Abstract: A semiconductor device including a first die and a second die bonded to one another. The first die includes a first passivation layer over a substrate, and first bond pads in the first passivation layer. The second die includes a second passivation layer, which may be bonded to the first passivation layer, and second bond pads in the second passivation layer, which may be bonded to the first bond pads. The second bond pads include inner bond pads and outer bond pads. The outer bond pads may have a greater diameter than the inner bond pads as well as the first bond pads.

Abstract: An electronic device includes a casing, a driven component, a magnetic component and an electromagnetic component. The casing has an outer surface, an inner surface, and an accommodating groove penetrating through the outer surface and the inner surface. The driven component is movably disposed in the accommodating groove. The magnetic component is connected to the driven component. The electromagnetic component is aligned with the magnetic component, and the magnetic component and the electromagnetic component are located at the same side of the inner surface. When the electromagnetic component isn't powered, the magnetic component and the electromagnetic component are attracted to each other, and the driven component is positioned at a first position. When the electromagnetic component is powered, the magnetic component and the electromagnetic component are repulsed to each other so as to drive the driven component to move from the first position to the second position.

Abstract: The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.

Abstract: A laser grooving operation is performed to form a plurality of grooves in a semiconductor die prior to attaching the semiconductor die to a semiconductor device package substrate. In addition to forming a first groove through which blade sawing is to be performed to separate the semiconductor die from other semiconductor dies, a second groove may be formed between the first groove and a seal ring of the semiconductor die. The second groove is configured to contain any potential delamination that might otherwise propagate to an active region of the semiconductor die. Accordingly, the second groove and the associated laser grooving operation described herein may reduce the likelihood of delamination that might otherwise be caused by swelling and/or expansion in a molding compound formed around the semiconductor die after the semiconductor die is attached to the semiconductor device package substrate.

Abstract: A device stand may include a base having a support portion and a connector portion. An upper surface of the connector portion may include at least one coupling mechanism that is configured to engage with a corresponding feature of a keyboard housing to secure the base with the keyboard housing. The device stand may include a first support member coupled with the support portion. The device stand may include a second support member coupled with the support portion and laterally spaced apart from the first support member to form a channel between the first support member and the second support member. The channel may be sized to receive a computing device.

Abstract: Manufacturing of a shoe is enhanced by creating 3-D models of shoe parts. For example, a laser beam may be projected onto a shoe-part surface, such that a projected laser line appears on the shoe part. An image of the projected laser line may be analyzed to determine coordinate information, which may be converted into geometric coordinate values usable to create a 3-D model of the shoe part. Once a 3-D model is known and is converted to a coordinate system recognized by shoe-manufacturing tools, certain manufacturing steps may be automated.

Abstract: An electronic device includes a storage array, a row fan, a distance sensor, and a controller. The storage array includes a plurality of storage units. The row fan cools the storage array. The distance sensor senses the distance between the storage array and the row fan and outputs a corresponding distance signal. The controller receives the distance signal and sets the distance threshold of each of the storage units. When the distance is longer than the distance threshold, the controller outputs a control signal to the row fan to increase the rotation speed of the row fan.

Abstract: An overlay mark includes a first feature extending in an X-direction, wherein the first feature is a first distance from a substrate. The overlay mark further includes a second feature extending in a Y-direction perpendicular to the X-direction, wherein the second feature is a second distance from the substrate, and the second distance is different from the first distance, wherein at least one of the first feature or the second feature comprises a conductive material. The overlay mark further includes a third feature extending in the X-direction and the Y-direction, wherein the third feature is a third distance from the substrate, and the third distance is different from the first distance and the second distance. The first distance, the second distance and the third distance from the substrate are along a Z-direction perpendicular to both the X-direction and the Y-direction.

Abstract: In a method of manufacturing a semiconductor device, underlying structures comprising gate electrodes and source/drain epitaxial layers are formed, one or more layers are formed over the underlying structures, a hard mask layer is formed over the one or more layers, one or more first resist layers are formed over the hard mask layer, a first photo resist pattern is formed over the one or more first resist layers, a width of the first photo resist pattern is adjusted, the one or more first resist layers are patterned by using the first photo resist pattern as an etching mask, thereby forming a first hard mask pattern, and the hard mask layer is patterned by using the first hard mask pattern, thereby forming a second hard mask pattern.

Abstract: The present disclosure describes a structure that joins semiconductor packages and a method for forming the structure. The structure includes an adhesion layer in contact with a first semiconductor package and a first joint pad in contact with the adhesion layer. The structure further includes a film layer disposed on the first semiconductor package and the first joint pad, where the film layer includes a slanted sidewall, the slanted sidewall covers an end portion of the adhesion layer and a first portion of the first joint pad, and the slanted sidewall exposes a second portion of the first joint pad. The structure further includes a solder ball attached to the second portion of the first joint pad and a second joint pad of a second semiconductor package.

