Abstract: A semiconductor structure includes an isolation feature formed in the semiconductor substrate and a first fin-type active region. The first fin-type active region extends in a first direction. A dummy gate stack is disposed on an end region of the first fin-type active region. The dummy, gate stack may overlie an isolation structure. In an embodiment, any recess such as formed for a source/drain region in the first fin-type active region will be displaced from the isolation region by the distance the dummy gate stack overlaps the first fin-type active region.

Abstract: A tool path for treating a shoe upper may be generated to treat substantially only the surface of the shoe bounded by a bite line. The bite line may be defined to correspond to the junction of the shoe upper and a shoe bottom unit. Bite line data and three-dimensional profile data representing at least a portion of a surface of a shoe upper bounded by a bite line may be utilized in combination to generate a tool path for processing the surface of the upper, such as automated application of adhesive to the surface of a lasted upper bounded by a bite line.

Abstract: A memory device includes a first electrode, a first support layer, a dielectric layer and a second electrode. The first electrode is disposed on a substrate and extending upwards. The first support layer laterally supports an upper portion of a sidewall of the first electrode, where the first support layer has a slim portion. The dielectric layer is disposed on the first electrode and the first support layer. The second electrode is disposed on the dielectric layer. In addition, a method of fabricating the memory device is provided.

Abstract: In a system having a hybrid powertrain having a piston internal combustion engine, and a motor/generator, and the motor generator being coupleable to a clutch and thereby to a gearbox, the engine further being equipped with a valvetrain control system operable to change the engine valve operation between a first mode in which the engine can operate in a conventional internal combustion mode and a second mode in which pumping losses are reduced when the engine is not operating in a conventional internal combustion mode. This allows it to be rotated without generating power, in a hybrid mode, with minimal losses.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. A first conductive feature and a second conductive feature are provided. A first hard mask (HM) is formed on the first conductive feature. A patterned dielectric layer is formed over the first and the second conductive features, with first openings to expose the second conductive features. A first metal plug is formed in the first opening to contact the second conductive features. A second HM is formed on the first metal plugs and another patterned dielectric layer is formed over the substrate, with second openings to expose a subset of the first metal plugs and the first conductive features. A second metal plug is formed in the second openings.

Abstract: A semiconductor structure includes an isolation feature formed in the semiconductor substrate and a first fin-type active region. The first fin-type active region extends in a first direction. A dummy gate stack is disposed on an end region of the first fin-type active region. The dummy gate stack may overlie an isolation structure. In an embodiment, any recess such as formed for a source/drain region in the first fin-type active region will be displaced from the isolation region by the distance the dummy gate stack overlaps the first fin-type active region.

Abstract: A method of manufacturing a semiconductor structure includes depositing a silicon layer over a substrate, removing a portion of the silicon layer to form a gate stack, and performing a hydrogen treatment on the gate stack to repair a plurality of voids in the stack structure.

Abstract: An optical assembly includes a first prism and a second prism. The first prism has a first surface. The first surface includes a first optical region. The second prism has a second surface. The first and the second surface are disposed facing each other. The second surface includes a second optical region, in which on a first reference plane, an orthographic projection of the first optical region overlaps an orthographic projection of the second optical region, and the first reference plane is substantially parallel to the first surface or the second surface. When the optical assembly is at a first temperature, at least one of the first optical region and the second optical region is concave, and a vertical distance between the first and the second optical region gradually decreases from a first center point of the first optical region to a first edge of the first optical region.

Abstract: A three dimensional printing apparatus including a carrying plate, a transparent plate, an elastic film, and a bump is provided. The transparent plate is disposed on the carrying plate. The elastic film is disposed on the transparent plate. The bump is disposed between the elastic film and the carrying plate. An interface between the transparent plate and the elastic film is in communication with an external space through a fluid channel between each bump and the elastic film. An orthographic projection area of the bump on the transparent plate is not more than ¼ of a surface area of the transparent plate.

Abstract: An electronic device includes an array substrate. The array substrate includes first to third gate lines, a first to third pixel units, and a gate driving circuit. The third gate line is disposed between the first and second gate lines. The first pixel unit is electrically connected to the first gate line and the data line. The second pixel unit is electrically connected to the second gate line and the data line. The third pixel unit is electrically connected to the third gate line and the data line. The gate driving circuit is electrically connected to the first to third gate lines. The gate driving circuit provides a first gate driving signal to the first pixel unit, a second gate driving signal to the second pixel unit, and a third gate driving signal to the third pixel unit in a time sequence.

