Abstract: An irradiation unit is disclosed that includes a pump radiation source for emitting pump radiation in the form of a beam, a conversion element for at least partially converting the pump radiation into conversion radiation, and a support on which the conversion element is situated. The support accommodates a through-hole through which the beam including the pump radiation is incident on an incident surface of the conversion element, the though-hole being laterally delimited by an inner wall face of the support, at least one portion of the face tapering in the direction of the incident surface. During operation, the pump radiation conducted in the beam is at least intermittently at least in part, incident on the inner wall face of the support and is reflected thereby onto the incident surface.

Abstract: An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.

Abstract: A display device and a method for producing a display device are disclosed. In an embodiment a display device includes a flat textile support and a plurality of optoelectronic semiconductor components disposed on the support. Each semiconductor component includes a connection substrate comprising a plurality of electrical connections, the plurality of electrical connections electrically connected via electrically conductive contact threads, wherein each electrical connection is realized by a contact hole which completely penetrates through the semiconductor component and, viewed in a plan view, is surrounded all around by the connection substrate and wherein, in each case, at least one contact thread runs through the contact hole so that the contact thread is arranged in part on an upper side of the semiconductor component facing away from the support, a plurality of semiconductor chips for generating light and at least one control unit for adjusting a color location of the light.

Abstract: A filament structure, a lighting device with filament structures, a method for manufacturing a lighting device and a method for manufacturing a filament structure are disclosed.

Abstract: An optoelectronic semiconductor chip, a method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence having an emission side, the emission side comprising a plurality of emission fields, partition walls on the emission side in a region between two adjacent emission fields and a conversion element on one or more emission fields, wherein the conversion element includes a matrix material with first phosphor particles incorporated therein, wherein the first phosphor particles are sedimented in the matrix material such that a mass fraction of the first phosphor particles is greater in a lower region of the conversion element facing the semiconductor layer sequence than in a remaining region of the conversion element, and wherein the partition walls are attached to the emission side without any additional connectors.

Abstract: A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein the lead frame has two connection parts for external electrical contacting of the device; the moulded body is formed to the lead frame; the moulded body is transmissive to the radiation generated during operation of the device; and the semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device. Furthermore, a method for producing devices is specified.

Abstract: In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6).

Abstract: The present invention relates to a lighting means comprising at least two LEDs, mounted on opposite sides of a flat printed circuit board, said printed circuit board being combined with a reflector which is free of LEDs, a part of the light emitted by each LED being reflected by the reflector to homogenize the light distribution generated by the lighting means, and specifically in each case with a directional component parallel to a surface direction of the flat printed circuit board.

Abstract: The present disclosure relates to a luminous means having a cap and an outer bulb in which LEDs are arranged on a flat multilayer substrate which is constructed, at least in regions, from at least two substrate layers between two outside surfaces which are opposite one another, wherein the at least two substrate layers are formed from a flat substrate sheet which is laid back on itself, and wherein the LEDs are mounted on a side surface of the substrate sheet, which at least proportionally forms the two outside surfaces of the multilayer substrate in each case on account of the substrate sheet being laid back, in such a manner that at least one of the LEDs is mounted in each case on both of the two outside surfaces of the multilayer substrate.

Abstract: A filament structure, a lighting device with filament structures, a method for manufacturing a lighting device and a method for manufacturing a filament structure are disclosed.

Abstract: A light fixture comprises two cooling elements and a plurality of semiconductor lighting elements, wherein each cooling element has a central portion and a wall portion which extends away from the central portion and at least partially surrounds an interior of a cooling element. The two cooling elements are arranged opposite one another. An annular opening for exchange of air with the environment is present between the two cooling elements. The semiconductor lighting elements are arranged on the outside of the wall portion of the cooling elements. A corresponding cooling element has two or more vanes, wherein all vanes are connected to one another by means of a central connecting element. Each vane extends in an axial direction and in a circumferential direction and has a curvature in the axial direction and preferably a curvature in the circumferential direction.

Abstract: The present invention relates to a lighting means comprising at least two LEDs mounted on opposite sides of a flat printed circuit board, said printed circuit board being combined with a reflector which is free of LEDs, a part of the light emitted by each LED being reflected by the reflector to homogenize the light distribution generated by the lighting means, and specifically in each case with a directional component parallel to a surface direction of the flat printed circuit board.

