Patents by Inventor Andreas Grassmann

Andreas Grassmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170140946
    Abstract: A cooling apparatus is manufactured by: receiving a discrete module by a first singular part, the discrete module including a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, and a first cooling plate at least partly uncovered by the mold compound; attaching a second singular part to a periphery of the first part to form a housing, the housing surrounding a periphery of the discrete module, the second part having a cutout which exposes the first cooling plate and a sealing structure facing a side of the discrete module with the first cooling plate; and filling the sealing structure with a sealing material which forms a water-tight seal around the periphery of the discrete module at the side of the discrete module with the first cooling plate.
    Type: Application
    Filed: January 31, 2017
    Publication date: May 18, 2017
    Inventors: Inpil Yoo, Andreas Grassmann
  • Publication number: 20170096066
    Abstract: A hybrid vehicle including a hybrid power control unit (HPCU) is provided. The HPCU includes a power module having chips disposed therein, each of which generates heat during operation, a coolers that cools the heat from the power module. Additionally chip soldering interface material (SIM)s that bond the chips and the power module are provided to form interior solder layers. Further, a cooler Soldering Interface Material (SIM)s bonds the power module and the coolers to form an exterior solder layers. Consequently, improvements in cooling performance and a reduction in cost are achieved, without a variation in applied thickness and a pump-out phenomenon caused when using a TIM having low thermal conductivity.
    Type: Application
    Filed: August 24, 2016
    Publication date: April 6, 2017
    Inventors: Hyun-Koo Lee, Andreas Grassmann
  • Patent number: 9613885
    Abstract: A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: April 4, 2017
    Assignee: Infineon Technologies AG
    Inventors: Inpil Yoo, Andreas Grassmann
  • Patent number: 9589922
    Abstract: An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.
    Type: Grant
    Filed: March 16, 2014
    Date of Patent: March 7, 2017
    Assignee: Infineon Technologies AG
    Inventors: Christian Neugirg, Andreas Grassmann, Wolfram Hable, Ottmar Geitner, Frank Winter, Alexander Schwarz, Inpil Yoo
  • Publication number: 20170062317
    Abstract: A power semiconductor module is provided. The power semiconductor module includes a lower substrate and a first electronic device bonded to a surface of the lower substrate. A lead frame has a first side surface bonded to a surface of the first electronic device by a first adhesive, and a second electronic device bonded to a second side surface of the lead frame by the first adhesive. An upper substrate is bonded to a surface of the second electronic device.
    Type: Application
    Filed: November 30, 2015
    Publication date: March 2, 2017
    Inventors: Jeong-Min Son, Andreas Grassmann
  • Patent number: 9585241
    Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: February 28, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Wolfram Hable, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt
  • Patent number: 9564384
    Abstract: A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: February 7, 2017
    Assignee: Infineon Technologies AG
    Inventors: Inpil Yoo, Andreas Grassmann
  • Publication number: 20160293524
    Abstract: An electronic module includes a circuit board, having a carrier layer, the carrier layer having a plurality of recess areas in a main surface thereof, and a plurality of electronic sub-modules, each one of the sub-modules being disposed in one of the recess areas and each one of the sub-modules having a carrier, a semiconductor chip disposed on the carrier, and an encapsulation material disposed on the carrier and on the semiconductor chip.
    Type: Application
    Filed: March 28, 2016
    Publication date: October 6, 2016
    Inventors: Andreas Grassmann, Juergen Hoegerl
  • Publication number: 20160260654
    Abstract: A cooling apparatus includes a plurality of discrete modules and a plastic housing. Each module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of each module to form a multi-die module. The plastic housing includes a first singular plastic part which receives the modules and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates.
    Type: Application
    Filed: March 3, 2015
    Publication date: September 8, 2016
    Inventors: Inpil Yoo, Andreas Grassmann
  • Patent number: 9370113
    Abstract: A power semiconductor module includes a power electronics substrate having a first surface, a second surface opposite the first surface, a first longitudinal side, a second longitudinal side opposite the first longitudinal side, a module frame, which is arranged to enclose the power electronics substrate, at least one power terminal which is arranged at the first longitudinal side and extends through the module frame, a further terminal, which is arranged at the second longitudinal side and extends through the module frame, at least one power semiconductor component which is arranged on the first surface of the power electronics substrate and is electrically connected to at least one power terminal, and at least one current sensor which is designed to measure a current in a power terminal. The at least one current sensor is arranged on the power terminal and has a signal output connected to the further terminal.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: June 14, 2016
    Assignee: Infineon Technologies AG
    Inventors: Udo Ausserlechner, Andreas Grassmann
  • Patent number: 9275926
    Abstract: According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: March 1, 2016
    Assignee: Infineon Technologies AG
    Inventors: Wolfram Hable, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt, Lothar Koenig, Andre Uhlemann
  • Publication number: 20160013639
    Abstract: A circuit may comprise an electronic switching element, an integrated sensor, and a low-impedance path from one of the terminals of the sensor to one of the terminals of the electronic switching element.
