Abstract: An anchoring system for use with a downhole tool includes a body with anchor members mounted on the body that pivot radially outward from the body and into engagement with an inner surface of a tubular. Curved slots are provided along a portion of the members and a sliding block has a protrusion that projects into the slots. The slots are curved so that when the block is urged axially within the body, the interaction between the slots and protrusions pivots the members radially outward. A piston is urged through the body to drive the block. Optionally, an elongate helical gear may cooperate with grooves formed in an edge of the members so that rotating the gear pivots the members radially outward.

Abstract: The invention relates to a compressor blade of a compressor which, along a main axis, comprises a blade base, a platform area and an adjacent blade profile having a profile tip. The blade profile is configured by a convex wall at the suction end and a concave wall at the pressure end opposite the wall at the suction end. These surfaces extend, with respect to a flow medium, from a leading edge to a trailing edge, a profile center line extending in the center between the two. A front face is arranged on the profile tip at an angle to the main axis, a sealing lip at least partially extending from the leading edge to the trailing edge and the blade profile including the sealing lip having a blade profile height extending in the direction of the main axis. In order to allow for an inexpensive compressor blade having improved aerodynamic properties and a modified sealing lip while having the same sealing properties, the height of the sealing lip is less than 2 percent of the height of the blade profile.

Abstract: A semiconductor device includes a semiconductor substrate having a first side and a second side opposite the first side, an active area and a through contact area, the active area including a transistor structure having a control electrode, the through contact area including a semiconductor mesa having insulated sidewalls. The semiconductor device further includes a first metallization on the first side in the active area and a recess extending from the first side into the semiconductor substrate and between the active area and the through contact area and including in the through contact area a horizontally widening portion, the recess being at least partly filled with a conductive material forming a first conductive region in ohmic contact with the semiconductor mesa and the transistor structure. The semiconductor device also includes a control metallization on the second side and in ohmic contact with the semiconductor mesa.

Abstract: A package for disposable diapers having a portion of the package usable as a baby changing mat.

Abstract: Measurements made by a near-bit magnetic sensor on a bottomhole assembly are used to determine the azimuth of the BHA. The sensor may be uncalibrated. The measurement may include a cross-axial component of the magnetic field. The method may include estimating the axial component of the near-bit magnetic field using the measurement. The method may include using the estimated azimuth of the BHA for controlling a direction of drilling. The method may include estimating the component Hxy. The method may include correcting the estimated axial component using an offset between a gravitational toolface and a magnetic toolface.

Abstract: A method for determining execution states, market clearing prices and bid and ask prices for futures products at an opening auction. A plurality of orders is received, each order is associated with a price limit, a quantity, a participant and a futures product. For each order a quantity vector is determined, is based on the futures product associated with the order. Further, for each order a price vector is determined, based on the price limit and the futures product associated with the order. Then, an execution state vector is determined by using the determined price and quantity vectors to maximize an objective function subject to constraints. Market clearing prices and best, not executed, buy and sell orders are determined for each product using the execution state vector. Finally the bid and ask prices are given by the price limits of the best, not executed, buy and sell orders.

Abstract: An apparatus for drilling a borehole into an earth formation includes: a drill bit configured to be rotated to drill into the formation; a drill tubular coupled to the drill bit and configured to rotate the drill bit; a steering device coupled to the drill string and configured to impart a force on the drill string to control a direction of drilling; and a controller configured to communicate a control signal to the steering device. The control signal includes information for directing actuation of the steering device for steering the drill bit in an intended drilling direction. The controller is further configured to direct the steering device to provide a compensating force on the drill string that prevents or reduces an azimuthal deviation from the intended drilling direction due to drill bit walking.

Abstract: A semiconductor device includes a semiconductor substrate having a first side and a second side opposite the first side, an active area and a through contact area, the active area including a transistor structure having a control electrode, the through contact area including a semiconductor mesa having insulated sidewalls. The semiconductor device further includes a first metallization on the first side in the active area and a recess extending from the first side into the semiconductor substrate and between the active area and the through contact area and including in the through contact area a horizontally widening portion, the recess being at least partly filled with a conductive material forming a first conductive region in ohmic contact with the semiconductor mesa and the transistor structure. The semiconductor device also includes a control metallization on the second side and in ohmic contact with the semiconductor mesa.

Abstract: According to an embodiment, a method for manufacturing a semiconductor device is provided. The method includes providing a mask layer which is used as an implantation mask when forming a doping region and which is used as an etching mask when forming an opening and a contact element formed in the opening. The contact element is in contact with the doping region.

Abstract: A device for dissipating heat away from a heat sensitive component includes a heat dissipation member thermally coupled to a heat sensitive component. The heat dissipation member may be formed of a composite material. In aspects, the device may be include an enclosure coupled to a conveyance device; a heat sensitive component disposed in the enclosure; and a composite heat dissipation member thermally coupled to the heat sensitive component. The composite heat dissipation member may include a metal and a non-metal. The apparatus may also include an encapsulation substantially encapsulating the heat dissipation member and the heat sensitive component.