Abstract: A luminous means is disclosed, the luminous means having LEDs on a substrate, an outer bulb in which the substrate having the LEDs is arranged, and a cap, wherein at least two partial surfaces of the substrate are folded out with respect to the remaining substrate around a bridge area in each case, via which the particular partial surface is connected to the remaining substrate, and are thus set obliquely with respect to the remaining substrate which is flat per se, wherein, for each side surface of the remaining substrate, which side surfaces are opposite one another with respect to a thickness direction of the remaining substrate, at least one partial surface is folded out in each case, and wherein at least one of the LEDs is arranged on each of the partial surfaces.

Abstract: The present invention relates to a luminous means comprising an enveloping bulb, a base, a first LED and a second LED, which are assembled on a planar printed circuit board, to be precise on the opposite side thereof in relation to a thickness direction, wherein a first diverging lens is mounted on the first side of the printed circuit board in a manner assigned to the first LED and a second diverging lens is mounted on the second side of the printed circuit board in a manner assigned to the second LED for the purposes of homogenizing the light distribution generated by the luminous means, and the light emitted by the respective LED has a widened luminous intensity distribution downstream of the respective diverging lens in comparison with upstream of the respective diverging lens.

Abstract: A display device and a method for producing a display device are disclosed. In an embodiment a display device includes a flat textile support and a plurality of optoelectronic semiconductor components disposed on the support. Each semiconductor component includes a connection substrate comprising a plurality of electrical connections, the plurality of electrical connections electrically connected via electrically conductive contact threads, wherein each electrical connection is realized by a contact hole which completely penetrates through the semiconductor component and, viewed in a plan view, is surrounded all around by the connection substrate and wherein, in each case, at least one contact thread runs through the contact hole so that the contact thread is arranged in part on an upper side of the semiconductor component facing away from the support, a plurality of semiconductor chips for generating light and at least one control unit for adjusting a color location of the light.

Abstract: An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.

Abstract: A light fixture comprises two cooling elements and a plurality of semiconductor lighting elements, wherein each cooling element has a central portion and a wall portion which extends away from the central portion and at least partially surrounds an interior of a cooling element. The two cooling elements are arranged opposite one another. An annular opening for exchange of air with the environment is present between the two cooling elements. The semiconductor lighting elements are arranged on the outside of the wall portion of the cooling elements. A corresponding cooling element has two or more vanes, wherein all vanes are connected to one another by means of a central connecting element. Each vane extends in an axial direction and in a circumferential direction and has a curvature in the axial direction and preferably a curvature in the circumferential direction.

Abstract: The present invention relates to a luminous means (1) comprising an enveloping bulb (3), a base (4), a first LED (21a) and a second LED (21b), which are assembled on a planar printed circuit board (2), to be precise on the opposite sides (20) thereof in relation to a thickness direction, wherein a first diverging lens (5a) is mounted on the first side (20a) of the printed circuit board (2) in a manner assigned to the first LED (21a) and a second diverging lens (5b) is mounted on the second side (20b) of the printed circuit board (2) in a manner assigned to the second LED (21b) for the purposes of homogenizing the light distribution generated by the luminous means (1), and the light emitted by the respective LED (21) has a widened luminous intensity distribution downstream of the respective diverging lens (5) in comparison with upstream of the respective diverging lens (5).

Abstract: The present invention relates to a lighting means (71) comprising at least two LEDs (3) mounted on apposite sides (21a, b) of a flat printed circuit board (1), said printed circuit board (1) being combined with a reflector (2) which is free of LEDs, a part of the light emitted by each LED (3) being reflected by the reflector (2) to homogenize the light distribution generated by the lighting means (71), and specifically in each case with a directional component parallel to a surface direction (24) of the flat printed circuit board (1).

Abstract: The present invention relates to a luminous means (1) having a cap (6) and an outer bulb (5) in which LEDs (3) are arranged on a flat multilayer substrate (2) which is constructed, at least in regions, from at least two substrate layers (81) between two outside surfaces (4) which are opposite one another, wherein the at least two substrate layers (81) are formed from a flat substrate sheet (21) which is laid back on itself, and wherein the LEDs (3) are mounted on a side surface (84) of the substrate sheet (21), which at least proportionally forms the two outside surfaces (4) of the multilayer substrate (2) in each case on account of the substrate sheet (21) being laid back, in such a manner that at least one of the LEDs (3) is mounted in each case on both of the two outside surfaces (4) of the multilayer substrate (2).