Abstract: A modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration and hydrogenation of dicyclopentadiene phenolic resin.

Abstract: A lithium battery includes a positive electrode plate, a negative electrode plate, an electrolyte disposed between the positive electrode plate and the negative electrode plate, a separator disposed in the electrolyte, and an organic-inorganic composite film disposed on the surface of the positive electrode plate, the surface of the negative electrode plate, the surface of the separator, or a combination thereof. The organic-inorganic composite film includes 100 parts by weight of clay, 3 to 35 parts by weight of lignocellulose, and 25 to 270 parts by weight of a first binder.

Abstract: A composite film includes a first thermoplastic elastomer film layer and a second thermoplastic elastomer film layer, wherein the first thermoplastic elastomer film layer includes a first styrenic block copolymer. The second thermoplastic elastomer film layer is disposed on the first thermoplastic elastomer film layer, wherein the second thermoplastic elastomer film layer includes a second styrenic block copolymer, diffusion particles dispersed in the second thermoplastic elastomer film layer, and a surface microstructure disposed on the surface of the second thermoplastic elastomer film layer.

Abstract: The disclosure discloses a penetrating cushion damping device comprising a penetrator, and belongs to the field of in-situ penetrating exploration of extraterrestrial celestial bodies. A magnetic conductor encloses the non-penetrating end of the penetrator, a drag plate connected to the penetrator is provided at the lower end face of the magnetic conductor, and a magnetic source structure for generating magnetic force on the magnetic conductor is provided in the non-penetrating end of the penetrator. The disclosure utilizes the penetrating cushion anti-drag mode with the drag plate and the electromagnetic structure, which is self-adaptive to the flight penetration speed and compact in structure, reduces the jump probability, and further reduces the cushion resistance after the speed is reduced.

Abstract: A vehicle-mounted security inspection system includes a mobile chassis. A first cabin provided on the mobile chassis includes an object security inspection apparatus, which is used to perform a security inspection on an object. A second cabin provided on the mobile chassis includes a human body security inspection apparatus which is used to perform a security inspection on a human body. The second cabin is flexibly connected to the first cabin, so that in a first state, the second cabin is located at one end of the first cabin in a longitudinal direction of the mobile chassis, and in a second state, the second cabin is located on one side of the first cabin in the longitudinal direction of the mobile chassis.

Abstract: An imaging lens assembly module includes an imaging lens assembly and a variable aperture module. The imaging lens assembly has an optical axis. The variable aperture module includes a light blocking sheet set, a fixed element, a movable element, and an annular light blocking portion. The light blocking sheet set includes at least two light blocking sheets, wherein the at least two light blocking sheets are mutually stacked along a circumferential direction surrounding the optical axis to form a variable aperture opening. The fixed element has a sidewall structure. The annular light blocking portion surrounds the optical axis to form a fixed aperture opening.

Abstract: The present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound and the light transmittance of the marking material is less than 50%, which is suitable for forming the mark on the semiconductor device by laser sintering, and the marking material is sintered to make the resin cross-link and cure to form a cured product. In addition, in one embodiment, the cured product formed by the marking material can be used as a deflector to guide the flow of the underfill and control the flow rate of underfill, so as to effectively solve the problem of uneven flow rate of the underfill.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A method of local implicit normalizing flow for arbitrary-scale image super-resolution, an associated apparatus and an associated computer-readable medium are provided. The method applicable to a processing circuit may include: utilizing the processing circuit to run a local implicit normalizing flow framework to start performing arbitrary-scale image super-resolution with a trained model of the local implicit normalizing flow framework according to at least one input image, for generating at least one output image, where a selected scale of the output image with respect to the input image is an arbitrary-scale; and during performing the arbitrary-scale image super-resolution with the trained model, performing prediction processing to obtain multiple super-resolution predictions for different locations of a predetermined space in a situation where a same non-super-resolution input image among the at least one input image is given, in order to generate the at least one output image.