Abstract: A package configuration for absorbent articles, such as disposable diapers, training pants and adult incontinence undergarments is disclosed. The package configuration may include one or more pluralities of absorbent articles, each plurality packaged in a flexible package. The one or more flexible packages may be wrapped and further contained by a wrap-around. The wrap-around may have first and second pairs of opposing side panels. Adjacent side panels from the first and second pair may be joined by corner panels. The corner panels may form interior angles with the side panels of from 100° to 170°. The presence of the angled corner panels may render the wrap-around better able to conform to the shape of the one or more flexible packages, and more resistant to deformation.

Abstract: Cursor synchronization in a plurality of graphs. A plurality of graphs may be displayed. Each graph may visually represent data and may include at least two axis. User input may be received specifying a value of a first axis of a first graph of the plurality of graphs. The method may determine if the first axis in the first graph corresponds to a first axis of a second graph in response to the user input. A visual indication may be indicated at a second value in the second graph in response to determining that the first axis in the first graph corresponds to the first axis of the second graph. The second value may correspond to the first value.

Abstract: According to an embodiment, a method for manufacturing a semiconductor device is provided. The method includes providing a mask layer which is used as an implantation mask when forming a doping region and which is used as an etching mask when forming an opening and a contact element formed in the opening. The contact element is in contact with the doping region.

Abstract: According to an embodiment, a method of forming a semiconductor device includes: providing a wafer having a semiconductor substrate with a first side a second side opposite the first side, and a dielectric region arranged on the first side; mounting the wafer with the first side on a carrier system; etching a deep vertical trench from the second side through the semiconductor substrate to the dielectric region, thereby insulating a mesa region from the remaining semiconductor substrate; and filling the deep vertical trench with a dielectric material.

Abstract: The invention relates to a lower cutter (4) which, together with an associated upper cutter (6), forms the shaving head of a dry shaver. The upper cutter is designed in the form of a perforated foil (6) which at least partially encloses the lower cutter (4) and is prestressed against the same. The lower cutter (4) has a plurality of spaced-apart blades having cutting edges (12, 13) in the form of strips between two peripheral regions (9, 10). The lower cutter (4) is essentially U-shaped in cross section. The width of the strip tapers monotonously from the two peripheral regions (9, 10) in the direction of the center (Z).

Abstract: According to one embodiment, a die package is provided comprising a first die structure with a first plurality of switching elements wherein controlled current input terminals of the first plurality of switching elements are electrically coupled by a common contact region and wherein controlled current output terminals of the first plurality of switching elements are insulated from each other; a second die structure with a second plurality of switching elements wherein controlled current output terminals of the second plurality of switching elements are coupled by a common contact region and wherein controlled current input terminals of the second plurality of switching elements are insulated from each other; and wherein, for each of the first plurality of switching elements, the output terminal of the switching element is coupled with the input terminal of at least one switching element of the second plurality of switching elements.

Abstract: A shaving foil for an electric shaving apparatus. The shaving foil includes a perforated region with a plurality of holes which are separated from each other by bars. The perforated region is divided at least into two zones, preferably a central zone, a first edge zone, and a second edge zone. The central zone is arranged between the first edge zone and the second edge zone. The holes in the central zone have (i) an average size which is smaller than the average size of the holes in the first edge zone and in the second edge zone, (ii) a floating mean value of the size of the openings in the central zone smaller than a floating mean value of the size of the openings in the first edge zone and the second edge zone, or both (i) and (ii).

Abstract: A transistor includes a trench formed in a semiconductor body, the trench having sidewalls and a bottom. The transistor further includes a first semiconductor material disposed in the trench adjacent the sidewalls and a second semiconductor material disposed in the trench and spaced apart from the sidewalls by the first semiconductor material. The second semiconductor material has a different band gap than the first semiconductor material. The transistor also includes a gate material disposed in the trench and spaced apart from the first semiconductor material by the second semiconductor material. The gate material provides a gate of the transistor. Source and drain regions are arranged in the trench with a channel interposed between the source and drain regions in the first or second semiconductor material so that the channel has a lateral current flow direction along the sidewalls of the trench.

Abstract: A flexible package being capable and being adapted for accommodating a multiplicity of absorbent articles. The package has a substantially parallelepiped-shape and further comprises a frame. The frame is completely surrounding the top gusset extending upwardly and substantially orthogonally from the top gusset. The flexible package also comprises a handle extending over the top gusset. It is a further object of the present invention to provide a method of manufacturing a flexible package.

Abstract: Disclosed is an electronic circuit. The electronic circuit includes a transistor having a control terminal to receive a drive signal, and a load path between a first and a second load terminal. A voltage protection circuit is coupled to the transistor, has a control input, is configured to assume one of an activated state and a deactivated state as an operation state dependent on a control signal received at the control input, and is configured to limit a voltage between the load terminals or between one of the load terminals and the control terminal. A control circuit is coupled to the control input of the voltage protection circuit and is configured to deactivate the voltage protection circuit dependent on at least one operation parameter of the transistor and when a voltage across the load path or a load current through the load path is other than zero.