After reading cardiovascular graphic files with the data reading module, the image generating module displays 2D images or a 3D image constructed from the 2D images. Then, active contours are generated by the contour determination module and the active contour module, so as for the geometric center axis computing module to calculate geometric center axes. The view angle selection module then rotates the 3D image according to the view angle data received and modifies the 2D image files accordingly to generate plural cross-section images of the 3D image. Finally, the function evaluation module calculates evaluation parameters according to the geometric center axes.

Abstract: The invention relates to a use of an aurantiamide dipepetide derivative in the treatment or prevention of angiogenesis-related diseases. Accordingly, aurantiamide dipeptide derivatives can be used as angiogenesis inhibitor, whereby preventing or treating invasive and metastatic cancer and ocular neovascularization (particularly macular degeneration such as pathological neovascularization of age-related macular degeneration (AMD)).

Abstract: A method for improving access performance of a non-volatile storage device when programming data of a size smaller than a fixed minimum program number (FMPN) is disclosed. The method includes the steps of: predetermining a size of a blank data section for combining with a first data section and a second data section, the total size of the first data section, the second data section and the blank data section equals the FMPN; reading out data located at the second data section; updating a new data to the first data section; combining the new data with the data at the second data section; and incorporating the combined data with the blank data of the blank data section to become a final data, and programming the final data.

Abstract: Disclosed herein are methods for treating an angiogenesis-related condition or disease in a subject in need thereof. Said method includes administering to the subject a peptide having at least 90% sequence identity of the sequence of SEQ ID NO: 1 or SEQ ID NO:3 in a therapeutically effective amount.

Abstract: The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.

Abstract: The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.