Patents by Inventor Andreas Zluc
Andreas Zluc has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170231098Abstract: A method of manufacturing a flexible electronic device is described. The method comprises arranging an electronic component on a temporary carrier, providing a flexible laminate comprising an adhesive layer, pressing the temporary carrier and the flexible laminate together with the adhesive layer facing the temporary carrier such that the electronic component is pushed into the adhesive layer, and removing the temporary carrier. Further, a corresponding flexible electronic device is described.Type: ApplicationFiled: February 8, 2017Publication date: August 10, 2017Inventors: Andreas Zluc, Johannes Stahr
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Publication number: 20170181293Abstract: A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive.Type: ApplicationFiled: April 1, 2015Publication date: June 22, 2017Inventors: Gerald Weidinger, Timo Schwarz, Andreas Zluc
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Publication number: 20170048984Abstract: The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formType: ApplicationFiled: February 26, 2015Publication date: February 16, 2017Applicant: AT&S Austia Technologie & Systemtechnik AktiengesellschaftInventors: Gerald Weidinger, Andreas Zluc
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Publication number: 20160324004Abstract: A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material; creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; positioning the component to be embedded in the clearance by way of the first temporary carrier layer; covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer; compressing the combinatType: ApplicationFiled: December 12, 2014Publication date: November 3, 2016Applicant: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Timo Schwarz, Andreas Zluc, Gregor Langer, Johannes Stahr
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Patent number: 9418930Abstract: A power module, having a printed circuit board core, which contains at least one electronic power component embedded in an insulating layer, the core being arranged between two heat dissipation plates, wherein each heat dissipation plate has a metal outer layer and a metal inner layer electrically separated from said metal outer layer by a thermally conductive, electrically insulating intermediate layer, and electrode terminals of the at least one power component are guided out from the core via terminal lines, wherein the printed circuit board core on both sides of the insulating layer has a conductor layer, at least one conductor layer is structured at least in portions, and each conductor layer is connected at least in portions via a conductive, metal intermediate layer to a metal inner layer of the heat dissipation plate, contacts run from the structured conductor layer to the electrode terminals of the at least one power component, and at least one power terminal of the at least one power component is coType: GrantFiled: May 6, 2014Date of Patent: August 16, 2016Assignee: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Johannes Stahr, Andreas Zluc, Gernot Grober, Timo Schwarz
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Publication number: 20160133558Abstract: A power module, having a printed circuit board core, which contains at least one electronic power component embedded in an insulating layer, the core being arranged between two heat dissipation plates wherein each heat dissipation plate has a metal outer layer and a metal inner layer electrically separated from said metal outer layer by a thermally conductive, electrically insulating intermediate layer, and electrode terminals of the at least one power component are guided out from the core via terminal lines, wherein the printed circuit board core on both sides of the insulating layer has a conductor layer, at least one conductor layer is structured at least in portions, and each conductor layer is connected at least in portions via a conductive, metal intermediate layer to a metal inner layer of the heat dissipation plate, contacts run from the structured conductor layer to the electrode terminals of the at least one power component, and at least one power terminal of the at least one power component is conType: ApplicationFiled: May 6, 2014Publication date: May 12, 2016Applicant: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Johannes Stahr, Andreas Zluc, Gernot Grober, Timo Schwartz
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Publication number: 20160044794Abstract: The invention relates to a method for producing a circuit board element having at least one electronic component, which component has a connection side defined by electrical contacts or a conductive layer and is connected to a temporary carrier for positioning and embedded in an insulating material; the component is attached in a specified position directly to a plastic film as a temporary carrier, whereupon a composite layer having at least a carrier and an electrical conductor, preferably also having an insulating material, is attached on the side of the component opposite the plastic film, with the carrier facing away from the component, and thereafter the plastic film is removed; then the component is embedded in insulating material, After the embedding of the component in the insulating material, an additional composite layer is preferably attached to the component and the embedding of the component on the side opposite the first composite layer.Type: ApplicationFiled: March 17, 2014Publication date: February 11, 2016Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFTInventors: Johannes STAHR, Andreas ZLUC
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Patent number: 9253888Abstract: In a method for integrating at least one electronic component into a printed circuit board or a printed circuit board intermediate product, the following steps are provided: providing a layer for at least temporarily supporting the electronic component, fixing the electronic component on the layer, arranging a conductive layer on the supporting layer with at least one cutout corresponding to the dimensions of the electronic component to be fixed, at least partly encapsulating or covering the component fixed on the supporting layer with an insulating material, exposing the electronic component, and at least partial regions of the conductive layer, which adjoins the component and is arranged on the supporting layer, and at least partly making contact between the electronic component and the conductive layer adjoining the component. Furthermore, a printed circuit board and a printed circuit board intermediate product having an integrated electronic component are provided.Type: GrantFiled: January 24, 2012Date of Patent: February 2, 2016Assignee: AT & S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Gerald Weidinger, Andreas Zluc, Johannes Stahr
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Publication number: 20140307403Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).Type: ApplicationFiled: June 25, 2014Publication date: October 16, 2014Inventors: Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser
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Publication number: 20140216795Abstract: In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board.Type: ApplicationFiled: March 11, 2014Publication date: August 7, 2014Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFTInventors: Günther Weichslberger, Johannes Stahr, Markus Leitgeb, Andreas Zluc, Gerald Weidinger
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Patent number: 8789271Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).Type: GrantFiled: May 29, 2009Date of Patent: July 29, 2014Assignee: AT & S Austria Technologies & Systemtechnik AktiengesellschaftInventors: Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser
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Patent number: 8685196Abstract: In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board.Type: GrantFiled: January 22, 2010Date of Patent: April 1, 2014Assignee: AT & S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Günther Weichslberger, Johannes Stahr, Markus Leitgeb, Andreas Zluc, Gerald Weidinger
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Publication number: 20140000941Abstract: In a method for integrating at least one electronic component into a printed circuit board or a printed circuit board intermediate product, the following steps are provided: providing a layer for at least temporarily supporting the electronic component, fixing the electronic component on the layer, arranging a conductive layer on the supporting layer with at least one cutout corresponding to the dimensions of the electronic component to be fixed, at least partly encapsulating or covering the component fixed on the supporting layer with an insulating material, exposing the electronic component, and at least partial regions of the conductive layer, which adjoins the component and is arranged on the supporting layer, and at least partly making contact between the electronic component and the conductive layer adjoining the component. Furthermore, a printed circuit board and a printed circuit board intermediate product having an integrated electronic component are provided.Type: ApplicationFiled: January 24, 2012Publication date: January 2, 2014Applicant: AT & S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Gerald Weidinger, Andreas Zluc, Johannes Stahr
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Patent number: 8541689Abstract: The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.Type: GrantFiled: January 30, 2008Date of Patent: September 24, 2013Assignee: AT & S Austria Technologie & Systemtecknik AktiengesellschaftInventors: Gerald Weidinger, Markus Leitgeb, Johannes Stahr, Günther Weichslberger, Andreas Zluc
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Publication number: 20110272177Abstract: In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board.Type: ApplicationFiled: January 22, 2010Publication date: November 10, 2011Inventors: Günther Weichslberger, Johannes Stahr, Markus Leitgeb, Andreas Zluc, Gerald Weidinger
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Publication number: 20110069448Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).Type: ApplicationFiled: May 29, 2009Publication date: March 24, 2011Inventors: Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser
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Publication number: 20100059262Abstract: The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.Type: ApplicationFiled: January 30, 2008Publication date: March 11, 2010Inventors: Gerald Weidinger, Markus Leitgeb, Johannes Stahr, Günther Weichslberger, Andreas Zluc