Patents by Inventor Andreas Fischer

Andreas Fischer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8449755
    Abstract: The invention relates to a process for preparing biaryl alcohols, in which anodic dehydrodimerization of substituted phenols is carried out in the presence of partially fluorinated and/or periluorinated mediators and a supporting electrolyte at a graphite electrode.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: May 28, 2013
    Assignee: BASF SE
    Inventors: Andreas Fischer, Itamar Michael Malkowsky, Florian Stecker, Siegfried Waldvogel, Axel Kirste
  • Patent number: 8450635
    Abstract: A method for processing a substrate is disclosed. The method includes supporting the substrate in the plasma-processing chamber configured with a first electrode and a second electrode. The method also includes coupling a passive radio frequency (RF) circuit to the second electrode, the passive RF circuit being configured to adjust one or more of an RF impedance, an RF voltage potential, and a DC bias potential on the second electrode.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: May 28, 2013
    Assignee: Lam Research Corporation
    Inventors: Rajinder Dhindsa, Alexei Marakhtanov, Eric Hudson, Andreas Fischer
  • Patent number: 8443756
    Abstract: Showerhead electrodes for a semiconductor material processing apparatus are disclosed. An embodiment of the showerhead electrodes includes top and bottom electrodes bonded to each other. The top electrode includes one or more plenums. The bottom electrode includes a plasma-exposed bottom surface and a plurality of gas holes in fluid communication with the plenum. Showerhead electrode assemblies including a showerhead electrode flexibly suspended from a top plate are also disclosed. The showerhead electrode assemblies can be in fluid communication with temperature-control elements spatially separated from the showerhead electrode to control the showerhead electrode temperature. Methods of processing substrates in plasma processing chambers including the showerhead electrode assemblies are also disclosed.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: May 21, 2013
    Assignee: Lam Research Corporation
    Inventors: Andreas Fischer, Rajinder Dhindsa
  • Publication number: 20130085038
    Abstract: Stationary exercise equipment for physical training, more particularly an exercise bike, comprising a frame with a movement unit which either is to be moved by the exerciser or is itself driven and interacts with the exerciser, one or more sensors, assigned to the movement unit and/or the exerciser, for capturing measured values, and a computer apparatus for establishing one or more items of measurement-value-related information, which are output on a frame-side display apparatus, letterized in that provision is made for a first display apparatus (6), which is directed at the exerciser for displaying one or more items of information, and in that provision is made for a second display apparatus (11), which is directed at the opposite side for outputting at least one item of information.
    Type: Application
    Filed: August 16, 2012
    Publication date: April 4, 2013
    Inventor: Andreas FISCHER
  • Publication number: 20130056364
    Abstract: The invention provides a method for bleaching kitchenware in a dishwasher, comprising the step of the in situ activation of a bleach activator by means of a reactive oxygen species, where the reactive oxygen species is generated in situ in the dishwasher by electrolysis of an aqueous solution.
    Type: Application
    Filed: September 5, 2012
    Publication date: March 7, 2013
    Applicant: BASF SE
    Inventors: Florian Stecker, Steffen Maas, Ulrich Griesbach, Andreas Fischer
  • Publication number: 20130057307
    Abstract: A circuit breaker is disclosed. A Rogowski converter is checked for wire breakage by applying the Rogowski converter with a voltage which is output by a digital/analog converter in response to a digital signal. The digital signal is dependent on the switch rated current of the circuit breaker.
    Type: Application
    Filed: September 5, 2012
    Publication date: March 7, 2013
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Andreas FISCHER
  • Publication number: 20130049486
    Abstract: In order to provide a high impedance between two sensor terminals, for instance for connecting a Rogowski transducer to a circuit breaker, but to prevent the coupling-in of interference signals in the case of a non-connection to the terminals, two auxiliary terminals are connected. In at least one embodiment, they are connected in such a manner that in the basic state, the sensor terminals are short circuited but in the case of a connection, for example of a plug to the sensor terminals and simultaneously to the auxiliary terminals, the short circuit is canceled with external short circuiting of the auxiliary terminals.
    Type: Application
    Filed: August 28, 2012
    Publication date: February 28, 2013
    Applicant: Siemens Aktiengesellschaft
    Inventor: Andreas FISCHER
  • Publication number: 20130040031
    Abstract: The present invention relates to a method for producing vanillin, which comprises an electrochemical oxidation of an aqueous, lignin-comprising suspension or solution at an anode, wherein the anode used is a silver electrode.
