Patents by Inventor Andre Schaefer

Andre Schaefer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964323
    Abstract: A three-plate pressure die casting mold for producing at least one metallic die casting part by die casting a metal melt, includes first, second and third mold parts and at least one mold cavity as well as a sprue system. In the third mold part there is at least one spring-loaded pressure element which, when opening the die casting mold, presses the sprue produced in the sprue system against the first mold part, whereby the sprue is retained and tears off from the die casting part in a defined manner. A method for pressure die casting using the three-plate pressure die casting mold is disclosed.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 23, 2024
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Olaf Hentschel, Andre Schaefer, Manfred Tremmel
  • Publication number: 20240129374
    Abstract: In a scenario involving a primary and secondary server, resource requests can be managed to avoid sending multiple requests to the secondary server. In particular, requests for data object attributes can be queued when another request has already been made. Hashkey and locking mechanisms can be used to support scenarios involving multiple users and multiple data object instances. Performance of the overall system landscape can thus be improved by effectively consolidating resource requests.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 18, 2024
    Applicant: SAP SE
    Inventors: Andre Klahre, Michael Hettich, Nitish Kumar, Christine Schaefer
  • Publication number: 20240092430
    Abstract: A rear structure for a motor vehicle includes two longitudinal members, a front cross member and a rear cross member. The front cross member and the rear cross member connect the longitudinal members to one another. The rear structure is a single-piece die-cast component. A motor vehicle includes such a rear structure.
    Type: Application
    Filed: March 15, 2022
    Publication date: March 21, 2024
    Inventors: Manuel ANASENZL, Moritz FRENZEL, Christian HASLAUER, Daniel HEIM, Maximilian JUENGLING, Manuel RIEDL, Andre SCHAEFER, Marcel STERZENBACH
  • Publication number: 20230330746
    Abstract: A three-plate pressure die casting mold for producing at least one metallic die casting part by die casting a metal melt, includes first, second and third mold parts and at least one mold cavity as well as a sprue system. In the third mold part there is at least one spring-loaded pressure element which, when opening the die casting mold, presses the sprue produced in the sprue system against the first mold part, whereby the sprue is retained and tears off from the die casting part in a defined manner. A method for pressure die casting using the three-plate pressure die casting mold is disclosed.
    Type: Application
    Filed: August 23, 2021
    Publication date: October 19, 2023
    Inventors: Olaf HENTSCHEL, Andre SCHAEFER, Manfred TREMMEL
  • Publication number: 20230330745
    Abstract: A three-plate pressure die casting mold for producing at least one metallic die casting part by die casting a metal melt, includes first, second and third mold parts and at least one mold cavity as well as a sprue system. A relatively movable pressure plate is arranged in the third mold part, which, when opening the die casting mold, presses the sprue produced in the sprue system against the first mold part, whereby the sprue is retained and tears off from the die casting part in a defined manner. A method for pressure die casting using the three-plate pressure die casting mold is disclosed.
    Type: Application
    Filed: August 26, 2021
    Publication date: October 19, 2023
    Inventors: Olaf HENTSCHEL, Andre SCHAEFER, Manfred TREMMEL
  • Publication number: 20230111366
    Abstract: A three-plate die casting mold for producing a metal die-cast part by die casting a molten metal includes a first, second, and third mold part, where the third mold part is disposed between the first and second mold parts. Molten metal is feedable to a die cavity through a sprue system where the sprue system has a plurality of feed channels that are disposed in the third mold part and open into the die cavity. The plurality of feed channels have a respective tapering at a die cavity-side end where the respective tapering locally decreases a channel cross section such that a predetermined breaking point is generated during a die casting operation which allows a defined separation of the metal die-cast part from a sprue created in the sprue system when the three-plate die casting mold is being opened.
    Type: Application
    Filed: February 22, 2021
    Publication date: April 13, 2023
    Inventors: Fritz HIRNING, Andre SCHAEFER, Jean-Marc SEGAUD, Klaus-Peter TUCAN
  • Publication number: 20220340752
    Abstract: Described herein is a thermoplastic molding composition, including A) from 10 to 60% by weight of a thermoplastic semicrystalline polyamide-6, B) from 5 to 50% by weight of a thermoplastic semiaromatic semicrystalline polyamide containing repeating units of hexamethylenediamine and terephthalic acid, C) from 10 to 65% by weight of fibrous and/or particulate fillers, and D) from 0 to 30% by weight of further additives, where the total of the percentages by weight of components A) to D) is 100%.