Abstract: A method includes forming a first layer on a substrate; forming a first plurality of trenches in the first layer by a patterning process; and forming a second plurality of trenches in the first layer by another patterning process, resulting in combined trench patterns in the first layer. A first trench of the second plurality connects two trenches of the first plurality. The method further includes forming dielectric spacer features on sidewalls of the combined trench patterns. A space between two opposing sidewalls of the first trench is completely filled by the dielectric spacer features and another space between two opposing sidewalls of one of the two trenches is partially filled by the dielectric spacer features.

Abstract: A method for locating critical control points on a part or combination of parts during a manufacturing process involves mating, directly or indirectly, a jig extension to the part or parts. A pattern on the jig extension defines an origin point that is used to track the position of the part or parts during manufacturing, such as during location-sensitive operations. The jig extension may be a shoe last extension which connects to a shoe or shoe component via a shoe last.

Abstract: The present disclosure provides a hybrid powertrain system, comprising: an engine; a motor/generator (“MG”); a clutch coupled to the engine and the MG; a transmission coupled to the MG; an energy storage system connected to the MG; and a controller coupled to the engine, the MG, the clutch, the transmission and the energy storage system. The controller is configured to initiate an engine stop, allow engine torque and MG torque to reduce to zero or near zero, shift the transmission to a neutral gear, cause the MG to operate in a generator mode, thereby loading the engine to recover kinetic energy from the engine, disengage the clutch to decouple the MG from the engine, increase the speed of the MG to a target speed, and shift the transmission into gear in response to the MG reaching the target speed.

Abstract: A device including a first receptacle for receiving a first electronic device, a second receptacle for receiving a second electronic device, a first switching charger for fast charging the first electronic device, and a second switching charger for fast charging the second electronic device. The device may determine that the first electronic device is communicatively coupled to the device within the first receptacle and that the second electronic device is communicatively coupled to the device within the second receptacle. The device may receive a first request from the first electronic device to fast charge the first electronic device via the first switching charger and charge the first electronic device via the first switching charger. Additionally, the device may receive a second request from the second electronic device to fast charge the second electronic device via the second switching charger and charge the second electronic device via the second switching charger.

Abstract: The disclosure provides an electrical apparatus. The electrical apparatus includes a timing controller, a data driver circuit, and a display panel. The timing controller is configured to receive at least one data polarity configuration signal. The timing controller generates and outputs a plurality of polarity inversion signals according to the data polarity configuration signal. The phases of the polarity inversion signals are different. The data driver circuit is coupled to the timing controller. The data driver circuit is configured to receive the polarity inversion signals. The display panel is coupled to the data driver circuit. The display panel is configured to display images. The data driver circuit drives the display panel to display the images according to the polarity inversion signals.

Abstract: A spine connecting rod includes a coupling assembly, a first rod and a second rod. The coupling assembly includes a cylindrical body having first and second coupling parts and a cylindrical elastic part inside the body. The first rod, pivotally connected with the coupling assembly, has a diameter less than any inner diameter of the elastic part and the first coupling part. One end of the first rod is furnished with a ball having a diameter greater than that of the first rod and any inner diameters of the elastic part and the second coupling part. The second rod is connected with the coupling assembly. The first and second rods protrude out of the first and second coupling parts, respectively. The ball of the first rod is rotationally disposed inside the coupling assembly to allow the first rod to undergo elastic movements via the elastic part.

Abstract: Examples of hybrid powertrain systems are provided herein. The system includes: an engine; a motor/generator (“MG”); a clutch coupled to the engine and the MG; a transmission coupled to the MG; an energy storage system connected to the MG; and a controller coupled to the engine, the MG, the clutch, the transmission and the energy storage system. The controller is configured to initiate an engine stop, allow engine torque and MG torque to reduce to zero or near zero, shift the transmission to a neutral gear, cause the MG to operate in a generator mode, thereby loading the engine to recover kinetic energy from the engine, disengage the clutch to decouple the MG from the engine, increase the speed of the MG to a target speed, and shift the transmission into gear in response to the MG reaching the target speed.

Abstract: A display device is provided and includes a display panel, a light source, a light source controller, and a timing controller. The light source is adjacent to the display panel. The light source controller is electrically connected to the light source. The timing controller is electrically connected to the light source controller and the display panel. The timing controller includes a decoding unit and first and second processing units. The first processing unit is electrically connected to the decoding unit and the display panel. The second processing unit is electrically connected to the decoding unit and the light source controller. The decoding unit provides a refresh signal to the first and second processing units so that the display panel refreshes displayed content in a first refresh sequence according to first refresh rates, and the light source refreshes brightness in a second refresh sequence according to second refresh rates.