    Type: Application
    Filed: August 8, 2012
    Publication date: February 14, 2013
    Applicants: Rheinische Friedrich-Wilhelms-Universitaet Bonn, BASF SE
    Inventors: Florian STECKER, Itamar Michael MALKOWSKY, Andreas FISCHER, Siegfried R. WALDVOGEL, Carolin REGENBRECHT
  • Publication number: 20130029480
    Abstract: A method of making a three-dimensional structure in semiconductor material includes providing a substrate (20) is provided having at least a surface including semiconductor material. Selected areas of the surface of the substrate are exposed to a focussed ion beam whereby the ions are implanted in the semiconductor material in the selected areas. Several layers of a material selected from the group consisting of mono-crystalline, poly-crystalline or amorphous semiconductor material, are deposited on the substrate surface and between depositions focussed ion beam is used to expose the surface so as to define a three-dimensional structure. Material not part of the final structure (30) defined by the focussed ion beam is etched away so as to provide a three-dimensional structure on the substrate (20).
    Type: Application
    Filed: April 5, 2011
    Publication date: January 31, 2013
    Inventors: Frank Niklaus, Andreas Fischer
  • Publication number: 20130012078
    Abstract: A method for at least partially inserting a plug into a hole, said method comprising the steps of a) providing a at least one substrate with at least one hole wherein said at least one hole has a largest dimension of from 1 ?m to 300 ?m, b) providing a piece of material, wherein said piece of material has a larger dimension than said at least one hole, c) pressing said piece of material against the hole with a tool so that a plug is formed, wherein at least a part of said piece of material is pressed into said hole, d) removing the tool from the piece of material. There is further disclosed a plugged hole manufactured with the method. One advantage of an embodiment is that an industrially available wire bonding technology can be used to seal various cavities. The existing wire bonding technology makes the plugging fast and cheap.
    Type: Application
    Filed: December 17, 2010
    Publication date: January 10, 2013
    Applicant: AEROCRINE AB
    Inventors: Andreas Fischer, Göran Stemme, Frank Niklaus, Niklas Roxhed
  • Patent number: 8337713
    Abstract: A method for etching a layer over a substrate in a process chamber, wherein the process chamber including a first electrode and a second electrode and the first electrode is disposed opposite of the second electrode is provided. The method includes placing the substrate on the second electrode and providing an etching gas into the process chamber. The method also includes providing a first radio frequency (RF) signal into the process chamber and modulating the first RF signal. The method further includes providing a second RF signal into the process chamber and modulating the second RF signal.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: December 25, 2012
    Assignee: Lam Research Corporation
    Inventors: Peter Loewenhardt, Mukund Srinivasan, Andreas Fischer
  • Publication number: 20120318455
    Abstract: Passive wafer gap compensation arrangements and methods relying on temperature-driven dimensional change of thermally expanding component(s) to counteract, substantially or partially, the change in the wafer gap due to chamber component temperature change is provided. The passive arrangements and techniques involve passively raising or lowering the substrate-facing component or the substrate support to counteract, substantially or partially, the gap-narrowing effect or gap-expanding effect of rising temperature, thereby reducing or eliminating the change in the wafer gap due to a change in the chamber component temperature. Cooling arrangement(s) and thermal break(s) are optionally provided to improve performance.
    Type: Application
    Filed: June 14, 2011
    Publication date: December 20, 2012
    Inventors: Andreas Fischer, Gregory Sexton
  • Publication number: 20120312780
    Abstract: A method for processing a substrate in a capacitively-coupled plasma processing system having a plasma processing chamber and at least an upper electrode and a lower electrode. The substrate is disposed on the lower electrode during plasma processing. The method includes providing at least a first RF signal, which has a first RF frequency, to the lower electrode. The first RF signal couples with a plasma in the plasma processing chamber, thereby inducing an induced RF signal on the upper electrode. The method also includes providing a second RF signal to the upper electrode. The second RF signal also has the first RF frequency, A phase of the second RF signal is offset from a phase of the first RF signal by a value that is less than 10%, The method further includes processing the substrate while the second RF signal is provided to the upper electrode.