    Type: Application
    Filed: June 23, 2020
    Publication date: October 27, 2022
    Inventors: Jens Cremer, Andre Schaefer, Tsung-Chie Cheng, Boris Weber
  • Patent number: 10853216
    Abstract: A mechanism is described for facilitating write tracking for following data eye movements across changing thermal conditions in memory systems according to one embodiment of the invention. A method of embodiments of the invention includes monitoring movements of a valid data eye associated with a memory device of a plurality of memory devices of a memory system at a computing system. The monitoring may include initiating write commands during one or more refresh periods associated with the valid data eye. The method may include determining drifting in the movement of the data eye, and correcting the drifting based on adjusting one or more existing phase interpolator values associated with the movements of the data eye.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: December 1, 2020
    Assignee: Intel Corporation
    Inventors: Tsun Ho Liu, Andre Schaefer, Hoi M. Ng, Guy R. Murray, Oleg Mikulchenko, Xiaofang Gao
  • Patent number: 10851516
    Abstract: A manhole cover for manholes, sewer accesses or drainage channels, including a reinforcing element and a body made of plastic which is connected to the reinforcing element. The reinforcing element may be constructed from intersecting, vertically aligned elements. Corrugations may be formed in the reinforcing element. The reinforcing elements may be arched and may include an outer encircling strip and a central plate, which are each connected to the body made of plastic. The reinforcing element rests on a bearing surface on the manhole, sewer access or drainage channel when the manhole, sewer access or drainage channel is closed by means of the manhole cover. The body made of plastic includes ribs, which extend perpendicularly or at an angle of more than 45° to the surface surrounding the manhole cover, sewer access or drainage channel when the manhole, sewer or drainage channel is closed.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: December 1, 2020
    Inventors: Torsten Hensel, Patrick Frey, Helge Weiler-Schlecker, Andreas Wuest, Kay Michael Brockmueller, Milan Kopecek, Andre Schaefer, Joaquin Perez
  • Patent number: 10760688
    Abstract: Rotary joints are disclosed, such as for supplying fluid to a pressure chamber that is disposed between a rotatable component and a stationary component. The rotary joint may include a seal carrier having at least one channel for a fluid connection to the pressure chamber. At least two axially spaced apart sealing rings may be disposed on the seal carrier for a static sealing of the at least one channel. At least one sealing element may be non-rotatably disposed on the seal carrier and configured to form an axial and a radial seal of the pressure chamber. The at least one sealing element may be configured to bear on a ring element that is non-rotatably connected to the rotatable component when pressure is built up in the pressure chamber and the at least one sealing element may have means for reducing the axial pressure exerted on the ring element.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: September 1, 2020
    Assignees: Schaeffler Technologies AG & Co. KG, GAPI Technische Produkte GmbH
    Inventors: Robert Heuberger, Horst Brehm, Sebastian Niederle, Marc-André Schäfer, Andre Hofmann, Andreas Flint
  • Patent number: 10655680
    Abstract: A sealing arrangement for a wheel bearing having a first component against a second component which is rotatable relative thereto, the sealing arrangement having a first seal arranged on the first component and a second seal arranged on the second component, the first seal has at least one opening for the passage of air at least in a sealing chamber formed spatially between the two seals, and a fabric element is provided to at least partially expand upon contact with water and thereby to seal the at least one opening.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: May 19, 2020
    Inventors: Simon Brähler, Andreas Kaiser, Alexander Häpp, Marc-André Schäfer
  • Patent number: 10554212
    Abstract: Circuitry for voltage-to-current conversion, and in particular to differential voltage-to-current conversion circuitry. Such circuitry is operable to receive a differential voltage input signal and output a corresponding differential current signal. First and second controllable current sinks are connected to first and second load nodes of the circuitry so as to draw corresponding sink currents from those nodes.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: February 4, 2020
    Assignee: SOCIONEXT INC.
    Inventors: Frank Werner, Uwe Zillmann, Guido Dröge, André Schäfer
  • Publication number: 20190345982
    Abstract: A sealing arrangement for a wheel bearing having a first component against a second component which is rotatable relative thereto, the sealing arrangement having a first seal arranged on the first component and a second seal arranged on the second component, the first seal has at least one opening for the passage of air at least in a sealing chamber formed spatially between the two seals, and a fabric element is provided to at least partially expand upon contact with water and thereby to seal the at least one opening
    Type: Application
    Filed: August 24, 2017
    Publication date: November 14, 2019
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Simon Brähler, Andreas Kaiser, Alexander Häpp, Marc-André Schäfer
  • Publication number: 20190323199
    Abstract: A manhole cover for manholes, sewer accesses or drainage channels, including a reinforcing element and a body made of plastic which is connected to the reinforcing element. The reinforcing element may be constructed from intersecting, vertically aligned elements. Corrugations may be formed in the reinforcing element. The reinforcing elements may be arched and may include an outer encircling strip and a central plate, which are each connected to the body made of plastic. The reinforcing element rests on a bearing surface on the manhole, sewer access or drainage channel when the manhole, sewer access or drainage channel is closed by means of the manhole cover. The body made of plastic includes ribs, which extend perpendicularly or at an angle of more than 45° to the surface surrounding the manhole cover, sewer access or drainage channel when the manhole, sewer or drainage channel is closed.
