Abstract: A personal watercraft is disclosed, having a straddle-type seat disposed on a deck. The seat has a seat profile. A storage compartment is disposed rearwardly of the seat. A rear platform is pivotally connected to a rear portion of the watercraft. The rear portion has a raised portion protruding therefrom. The raised portion of the rear portion forms at least in part the storage compartment. The rear platform permits access to the storage compartment when in a raised position, and sealingly closes the storage compartment when in a lowered position. A highest point of the rear platform is disposed lower than the seat profile when the rear platform is in the lowered position.

Abstract: A personal watercraft is disclosed, having a straddle-type seat disposed on a deck. The seat has a seat profile. A storage compartment is disposed rearwardly of the seat. A rear platform is pivotally connected to a rear portion of the watercraft. The rear platform is pivotable between a raised position and a lowered position. The rear platform permits access to the storage compartment when in the raised position, and sealingly closes the storage compartment when in the lowered position. The rear platform is lower than the seat profile when the rear platform is in the lowered position. A personal watercraft having left and right storage compartments and a rear channel defined therebetween, in which the rear platform extends laterally above the rear channel when in the lowered position is also disclosed. A personal watercraft with a rear platform having heel rests with angled portions is also disclosed.

Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.

Abstract: A personal watercraft is disclosed having a hull and a sub-deck disposed on the hull. The hull and sub-deck together form a hull and sub-deck (HSD) assembly. An engine is disposed in the HSD assembly. A propulsion system is connected to the hull and operatively connected to the engine. A deck is disposed above the sub-deck. The deck has a pedestal. A straddle-type seat is disposed on the pedestal. A helm assembly is operatively connected to the propulsion system and disposed at least in part forwardly of the straddle-type seat. A deflector is disposed on the HSD assembly and extends outwardly therefrom. The deflector is disposed at least in part forwardly of a forward-most portion of the deck. A personal watercraft having only a hull and a deck is also disclosed.

Abstract: A method for efficiently producing a plurality of EAS or RFID tags or inlays that form a label ready for use. The process utilizes a first web of RFID chip straps or capacitor straps that are releasably secured to a liner using only a low tack adhesive and utilizes a second web of coils or antennas which are secured to a second liner. After indexing these two webs, selective heat and pressure are applied to the chips straps or to the capacitor straps to transfer them and electrically couple them to a corresponding coil or antenna. Where both chip straps and capacitor straps are applied to a common antenna, a third web of the additional strap is used in the process.

Abstract: The present invention relates to methods of assembly, labeling and programming decoupled EM tags used in the tagging and tracking of items wherein the tags including a printable label portion and a decoupler portion which are combined after printing on the surface of and programming a programmable device associated with the label portion.

Abstract: A capacitor strap that is applied to a security tag coil or antenna to form and properly tune an EAS or an RFID security tag. The capacitor strap is a thin film capacitor formed of two metal foils in between which is a dielectric material having ends that are electrically coupled to different points of a security tag coil or antenna. The capacitor strap may include an RFID integrated circuit, either in series or in parallel with the capacitor, which is then applied to security tag coil at a particular location to tune the tag to a predetermined frequency.

Abstract: A method for efficiently producing a plurality of EAS or RFID tags or inlays that form a label ready for use. The process utilizes a first web of RFID chip straps or capacitor straps that are releasably secured to a liner using only a low tack adhesive and utilizes a second web of coils or antennas which are secured to a second liner. After indexing these two webs, selective heat and pressure are applied to the chips straps or to the capacitor straps to transfer them and electrically couple them to a corresponding coil or antenna. Where both chip straps and capacitor straps are applied to a common antenna, a third web of the additional strap is used in the process.

Abstract: A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.

Abstract: A blister pack having at least one security tag formed from the metal layer of the blister pack. In one embodiment, the security tag is a detached portion of the metal layer that is entrenched in a corresponding channel in the plastic layer of the blister pack and which is then completed by electrically coupling a capacitor strap or chip strap to a gapped portion of the entrenched aluminum layer. Another embodiment also forms the security tag from the metal layer but the coil or antenna of the security tag is formed as part of the process of sealing the metal layer to the plastic layer. A capacitor strap or chip strap is then electrically coupled to a gapped portion of the coil or antenna.

Abstract: A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.

Abstract: A communication-ready corrugated article and method for making the corrugated article is disclosed. The corrugated article includes a linersheet (e.g., craft paper), an undulating medium (e.g., craft paper), a conductive strip (e.g., metal, aluminum, wire, coil), and a security chip (e.g., RFID chip, EAS chip, integrated circuit, chip strap, RFID tag, EAS tag). The linersheet has a first side and a second side. The undulating medium is coupled to the first side of the linersheet, the conductive strip is positioned on the first side of the linersheet between the linersheet and the undulating medium. The security chip is attached to the second side of the linersheet opposite the conductive strip and is coupled to the conductive strip through the linersheet.

Abstract: A personal watercraft is disclosed having a hull and a sub-deck disposed on the hull. The hull and sub-deck together form a hull and sub-deck (HSD) assembly. An engine is disposed in the HSD assembly. A propulsion system is connected to the hull and operatively connected to the engine. A deck is disposed above the sub-deck. The deck has a pedestal. A straddle-type seat is disposed on the pedestal. A helm assembly is operatively connected to the propulsion system and disposed at least in part forwardly of the straddle-type seat. A deflector is disposed on the HSD assembly and extends outwardly therefrom. The deflector is disposed at least in part forwardly of a forward-most portion of the deck. A personal watercraft having only a hull and a deck is also disclosed.

Abstract: A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.

Abstract: A releasable security tag for attachment to an article of merchandise includes: a locking mechanism with a release for attaching the tag to the article of merchandise; an EAS resonant circuit or an RFID circuit for responding to a first RF signal at a predetermined frequency corresponding to the resonant circuit or to the RFID circuit; an ambient RF energy harvesting circuit; a release signal detection circuit coupled to and powered by the ambient RF energy harvesting circuit and an electro-mechanical actuator electrically coupled to the release signal detection circuit. The electro-mechanical actuator releases the locking mechanism whenever the release signal detection circuit receives a release signal.

Abstract: A personal watercraft is disclosed, having a straddle-type seat disposed on a deck. The seat has a seat profile. A storage compartment is disposed rearwardly of the seat. A rear platform is pivotally connected to a rear portion of the watercraft. The rear platform is pivotable between a raised position and a lowered position. The rear platform permits access to the storage compartment when in the raised position, and sealingly closes the storage compartment when in the lowered position. The rear platform is lower than the seat profile when the rear platform is in the lowered position. A personal watercraft having left and right storage compartments and a rear channel defined therebetween, in which the rear platform extends laterally above the rear channel when in the lowered position is also disclosed. A personal watercraft with a rear platform having heel rests with angled portions is also disclosed.

Abstract: A method of making UHF antennas for security tag and antennas thereby. A web of electrically conductive material having a thickness in the range of approximately 5 to approximately 50 microns is releasably secured to a carrier web using a releasably securable adhesive substantially coextensive with the conductive web. A series of antennas of a desired shape are die-cut into the conductive web, but not into the carrier web. The portion of the conductive web not making up the antennas is in the form of scrap and is removed, thereby leaving the series of antennas releasably secured to the carrier sheet. The antennas are arranged to be removed from the carrier sheet, whereupon the releasably securable adhesive is transferred to them, so that they may be subsequently secured to other components to form a security tag.