Abstract: The present disclosure provides a medical device (100) for electrical stimulation. The medical device (100) includes electric circuitry configured to perform active charge compensation, said electric circuitry being connectable to at least one electrode arrangement (102) for electrical stimulation. The electric circuitry includes monitoring means configured to monitor at least one voltage associated with a stimulation network (108, 116); at least one variable resistive element configured to provide an voltage drop used in the active charge compensation: and adjustment means configured to dynamically adjust a resistance value of the at least one variable resistive element during the active charge compensation based on the at least one monitored voltage, wherein the adjustment means (202) is a finite state machine for neurostimulation.

Abstract: A support member, a display module and a display device are provided. The support member is configured for supporting a display panel and includes: a first support plate, being a flexible plate, the first support plate includes a first deformable region defined with a plurality of openings; a first adhesive layer, arranged on a side of the first support plate; and a second support plate, bonded to the side of the first support plate through the first adhesive layer, where a rigidity of the second support plate is greater than a rigidity of the first support plate, and the second support plate includes a second deformable region fitted and fixed with the first deformable region and corresponds to the bending region of the display panel.

Abstract: An antenna module includes an antenna box and a first connection wire. The antenna box can include a first antenna, a second antenna, a first connection terminal, a second connection terminal and a housing. The first and second antennas are located in the housing and the housing has a first opening collectively exposing a portion of the first connection terminal and a portion of the second connection terminal. Each of the first and second antennas is adapted to receive or transmit wireless signals according to one of a plurality of wireless communication standards and the first and second antennas are electrically connected to the first and second connection terminals, respectively. The wireless communication standards can be different from each other.

Abstract: A distributed low energy dynamic thermal management system for solid matter prevention and control in oil and gas transportation pipeline includes pipeline data monitoring terminal, current and electric pulse control terminal, land console, electric heating terminal, wiring flange, oil and gas transportation pipeline, valve structure. The system monitors the state of the pipeline in real time by the pipeline data monitoring terminal, and transmits the monitoring data to the current and electric pulse control terminal in real time, the current and electric pulse control terminal produces different thermal responses to the electric heating terminal according to the state in the tube, raises the temperature inside the tube by generating a continuous current, unblocks pipeline by generating high power electric pulse, so as to realize real-time monitoring and local temperature dynamic control of oil and gas transportation pipeline.

Abstract: This application provide a data processing method and apparatus, to store more user data in a limited quantity of storage chips in a design manner of reusing storage space corresponding to a second storage chip. In the method, a computer device first obtains user data, where the user data includes first data and second data. Then, the device writes the first data into a first storage chips, where a is an integer greater than 0. The device writes the second data and first check data into b second storage chips, where the first check data includes check data for the user data, and b is an integer greater than 0. In addition, the device writes second check data into c third storage chips, where the second check data includes check data for both the user data and the first check data, and c is an integer greater than 0.

Abstract: A sensing device includes a driving unit, a magnetic transmission unit, a sensing unit, and an operating unit. The magnetic transmission unit includes a main driving wheel, and first and second driven wheels. The main driving wheel includes a main driving wheel body sleeved co-rotatably to the driving unit, a main feedback portion mounted co-rotatably on the main driving wheel body, and a main magnetic driving portion mounted co-rotatably on the main driving wheel body. The first and second driven wheels respectively include first and driven wheel bodies, first and second feedback portions that are mounted co-rotatably and respectively on the first and second driven wheel bodies, and first and second magnetic driven portions mounted co-rotatably and respectively on the first and second driven wheel bodies, and magnetically driven by the main magnetic driving portion to rotate when the main driving wheel body co-rotates with the driving unit.

Abstract: A distance determination method has: detecting a first received signal strength indicator (RSSI) of a first electronic device by a second electronic device; detecting a second RSSI of the second electronic device by the first electronic device; obtaining the first RSSI from the second electronic device by the first electronic device; and calculating a motion direction and a distance of the second electronic device relative to the first electronic device according to the first RSSI and the second RSSI by the first electronic device.

Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a gate structure over the substrate, a layer of dielectric material over the gate structure, a source/drain (S/D) contact layer formed through and adjacent to the gate structure, and a trench conductor layer over and in contact with the S/D contact layer. The S/D contact layer can include a layer of platinum-group metallic material and a silicide layer formed between the substrate and the layer of platinum-group metallic material. A top width of a top portion of the layer of platinum-group metallic material can be greater than or substantially equal to a bottom width of a bottom portion of the layer of platinum-group metallic material.

Abstract: This disclosure relates to anti-human OX40 (TNF Receptor Superfamily Member 4, or TNFRSF4) antibodies, antigen-binding fragments, and the uses thereof.