    Type: Application
    Filed: July 14, 2014
    Publication date: January 14, 2016
    Inventors: Stefan Willkofer, Gernot Langguth, Wolfgang Roesner, Andreas Grassmann
  • Publication number: 20160014916
    Abstract: A power semiconductor module includes a power electronics substrate having a first surface, a second surface opposite the first surface, a first longitudinal side, a second longitudinal side opposite the first longitudinal side, a module frame, which is arranged to enclose the power electronics substrate, at least one power terminal which is arranged at the first longitudinal side and extends through the module frame, a further terminal, which is arranged at the second longitudinal side and extends through the module frame, at least one power semiconductor component which is arranged on the first surface of the power electronics substrate and is electrically connected to at least one power terminal, and at least one current sensor which is designed to measure a current in a power terminal. The at least one current sensor is arranged on the power terminal and has a signal output connected to the further terminal.
    Type: Application
    Filed: July 9, 2015
    Publication date: January 14, 2016
    Inventors: Udo Ausserlechner, Andreas Grassmann
  • Publication number: 20150264796
    Abstract: An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.
    Type: Application
    Filed: March 16, 2014
    Publication date: September 17, 2015
    Applicant: Infineon Technologies AG
    Inventors: Christian NEUGIRG, Andreas GRASSMANN, Wolfram HABLE, Ottmar GEITNER, Frank WINTER, Alexander SCHWARZ, Inpil YOO
  • Publication number: 20150085446
    Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.
    Type: Application
    Filed: September 24, 2013
    Publication date: March 26, 2015
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Wolfram Hable, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt
  • Publication number: 20140353818
    Abstract: A method of manufacturing a power module comprising two substrates is provided, wherein the method comprises disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer
    Type: Application
    Filed: June 4, 2013
    Publication date: December 4, 2014
    Inventors: Ottmar GEITNER, Wolfram HABLE, Andreas Grassmann, Frank Winter, Christian Neugirg, Ivan Nikitin
  • Publication number: 20140327127
    Abstract: According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.
    Type: Application
    Filed: May 3, 2013
    Publication date: November 6, 2014
    Inventors: Wolfram HABLE, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt, Lothar Koenig, Andre Uhlemann
  • Patent number: 6635388
    Abstract: The invention relates to a phase shift mask for lithographically producing small structures at the limit of a resolution that is predetermined by the wavelength of the exposure radiation. The phase shift mask has first regions A and second regions B that effect a phase-shift relative to the first regions. The second regions are arranged beside the first regions for producing a sudden phase shift along the boundaries between the first and the second regions. Individual first regions touch one another via corners at points, at which the second regions also touch one another via corners. The result is that the boundaries between first and second regions merge at these points and these points are opaque to the radiation. The invention makes it possible to expose extremely small contact holes with just a single exposure and thus leads to a reduction of costs in the fabrication of integrated semiconductor circuits.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: October 21, 2003
    Assignee: Infineon Technologies AG
    Inventors: Christoph Friedrich, Uwe Griesinger, Rainer Pforr, Dietrich Widmann, Andreas Grassmann
  • Patent number: 6162564
    Abstract: A shading film of chrome is formed entirely on one surface of a circular substrate of quartz. The substrate is rotated and resist is applied to the shading film. Since the substrate is shaped in a circle, the resist spreads uniformly on the entire surface of the shading film by the centrifugal force. Therefore, the resist has a substantially uniform film thickness over almost the entire surface of the shading film. This resist is patterned to form a resist pattern. By etching the shading film with the resist pattern used as a mask, a pattern preferable in accuracy of dimensions can be formed.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: December 19, 2000
    Assignees: Kabushiki Kaisha Toshiba, Siemens Microelectronics, Inc.
    Inventors: Katsuhiko Hieda, Thomas Fischer, Andreas Grassmann
  • Patent number: 6063530
    Abstract: A lithographic system with improved control of critical dimensions (CD). The lithographic system includes a detector for determining the amount of energy absorbed by the photoresist. This enables the lithographic system to expose each field with the required exposure dose, thus reducing variations in CD.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: May 16, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventor: Andreas Grassmann