    Type: Application
    Filed: August 22, 2012
    Publication date: December 13, 2012
    Inventors: Rajinder Dhindsa, Hudson Eric, Alexei Marakhtanov, Andreas Fischer
  • Publication number: 20120312475
    Abstract: A capacitively-coupled plasma processing system having a plasma processing chamber for processing a substrate is provided. The plasma processing system includes at least an upper electrode and a lower electrode for processing the substrate, the substrate being disposed on the lower electrode during plasma processing. The plasma processing system further includes means for providing at least a first RF signal to the lower electrode, the first RF signal having a first RF frequency. The first RF signal couples with a plasma in the plasma processing chamber, thereby inducing an induced RF signal on the upper electrode. The plasma processing system further includes means for rectifying the induced RF signal to generate a rectified RF signal such that the rectified RF signal is more positively biased than negatively biased, wherein the substrate is configured to be processed while the rectified RF signal is provided to the upper electrode.
    Type: Application
    Filed: June 18, 2012
    Publication date: December 13, 2012
    Inventors: Rajinder Dhindsa, Hudson Eric, Alexei Marakhtanov, Andreas Fischer
  • Patent number: 8323523
    Abstract: A method of bevel edge processing a semiconductor in a bevel plasma processing chamber in which the semiconductor substrate is supported on a semiconductor substrate support is provided. The method comprises evacuating the bevel etcher to a pressure of 3 to 100 Torr and maintaining RF voltage under a threshold value; flowing a process gas into the bevel plasma processing chamber; energizing the process gas into a plasma at a periphery of the semiconductor substrate; and bevel processing the semiconductor substrate with the plasma.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: December 4, 2012
    Assignee: Lam Research Corporation
    Inventors: Tong Fang, Yunsang S. Kim, Andreas Fischer
  • Publication number: 20120302643
    Abstract: A hitherto unknown crystalline form of (?)-(1R,2R)-3-(3-dimethylamino-1-ethyl-2-methylpropyl)-phenol hydrochloride, pharmaceutical compositions containing the new crystalline form, methods of producing the new crystalline form, and a related method of use including treatment of, e.g., pain and/or urinary incontinence.
    Type: Application
    Filed: August 3, 2012
    Publication date: November 29, 2012
    Applicant: Gruenenthal GmbH
    Inventors: Andreas FISCHER, Helmut BUSCHMANN, Michael GRUSS, Dagmar LISCHKE
  • Publication number: 20120294937
    Abstract: According to the invention there is provided a capsule for peroral administration to the gastrointestinal tract containing (a) a pharmacologically effective amount of a PPI or a pharmaceutically acceptable salt thereof and an enteric substance positioned to protect the PPI or salt thereof from the acidic environment of the stomach, and (b) a plurality of granules comprising a pharmacologically effective amount of a micronised H2RA or a pharmaceutically acceptable salt thereof, a disintegrant and a filler The capsules of the invention are particularly useful in the treatment of gastric acid secretion-related disorders, such as gastro-esophageal reflux disease.
    Type: Application
    Filed: December 24, 2010
    Publication date: November 22, 2012
    Applicant: NOVARTIS AG
    Inventor: Andreas Fischer
  • Patent number: 8309610
    Abstract: This invention relates to solid crystalline forms of (1RS,3RS,6RS)-6-Dimethylaminomethyl-1-(3-methoxy-phenyl)cyclohexane-1,3-diol hydrochloride (1), methods of producing 1, methods of use of 1, use of 1 as analgesics and pharmaceutical compositions comprising 1.
    Type: Grant
    Filed: February 21, 2006
    Date of Patent: November 13, 2012
    Assignee: Gruenenthal GmbH
    Inventors: Michael Gruss, Helmut Buschmann, Andreas Fischer, Wolfgang Hell, Dagmar Lischke
  • Publication number: 20120282766
    Abstract: A method for preventing formation of metal silicide material on a wafer bevel is provided, where the wafer bevel surrounds a central region of the wafer. The wafer is placed in bevel plasma processing chamber. A protective layer is deposited on the wafer bevel. The wafer is removed from the bevel plasma processing chamber. A metal layer is deposited over at least part of the central region of the wafer, wherein part of the metal layer is deposited over the protective layer. Semiconductor devices are formed while preventing metal silicide formation on the wafer bevel.
    Type: Application
    Filed: May 6, 2011
    Publication date: November 8, 2012
    Applicant: Lam Research Corporation
    Inventors: Andreas Fischer, William Scott Bass
  • Patent number: D675687
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: February 5, 2013
    Inventor: Andreas Fischer