Abstract: Systems and methods disclosed herein are related to a memory system. In one aspect, the memory system includes a first set of memory cells including a first string of memory cells and a second string of memory cells; and a first switch including: a first electrode connected to first electrodes of the first string of memory cells and first electrodes of the second string of memory cells, and a second electrode connected to a first global bit line, wherein gate electrodes of the first string of memory cells are connected to a first word line and gate electrodes of the second string of memory cells are connected to a second word line.

Abstract: A semiconductor with 3D flash memory storing cells giving an extended life time includes a stack structure in each storing cell, a receiving space crossing through the stack structure, a blocking layer, at least one floating gate layer, and a channel layer. The stack structure includes at least one control gate layer, at least two dielectric layers, and at least one erasing layer. The receiving space comprises a first receiving portion communicating with several second receiving portions. The first receiving portion crosses through the stack structure and the second receiving portions are coplanar with the control gate layer. The blocking layer insulates the floating gate layer from the control gate layers. The erasing layer and floating gate layer form a passageway for electrons when data erasure is required in the semiconductor. A method for fabricating the semiconductor is also disclosed.

Abstract: Provided is a projection display device for displaying a time period of one frame of stereo image as a first modulation period. The projection display device includes: a light source for emitting illumination light; a spatial light modulator for modulating the illumination light according to a plurality of frames of two-dimensional images corresponding to a stereo image to be displayed, and sequentially emitting, within the first modulation period, image light corresponding to the plurality of frames of the two-dimensional images; an angle deflection apparatus arranged in an emergent optical path of the image light and used for deflecting the image light corresponding to the plurality of frames of two-dimensional images to different angles for emission; and a projection screen for displaying the image light deflected by the angle deflection apparatus.

Abstract: Methods, systems, and devices for wireless communications are described. A transmitter may transmit a payload in transmission to the base station in a wireless communications system. The transmitter may identify a payload to include in the transmission to the base station. The transmitter may determine to transmit the transmission using an orthogonal sequence codebook or a non-orthogonal sequence codebook, based on a size of the payload, a control message from the base station to the transmitter, or a combination of these. The transmitter may then transmit the transmission to the base station based on whether the transmission is to use the orthogonal sequence codebook or the non-orthogonal sequence codebook. The transmission may be a noncoherent transmission. The transmission may be an uplink control information transmission, an uplink data transmission, a downlink control information transmission, or a downlink data transmission.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.

Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.

Abstract: A method and apparatus for block partition are disclosed. If a cross-colour component prediction mode is allowed, the luma block and the chroma block are partitioned into one or more luma leaf blocks and chroma leaf blocks. If a cross-colour component prediction mode is allowed, whether to enable an LM (Linear Model) mode for a target chroma leaf block is determined based on a first split type applied to an ancestor chroma node of the target chroma leaf block and a second split type applied to a corresponding ancestor luma node. According to another method, after the luma block and the chroma block are partitioned using different partition tress, determine whether one or more exception conditions to allow an LM for a target chroma leaf block are satisfied when the chroma partition tree uses a different split type, a different partition direction, or both from the luma partition tree.

Abstract: A probe head includes a probe seat, and vertical probes each having a head portion including a head portion installation section with a first width, and a probe tip section including a probe tip contact part with a second width smaller than the first width and a probe tip gradually narrowing part which is located between the head portion installation section and the probe tip contact part, gradually narrows from the first width to the second width, and has a first length smaller than a second length of the probe tip contact part. The head portion installation section protrudes out of a lower surface of the probe seat for a length smaller than the sum of the first and second lengths. The vertical probe is great in current withstanding capability, structural strength and life time, and meets the requirement of probing tiny electrically conductive contacts.

Abstract: A door leaf combinable to form a side-hung door or a sliding door, which includes a frame (1) and a panel (2) disposed in the frame (1). The frame (1) is formed by combining a plurality of universal profiles (3) including a vertically-disposed universal profile and a horizontally-disposed universal profile.

Abstract: An optical lens assembly includes: a first element group including: a first lens group with positive refractive power, including one or two lenses; a second element group including: a second lens group with positive refractive power, including two or three lenses; an optical element including, in order from a visual side to an image source side: an absorptive polarizer, a reflective polarizer and a first phase retarder; and a partial-reflective-partial-transmissive element; and a third element group including an image source plane. The first element group, the second element group and the third element group are arranged in order from the visual side to the image source side. When the optical lens assembly satisfies a specific condition, the weight of the device can be reduced, the zoom function can be provided, and the image quality can be ensured.