Abstract: A light source driving circuit and a method for driving a light source are provided. The light source driving circuit includes a filter. The filter is configured to receive a pixel signal. The filter selects one filter parameter from multiple filter parameters according to a gray level value of the pixel signal. The filter performs a filter operation on the pixel signal according to the selected filter parameter, so as to output a driving signal to drive a light source module. The filter parameters include a first filter parameter, a second filter parameter, and a third filter parameter. The second filter parameter is obtained by performing an interpolation operation on the first filter parameter and the second filter parameter via the filter.

Abstract: Methods and apparatuses for connecting multiple loads with a common return pin in engine control module application are disclosed. Only one of the multiple loads can be connected to a power source at a time. At the high side, each load is coupled to the power source through a respective pin at a connector. At the low side, the multiple loads share a common return pin at the connector that connects the loads to the ground. When a first load is connected to the power source at the high side, a first low side driver circuit is used to connect the first load to the ground at the low side. When a second load is connected to the power source at the high side, the second low side driver circuit is used to connect the second load to the ground at the low side.

Abstract: In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.

Abstract: Manufacturing and assembly of a shoe or a portion of a shoe is enhanced by automated placement and assembly of shoe parts. For example, a part-recognition system analyzes an image of a shoe part to identify the part and determine a location of the part. Once the part is identified and located, the part can be manipulated by an automated manufacturing tool.

Abstract: An electronic device is provided. The electronic device includes a panel, a backlight module, a first circuit, and a second circuit. The backlight module and the panel are disposed correspondingly. The first circuit includes a system circuit module. The second circuit includes a panel timing controlling module and a backlight timing controlling module. The backlight timing controlling module receives a first signal transmitted from the system circuit module and provides a backlight controlling signal to the backlight module. The panel timing controlling module receives a second signal transmitted from the system circuit module and provides a panel controlling signal to the panel. Another electronic device is also provided, such that the first circuit includes the system circuit module and the backlight timing controlling module.

Abstract: Provided is a rotary optical module, including a drive device, an optical turntable, a balance ring, at least one counterweight device, and multiple protruding structures. The drive device includes a rotary axis, extending along a first direction. The optical turntable and the balance ring are both sleeved on the rotary axis of the drive device, and the balance ring is located between the drive device and the optical turntable. The balance ring includes an outer retaining wall, located at the edge of the balance ring. The at least one counterweight device is disposed on the balance ring and abuts against the inner side of the outer retaining wall. The protruding structures are radially arranged on the balance ring with the rotary axis as the center, and the height of the protruding structures in the first direction is greater than the height of the outer retaining wall in the first direction.

Abstract: A coaxial cable connector assembly includes a coupler defining an inner channel extending through the coupler and an outer conductor engagement feature extending inwardly from the inner channel, a rear body, positioned rearward of the coupler, defining a cable channel extending through the rear body, and structurally configured to receive the coaxial cable, and an adhesive reservoir positioned at least partially within the cable channel of the rear body, the adhesive reservoir including an adhesive and an adhesive reservoir breakable material that encapsulates the adhesive, where the adhesive reservoir breakable material is structurally configured to fracture upon the application of force exceeding a predetermined threshold, thereby releasing the adhesive from the adhesive reservoir to adhesively couple the coaxial cable to the rear body.

Abstract: The present disclosure proposes an electromagnetic susceptibility (EMS) testing method based on computer-vision. The method includes a training stage and a testing stage. During the training stage, the electronic device receives a testing data and the monitor displays a first picture. A camera captures the first picture to generate a template video. The processor generates a plurality of template images at least according to the template video. During the testing stage, an antenna emits an interference signal to the electronic device. The electronic device receives the testing data and the monitor displays a second picture. The camera captures the second picture to generate a testing video. The processor generates a testing image according to the testing video and calculates a difference ratio between the testing image and each template image. The processor sends an alert signal when the difference ratio is greater than a threshold.

Abstract: A device includes a diffraction-based overlay (DBO) mark having an upper-layer pattern disposed over a lower-layer pattern, and having smallest dimension greater than about 5 micrometers. The device further includes a calibration mark having an upper-layer pattern disposed over a lower-layer pattern, positioned substantially at a center of the DBO mark, and having smallest dimension less than about 1/5 the size of the smallest dimension of the DBO mark.

Abstract: Systems and apparatuses include a circuit structured to communicate with a real-time-clock battery and to selectively communicate with a vehicle battery, inhibit communication between the real-time-clock battery and a controller when a first voltage is received from the vehicle battery, and provide a communication from the real-time-clock battery to the controller when the first voltage is not received.