Abstract: A method includes forming a conductive feature through a first dielectric layer, sequentially forming a second dielectric layer and a third dielectric layer over the first dielectric layer, and etching the third dielectric layer to form an opening. A first width of the opening at a top surface of the third dielectric layer is greater than a second width of the opening at a first interface between the third dielectric layer and the second dielectric layer. The method also includes etching the second dielectric layer until the opening extends to the conductive feature, thereby forming an enlarged opening, and forming a metal material in the enlarged opening. A third width of the enlarged opening at the first interface is equal to or less than a fourth width of the enlarged opening at a second interface between the second dielectric layer and the first dielectric layer.

Abstract: An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, and a nonconductive support element. The first radiation element is coupled to a first grounding point on the ground element. The second radiation element has a feeding point. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the second radiation element. The first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The second radiation element is at least partially surrounded by the first radiation element. The third radiation element is at least partially surrounded by the second radiation element.

Abstract: The disclosure includes compounds of Formula (A): wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, and R12, j, k, m, n, Y, W, W1, W2, W3, V, L, Z1, Q1, Q2, Q3, and Q4, are defined herein. Also disclosed is a method for treating a neoplastic disease, an autoimmune disease, or a neorodegenerative disease with these compounds.

Abstract: A method of reconstruction of super-resolution of video frame includes inputting a first video frame with a first resolution and a plurality of consecutive frames thereof into a pre-trained super-resolution reconstruction network, and outputting, by the pre-trained super-resolution reconstruction network, a second video frame with a second resolution corresponding to the first video frame. The second resolution is higher than the first resolution. The super-resolution reconstruction network includes a feature extraction subnetwork, a spatial-temporal non-local alignment subnetwork, an attention progressive fusion subnetwork, and an up-sampling subnetwork which are connected in sequence.

Abstract: Aspects described herein relate to encoding uplink communications based on a coding table including determining to avoid certain portions of a coding table that may result decoding errors, or using a modified coding table, to improve decoding results. In one aspect, a network can transmit, to a device, a configuration indicating whether to use a modified coding table for encoding uplink communications.

Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An etch stop layer is formed on the sacrificial substrate. A portion of the etch stop layer is oxidized to form an oxide layer between the sacrificial substrate and the remaining etch stop layer. A capping layer is formed on the remaining etch stop layer. A device layer is formed on the capping layer. A first etching process is performed to remove the sacrificial substrate. A second etching process is performed to remove the oxide layer. A third etching process is performed to remove the remaining etch stop layer. A power rail is formed on the capping layer opposite to the device layer.

Abstract: An optical film, an optical film set, a backlight module and a display device are provided. The optical film includes a main body, plural first prism structures and plural second prism structures. The main body has a first optical surface and a second optical surface. The first prism structures are disposed on the first optical surface. Each of the first prism structures extends along a first direction. The second prism structures are disposed on the second optical surface. Each of the second prism structures extends along a second direction. The first direction is different from the second direction.

Abstract: A display panel includes: a display substrate, a first barrier wall surrounding a display area, a blocking portion between the first barrier wall and the display area, a first encapsulation layer covering at least the display area, and touch wires. The blocking portion at least partially surrounds the display area. The first encapsulation layer includes a first surface, a second surface and a transition surface connecting the surfaces. On the display substrate, orthographic projections of the touch wires at least partially overlap with an orthographic projection on of the second surface, and are staggered with an orthographic projection of the transition surface; and at least a portion of the orthographic projection of the transition surface is located in a region between a border, away from the display area, of an orthographic projection of the blocking portion and an orthographic projection of a touch wire farthest away from the display area.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

Abstract: The present invention relates to compounds of e.g. formula (I) as BCL-2 inhibitors for the treatment of neoplastic, autoimmune or neurodegenerative diseases. Preferred compounds are e.g. fused 1H-pyrrolo[2,3-b]pyridine derivatives of e.g.