Abstract: A computer-implemented method includes: extracting, by one or more processors, media data from an information technology ticket; extracting, by one or more processors, a plurality of data elements from the media data; and generating, by one or more processors, a ticket knowledge graph based on the plurality of data elements, wherein a node of the ticket knowledge graph represents a data element, and an edge between a first node and a second node in the ticket knowledge graph represents a correlation between a first data element represented by the first node and a second data element represented by the second node.

Abstract: An optical device for a head-mounted display apparatus comprises an optical lens assembly, a display unit, a lens and a mounting base. The mounting base includes a lens-mounting hole, and a side wall of the lens-mounting hole includes a first side-surface and a second side-surface which are opposite, and a third side-surface (and a fourth side-surface which are opposite. The lens is installed into the lens-mounting hole, the first side-surface and the second side-surface are respectively clamped to two sides of the lens, a gap is formed between the third side-surface and the lens, and a gap is formed between the fourth side-surface and the lens. The lens-mounting hole is clamped to the lens through the first side-surface and the second side-surface. While the lens is firmly mounted, there are gaps between the third side-surface and the lens and between the fourth side-surface and the lens.

Abstract: The described embodiments set forth techniques for management of electronic subscriber identity module (eSIM) profiles for a wireless device, including in-field replacement of provisioning (bootstrap) eSIM profiles. Public key infrastructure (PKI) information for an original equipment manufacturer (OEM) profile management server is installed in an embedded universal integrated circuit card (eUICC) of a wireless device at a time of manufacture and used subsequently by the wireless device to conduct an eSIM profile management session and verify authorization of the OEM profile management server to manage, e.g.

Abstract: The present disclosure includes system, methods, and kits relating to creating a second structure with a plurality of first structures at a target site inside or adjacent to a host object. The methods include the step of generating a field that non-invasively penetrates into the host object. The methods further include the step of positioning a first portion of the plurality of first structures at the target site using a force corresponding to the field. Additionally, the methods include the step of linking the first portion of the plurality of first structures with one another and/or the host object at the target site to form the second structure.

Abstract: A semiconductor device includes: a first fin and a second fin extending from a substrate and an epitaxial source/drain region. The epitaxial source/drain region includes a first portion grown on the first fin and a second portion grown on the second fin, and the first portion and the second portion are joined at a merging boundary. The epitaxial source/drain region further includes a first subregion extending from a location level with a highest point of the epitaxial source/drain region to a location level with a highest point of the merging boundary, a second subregion extending from the location level with the highest point of the merging boundary to a location level with a lowest point of the merging boundary, and a third subregion extending from the location level with the lowest point of the merging boundary to a location level with a top surface of an STI region.

Abstract: This Application sets forth techniques for binding and dynamic provisioning of international mobile equipment identifier (IMEI) values with cellular wireless service profiles, such as subscriber identity modules (SIMS) on physical SIM (pSIM) cards and electronic SIMs (eSIMs) on an embedded universal integrated circuit card (eUICC) of the mobile wireless device. When pSIMs and/or eSIMs change on the mobile wireless device, e.g., based on installation, activation, deactivation, de-installation, etc., IMEI binding logic accounts for the changes and maps IMEI values to pSIMs and/or eSIMs as required. IMEI values can be assigned based on a history of bindings between IMEI values and ICCID values of one or more eSIMS on an eUICC. A most recently used or a newly assigned IMEI value can be associated with an eSIM. Whether to assign an identical IMEI value to multiple eSIMs depends on requirements of associated cellular wireless service subscriptions.

Abstract: An optimization method for an implementation of mel-frequency cepstral coefficients is provided. The optimization method includes the following steps: performing a framing step, including using a 400×16 static random access memory to temporarily store a plurality of sampling points of a sound signal with overlap, and decomposing the sound signal into a plurality of frames. Each of the plurality of frames is 400 of the sampling points, there is an overlapping region between adjacent two of the plurality of frames, and the overlapping region includes 240 of the sampling points. The optimization method further includes performing a windowing step, which includes multiplying each of the plurality of frames by a window function in a bit-level design, and the optimization method includes performing a fast Fourier transform (FFT) step, which includes applying a 512 point FFT on a frame signal to obtain a corresponding frequency spectrum.

Abstract: The present disclosure provides a transistor device, a manufacturing method thereof, a display substrate and a display device. The transistor device includes a base substrate, as well as a first transistor and a second transistor that are disposed on the base substrate. The first transistor includes a first active layer. The second transistor includes a second gate. The first active layer and the second gate are disposed in the same layer.

Abstract: Provided is an epitaxial structure and a method for forming such a structure. The method includes forming a fin structure on a substrate, wherein the fin structure includes a semiconductor material having substantially a {110} crystallographic orientation. The method includes etching a portion of the fin structure to expose a sidewall portion of the semiconductor material. Further, the method includes growing an epitaxial structure on the sidewall of the semiconductor material, wherein the epitaxial structure propagates with facets having a {110} crystallographic orientation.

Abstract: A method for manufacturing an integrated circuit (IC) structure is provided. The method includes: etching a first recess and a second recess in a substrate; forming a sacrificial epitaxial plug in the first recess in the substrate; forming a first epitaxial feature and a second epitaxial feature respectively in the first recess and the second recess, wherein the first epitaxial feature is over the sacrificial epitaxial plug; forming a first source/drain epitaxial structure and a second source/drain epitaxial structure over the first epitaxial feature and the second epitaxial feature respectively; forming a gate structure laterally between the first source/drain epitaxial structure and the second source/drain epitaxial structure; removing the sacrificial epitaxial plug and the first epitaxial feature to form a backside via opening exposing a backside of the first source/drain epitaxial structure; and forming a backside via in the backside via opening.

Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.

Abstract: A micro-electronic element transfer apparatus including a first conveyer portion, a second conveyer portion, and a light source device is provided. The first conveyer portion is configured to output a plurality of micro-electronic elements. The second conveyer portion includes a first rolling component and a substrate. The substrate is disposed on the first rolling component and is moved through rolling of the first rolling component. A plurality of bumps are disposed on the substrate. The light source device is configured to irradiate the bumps for heating, and the bumps generate a phase transition. When the micro-electronic elements are outputted from the first conveyer portion, a connection force between the micro-electronic elements and the first conveyer portion is less than a connection force between the micro-electronic elements and the bumps. The micro-electronic elements are respectively bonded to the bumps. A micro-electronic element transfer method is also provided.

Abstract: This Application sets forth techniques for cellular service management for a secondary mobile wireless device assisted by a primary mobile wireless device, including provisioning and management of electronic subscriber identity modules (eSIMs) for a secondary mobile wireless device with user authorization obtained via the primary mobile wireless device.

Abstract: A method and a system of designing a memristor-based naive Bayes classifier and a classifier belonging to the field of information technology are provided. The method includes: constructing a naive Bayes classifier including a memristor array of M rows by 2N columns, where M is the number of classification types, and N is the number of pixels in a picture; calculating the number hj,2i?1 of the pixel value of 0 and the number hj,2i of the pixel value of 1 in an ith pixel in the jth training sample, where j=1, 2, . . . , and M; and applying hj,2i?1 pulses to a memristor Rj,2i?1 in a jth row and a 2i?1th column to modulate the conductance of the memristor Rj,2i?1 and applying hj,2i pulses to a memristor Rj,2i in the jth row and a 2ith column to modulate the conductance of the memristor Rj,2i.

Abstract: A resveratrol composition and its preparation method and application are disclosed, which relates to the technical field of resveratrol solid dispersion preparation. A resveratrol composition is prepared from following raw materials: 6%-60% by weight of resveratrol, and 40%-94% by weight of poloxamer. The disclosure mixes the resveratrol and poloxamer in proportion to prepare a composition, and further improves the dissolution and bioavailability of the resveratrol in combination with microencapsulation technology. The preparation process is suitable for industrialization and has good application and promotion prospects.

Abstract: A molecular marker of cadmium accumulation in rice improves cadmium accumulation in rice grains. The molecular marker of cadmium accumulation in rice includes a DNA fragment shown in the 8899129-9307609 region of rice chromosome 7, which is lcrf1 or lcrf2, lcrf1 is a DNA fragment shown in the 8899129-9307609 of rice chromosome 7, and the lcrf2 is the DNA fragment shown in SEQ ID No.1 in the sequence listing. The present invention finds that the molecular marker of cadmium accumulation in rice is related to the cadmium accumulation in rice grains, and the homozygous rice whose molecular marker of cadmium accumulation in rice is SEQ ID No. 1 in the sequence listing has the characteristics of low grain cadmium accumulation when planted in high cadmium polluted fields. Therefore, the DNA fragment can be introduced into other backgrounds by breeding methods such as hybridization and backcrossing.

Abstract: The present disclosure discloses a zonal trabecular uni-compartmental femoral condylar component containing zirconium-niobium alloy on oxidation layer and preparation method, including following steps: using zirconium niobium alloy powder as raw material, conducting a 3D printing for one-piece molding to obtain an intermediate product of the uni-compartmental femoral condylar component, performing hot isostatic pressing and cryogenic oxidation to obtain the uni-compartmental femoral condylar component; the uni-compartmental femoral condylar component includes an articular surface and an osseointegration surface, a bone trabeculae is arranged on the osseointegration surface.

Abstract: This Application sets forth techniques for cellular wireless service management for a secondary mobile wireless device assisted by a primary mobile wireless device, including delayed delivery of an electronic subscriber identity module (eSIM) to the secondary mobile wireless device for subscription to cellular wireless service of a mobile network operator (MNO).

Abstract: Embodiments are described herein for transferring a subscriber identity module (SIM) or electronic SIM (eSIM) profile securely from a source device to a target device with verifiable signatures generated by secure hardware elements of the source device contingent on receipt of a secure intent gesture. Trustworthiness of the profile transfer is based on a mobile network operator (MNO) entitlement server releasing a transfer token after verification of a message signed by an embedded universal integrated circuit card (eUICC) of the source device. The eUICC signs the message only after verifying a message from a secure enclave processor (SEP) of the source device that signs the message based on receipt of the secure intent gesture via a secure interface. To validate communication between the SEP and the eUICC, an asymmetric cryptographic key pair generated by the SEP is bound to a unique eUICC identifier (EID) value of the eUICC.

Abstract: A device includes a first nanostructure over a substrate and a first source/drain region adjacent the first nanostructure. The first source/drain region includes a first epitaxial layer covering a first sidewall of the first nanostructure. The first epitaxial layer has a first concentration of a first dopant. The first epitaxial layer has a round convex profile opposite the first sidewall of the first nanostructure in a cross-sectional view. The first source/drain region further includes a second epitaxial layer covering the round convex profile of the first epitaxial layer in the cross-sectional view. The second epitaxial layer has a second concentration of the first dopant, the second concentration being different from the first concentration.