Abstract: A graphical user interface is used along with an automated algorithm selection function to enable market participants to initiate automated, multi-algorithm trading strategies through a single drag and drop motion. A symbol representing a security can be dragged and dropped onto an icon representing a tactical or strategic algorithm. Other features of the graphical user interface show information such as the progress of the algorithms.

Abstract: A graphical user interface is used along with an automated algorithm selection function to enable market participants to initiate automated, multi-algorithm trading strategies through a single drag and drop motion. A symbol representing a security can be dragged and dropped onto an icon representing a tactical or strategic algorithm. Other features of the graphical user interface show information such as the progress of the algorithms.

Abstract: A third electrode frame structure for use in a fuel cell or battery is provided. The third electrode frame structure may include a first electrode, a separator positioned on an outer perimeter of the first electrode, and a frame third electrode coupled to the separator. The separator may be positioned in a same plane between the first electrode and the third frame electrode.

Abstract: A galvanic cell utilizing a gas scrubber is provided. The galvanic cell may include a galvanic cell unit and a gas scrubber comprising an active material layer, a resistance coil in contact with the active material layer, a first shutter positioned between the active material layer and ambient air, a second shutter may be positioned between the galvanic cell unit and the active material layer.

Abstract: An electrochemical cell structure comprises a conductive base defining a plurality of holes passing through the conductive base and a microporous cellular substrate disposed on the conductive base. In another embodiment, an electrochemical cell structure comprises a conductive base defining a plurality of holes passing through the conductive base, a coarse microporous cellular substrate disposed on the conductive base and a fine microporous cellular substrate disposed on the coarse microporous cellular substrate.

Abstract: A method for manufacturing a solid oxide electrochemical device comprising disposing electrolyte between a first electrode and a second electrode, applying a bonding agent between the first electrode and a first interconnect, applying a sealing agent between the first electrode and the first interconnect, disposing a second interconnect adjacent to the second electrode, heating the first interconnect, the first electrode, the electrolyte, the second electrode, the second interconnect, the bonding agent, and the sealing agent to at least one intermediate temperature for at least one intermediate length of time, and then to a curing temperature, for a curing time, effective to bond and seal the first electrode to the first interconnect, wherein the at least one intermediate temperature is less than the curing temperature.

Abstract: A fuel cell stack comprises multiple fuel cell assemblies, wherein each fuel cell assembly includes a fuel cell comprising an anode layer and a cathode layer, and an electrolyte interposed between the anode layer and the cathode layer. The fuel cell assembly further comprises an anode interconnect and a cathode interconnect, wherein the anode interconnect may be firmly attached to the anode layer by means of a bonding agent and a sealing agent used to seal passages on the anode layer of each fuel cell.

Abstract: An electronically variable fiber optic attenuator is disclosed for adjustably extracting optical energy from a single, side-polished fiber optic, and therefore attenuating the optical signal being transmitted through the fiber optic. In one aspect, material is removed from a portion of the fiber optic, thereby exposing a surface through which optical energy can be extracted. A slab of material is positioned over the exposed surface of the fiber optic with a liquid overlay disposed therebetween. An actuator applies a force to the slab of material to deform or bend the slab of material into and out of the evanescent field of the fiber optic for extracting the optical energy.

Abstract: An optical amplifier with integrated optical waveguide, pump source and other, optional components for amplifying an input optical signal. The amplifier includes a circulator and an optical signal reflective surface disposed at an end opposite an optical signal input receiving end of the waveguide which enables an optical signal to pass through the waveguide a second time exposing the optical signal to further amplification. The disclosed amplifier offers cost advantages and a higher gain without sacrificing other performance characteristics.

Abstract: Electronic VHF/UHF power conversion circuitry is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which VHF/UHF power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of VHF/UHF power conversion circuits.

Abstract: Electronic power conversion circuitry, for frequencies not exceeding 30 MHz, is manufactured using the benefits of low temperature co-fired ceramic substrates to provide interconnection between the discrete components of the power conversion circuit, and integrate various non-semiconductor devices into the body of the low temperature co-fired ceramic structure, such as resistors, capacitors, inductors and transformers. Use of a low temperature co-fired ceramic structure as a substrate on and within which power conversion circuitry is formed allows selection of various conductive and resistive inks to precisely form interconnection circuitry and selected non-semiconductor components which improves the stability and reduces the cost of power conversion circuits.

Abstract: A ferromagnetic material (18,20) in ink or tape form is sinterable using a same firing profile as and has approximately the same thermal shrinkage characteristics as low-temperature-cofired-ceramic (LTCC) tape, and is chemically non-reactive therewith. The ferromagnetic material (18,20) is applied to the surfaces of LTCC tape sheets (12,14,16) to form desired elements such as cores for inductors (22) and transformers and magnetic shields. Ferromagnetic vertical interconnects (vias) (54) can be formed by punching holes (56) through tape sheets (46) and filling them with ferromagnetic ink. The tape sheets (12,14,16) and ferromagnetic elements (18,20) are laminated together and cofired to form an integral structure (10). Ferromagnetic and non-magnetic components (114) can be fabricated separately and inserted into cavities (104a,-106a,108a) in tape sheets (104,106,108) prior to cofiring.

Abstract: Ferrimagnetic structures formed of ferrimagnetic vias in a unitized multilayer microcircuit structure that is formed of a plurality of co-fired insulating layers.

Abstract: A ferromagnetic material (18,20) in ink or tape form is sinterable using a same firing profile as and has approximately the same thermal shrinkage characteristics as low-temperature-cofired-ceramic (LTCC) tape, and is chemically non-reactive therewith. The ferromagnetic material (18,20) is applied to the surfaces of LTCC tape sheets (12,14,16) to form desired elements such as cores for inductors (22) and transformers and magnetic shields. Ferromagnetic vertical interconnects (vias) (54) can be formed by punching holes (56) through tape sheets (46) and filling them with ferromagnetic ink. The tape sheets (12,14,16) and ferromagnetic elements (18,20) are laminated together and cofired to form an integral structure (10). Ferromagnetic and non-magnetic components (114) can be fabricated separately and inserted into cavities (104a, 106a,108a) in tape sheets (104,106,108) prior to cofiring.

Abstract: Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure.

Abstract: A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure including a dielectric via fill in a via formed in one of the insulating layers, a first conductive element overlying the dielectric via fill, and a second conductive element underlying said dielectric via fill. Each of the first and conductive elements comprises a conductive via fill or a conductive trace.