    Type: Application
    Filed: June 19, 2017
    Publication date: October 24, 2019
    Inventors: Torsten Hensel, Patrick Frey, Helge Weiler-Schlecker, Andreas Wuest, Kay Michael Brockmueller, Milan Kopecek, Andre Schaefer, Joaquin Perez
  • Publication number: 20190304953
    Abstract: A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.
    Type: Application
    Filed: May 28, 2019
    Publication date: October 3, 2019
    Inventors: Pete D. VOGT, Andre SCHAEFER, Warren MORROW, John B. HALBERT, Jin KIM, Kenneth D. SHOEMAKER
  • Publication number: 20190229738
    Abstract: The present invention relates to circuitry for voltage-to-current conversion, and in particular to differential voltage-to-current conversion circuitry. Such circuitry is operable to receive a differential voltage input signal and output a corresponding differential current signal.
    Type: Application
    Filed: January 9, 2019
    Publication date: July 25, 2019
    Inventors: Frank Werner, Uwe Zillmann, Guido Dröge, André Schäfer
  • Patent number: 10079489
    Abstract: An apparatus such as heterogeneous device includes at least a first die and a second die. The apparatus further includes a first inductive element, a second inductive element, and switch control circuitry. The switch control circuitry is disposed in the first die. The switch control circuitry controls current through the first inductive element to produce a first voltage. The first voltage powers the first die. The second inductive element is coupled to the first inductive element. The second inductive element produces a second voltage to power the second die. The first die and second die can be fabricated in accordance with different technologies and in which the first die and second die withstand different maximum voltages. A magnitude of the first voltage can be greater than a magnitude of the second voltage.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: September 18, 2018
    Assignee: Intel Corporation
    Inventors: Guido Droege, Andre Schaefer, Uwe Zillmann
  • Publication number: 20180195619
    Abstract: Rotary joints are disclosed, such as for supplying liquid to a pressure chamber that is disposed between a rotatable component and a stationary component. The rotary joint may include a seal carrier having at least one channel for a fluid connection to the pressure chamber. At least two axially spaced apart sealing rings may be disposed on the seal carrier for a static sealing of the at least one channel. At least one sealing element may be non-rotatably disposed on the seal carrier and configured to form an axial and a radial seal of the pressure chamber. The at least one sealing element may be configured to bear on a ring element that is non-rotatably connected to the rotatable component when pressure is built up in the pressure chamber and the at least one sealing element may have means for reducing the axial pressure exerted on the ring element.
    Type: Application
    Filed: July 1, 2016
    Publication date: July 12, 2018
    Applicants: Schaeffler Technologies AG & Co. KG, GAPI Technische Produkte GmbH
    Inventors: Robert Heuberger, Horst Brehm, Sebastian Niederle, Marc-André Schäfer, Andre Hofmann, Andreas Flint
  • Publication number: 20180122779
    Abstract: A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.
    Type: Application
    Filed: September 8, 2017
    Publication date: May 3, 2018
    Inventors: Pete D. VOGT, Andre SCHAEFER, Warren MORROW, John B. HALBERT, Jin KIM, Kenneth D. SHOEMAKER
  • Patent number: 9921640
    Abstract: Magnetically enhanced inductors integrated with microelectronic devices at chip-level. In embodiments, magnetically enhanced inductors include a through substrate vias (TSVs) with fill metal to carry an electrical current proximate to a magnetic layer disposed on a substrate through which the TSV passes. In certain magnetically enhanced inductor embodiments, a TSV fill metal is disposed within a magnetic material lining the TSV. In certain magnetically enhanced inductor embodiments, a magnetically enhanced inductor includes a plurality of interconnected TSVs disposed proximate to a magnetic material layer on a side of a substrate. In embodiments, voltage regulation circuitry disposed on a first side of a substrate is integrated with one or more magnetically enhanced inductors utilizing a TSV passing through the substrate.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: March 20, 2018
    Assignee: Intel Corporation
    Inventors: Uwe Zillmann, Andre Schaefer, Ruchir Saraswat, Telesphor Kamgaing, Paul B. Fischer, Guido Droege