Abstract: The present invention relates to a luminous means (1) having a cap (6) and an outer bulb (5) in which LEDs (3) are arranged on a flat multilayer substrate (2) which is constructed, at least in regions, from at least two substrate layers (81) between two outside surfaces (4) which are opposite one another, wherein the at least two substrate layers (81) are formed from a flat substrate sheet (21) which is laid back on itself, and wherein the LEDs (3) are mounted on a side surface (84) of the substrate sheet (21), which at least proportionally forms the two outside surfaces (4) of the multilayer substrate (2) in each case on account of the substrate sheet (21) being laid back, in such a manner that at least one of the LEDs (3) is mounted in each case on both of the two outside surfaces (4) of the multilayer substrate (2).

Abstract: The present invention relates to a luminous means (1) having LEDs (23) on a substrate (2), an outer bulb (3) in which the substrate (2) having the LEDs (23) is arranged, and a cap (4), wherein at least two partial surfaces (2a) of the substrate (2) are folded out with respect to the remaining substrate (2b) around a bridge area (25) in each case, via which the particular partial surface (2a) is connected to the remaining substrate (2b), and are thus set obliquely with respect to the remaining substrate (2b) which is flat per se, wherein, for each side surface of the remaining substrate (2b), which side surfaces are opposite one another with respect to a thickness direction of the remaining substrate (2b), at least one partial surface (2a) is folded out in each case, and wherein at least one of the LEDs (23) is arranged on each of the partial surfaces (2a).

Abstract: The present invention relates to a lighting means (71) comprising at least two LEDs (3), mounted on opposite sides (21a, b) of a flat printed circuit board (1), said printed circuit board (1) being combined with a reflector (2) which is free of LEDs, a part of the light emitted by each LED (3) being reflected by the reflector (2) to homogenize the light distribution generated by the lighting means (71), and specifically in each case with a directional component parallel to a surface direction (24) of the flat printed circuit board (1).

Abstract: Various embodiments relate to a lighting device with an optoelectronic light source, an optical body downstream thereof for distributing the light, and a diffuser downstream of the latter, onto the light entry surface of which the light emitted by the optical body falls and the light exit surface of which represents a light emission surface of the lighting device. To homogenize the luminous intensity on the light exit surface, in addition to distributing the light with the optical body, the diffuser is not provided to be uniformly scattering to such an extent that light falling thereon in a central region is scattered more intensely than light falling thereon in an edge region.

Abstract: In various embodiments, a lighting unit is provided. The lighting unit may include a hollow body made of a plastics material as a substrate, which hollow body has an outer surface and an opposite inner surface, wherein the latter at least partially delimits a hollow body internal volume, a plurality of light emitting diodes, which are arranged on the outer surface of the hollow body, and a conductor track structure, which is electrically conductively connected to the light emitting diodes. The conductor track structure is arranged on the inner surface of the hollow body, and the electrically conductive connection to the light emitting diodes is produced by through-contacts, which are passed through the plastics material.

Abstract: An optoelectronic semiconductor component includes: at least one optoelectronic semiconductor chip, a leadframe having one a plurality of leadframe parts, at least two electrical connection means via which the semiconductor chip is electrically contact-connected to the leadframe, and a potting body, which is fitted to the leadframe and mechanically supports the latter, wherein the one or at least one of the leadframe parts is provided with a reflective coating at a top side, the semiconductor chip is fitted on the reflective coating at the top side, the leadframe includes at least two contact locations, onto which the connection means are directly fitted, and the contact locations are formed from a material that is different from the reflective coating.

Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.

Abstract: Various embodiments relate to a lighting device with an optoelectronic light source, an optical body downstream thereof for distributing the light, and a diffuser downstream of the latter, onto the light entry surface of which the light emitted by the optical body falls and the light exit surface of which represents a light emission surface of the lighting device. To homogenize the luminous intensity on the light exit surface, in addition to distributing the light with the optical body, the diffuser is not provided to be uniformly scattering to such an extent that light falling thereon in a central region is scattered more intensely than light falling thereon in an edge region.

Abstract: In various embodiments, a lighting unit is provided. The lighting unit may include a hollow body made of a plastics material as a substrate, which hollow body has an outer surface and an opposite inner surface, wherein the latter at least partially delimits a hollow body internal volume, a plurality of light emitting diodes, which are arranged on the outer surface of the hollow body, and a conductor track structure, which is electrically conductively connected to the light emitting diodes. The conductor track structure is arranged on the inner surface of the hollow body, and the electrically conductive connection to the light emitting diodes is produced by through-contacts, which are passed through the plastics material.

Abstract: An optoelectronic semiconductor component includes: at least one optoelectronic semiconductor chip, a leadframe having one a plurality of leadframe parts, at least two electrical connection means via which the semiconductor chip is electrically contact-connected to the leadframe, and a potting body, which is fitted to the leadframe and mechanically supports the latter, wherein the one or at least one of the leadframe parts is provided with a reflective coating at a top side, the semiconductor chip is fitted on the reflective coating at the top side, the leadframe includes at least two contact locations, onto which the connection means are directly fitted, and the contact locations are formed from a material that is different from the reflective coating.

Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.