Patents by Inventor Andrew J. Ries

Andrew J. Ries has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180333586
    Abstract: Systems, devices and methods are disclosed that include an antenna for an implantable medical device, the antenna including a passageway extending through the antenna windings of the antenna, the passageway providing a pathway for an electrical connector providing at least one electrical connection between a power source and electronic circuitry included within the implantable medical device.
    Type: Application
    Filed: May 17, 2018
    Publication date: November 22, 2018
    Inventors: James R. WASSON, Mark E. HENSCHEL, Andrew J. RIES, Rachel M. DAY, Kris A. PETERSON
  • Patent number: 10040021
    Abstract: Frame structures, assemblies and methods for use in implantable medical devices. The frames may include one or more first polymeric portions and one or more second polymeric portions coupled to the one or more first polymeric portions. The one or more first polymeric portions may have a higher durometer than the one or more second polymeric portions. The one or more second polymeric portions may provide an interference fit between the one or more second polymeric portions and the housing and/or between the one or more second polymeric portions and one or more components disposed in the housing.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: August 7, 2018
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, SuPing Lyu, Catherine M. Asgian, David Engmark, Ananta Pandey, Todd Schaefer, Erik Scott, Joachim Hossick-Schott
  • Patent number: 9889310
    Abstract: An implantable medical device housing has an outer surface and an inner surface that defines an interior cavity. A wire is coupled to the housing outer surface. The wire wholly defines an open aperture for receiving a fixation member. The wire includes a first wire end, a second wire end, and an annular loop between the first and second ends. A cover extends over at least the first end and the second end of the wire.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: February 13, 2018
    Assignee: Medtronic, Inc.
    Inventors: Andrew J Ries, Richard P Nelson, Kamal Deep Mothilal
  • Patent number: 9802055
    Abstract: An implantable device system for delivering electrical stimulation pulses to a patient's body includes a pulse delivery device having a piezoelectric element that is enclosed by a housing and produces voltage signals delivered to the patient's body in response to receiving ultrasound energy. The pulse delivery device includes a circuit having a rate limiter configured to filter voltage signals produced by the piezoelectric element a rate faster than a maximum stimulation rate.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: October 31, 2017
    Assignee: Medtronic, Inc.
    Inventors: James D Reinke, Sarah A Audet, Andrew J Ries, Robert W Stadler, John D Wahlstrand, Zhongping Yang
  • Publication number: 20170281954
    Abstract: An implantable device system for delivering electrical stimulation pulses to a patient's body includes a pulse delivery device having a piezoelectric element that is enclosed by a housing and produces voltage signals delivered to the patient's body in response to receiving ultrasound energy. The pulse delivery device includes a circuit having a rate limiter configured to filter voltage signals produced by the piezoelectric element a rate faster than a maximum stimulation rate.
    Type: Application
    Filed: April 28, 2016
    Publication date: October 5, 2017
    Inventors: James D Reinke, Sarah A Audet, Andrew J Ries, Robert W Stadler, John D Wahlstrand, Zhongping Yang
  • Patent number: 9750950
    Abstract: Implantable medical device systems of the present disclosure may include a subcutaneous implantable cardioverter defibrillator (SICD) that is powered by a multi-cell power source that is connected to a transformer and power conversion circuitry to charge one or more relatively small, but powerful, high voltage capacitors to provide a relatively high discharge voltage. The SICD includes electrical isolation for the multi-cell power source to protect against cross-charging between the cells during the operational lifetime of the SICD.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: September 5, 2017
    Assignee: Medtronic, Inc.
    Inventors: John D Norton, Andrew J Ries, Randolph E Crutchfield
  • Publication number: 20170232261
    Abstract: An implantable medical device system is configured to deliver cardiac pacing by receiving a cardiac electrical signal by sensing circuitry of a first device via a plurality of sensing electrodes, identifying by a control module of the first device a first cardiac event from the cardiac electrical signal, setting a first pacing interval in response to identifying the first cardiac event, controlling a power transmitter of the first device to transmit power upon expiration of the first pacing interval, receiving the transmitted power by a power receiver of a second device; and delivering at least a portion of the received power to a patient's heart via a first pacing electrode pair of the second device coupled to the power receiver.
    Type: Application
    Filed: April 28, 2016
    Publication date: August 17, 2017
    Inventors: Robert W. Stadler, Zhongping Yang, Sarah A. Audet, James K. Carney, James D. Reinke, Andrew J. Ries, John D. Wahlstrand
  • Patent number: 9731138
    Abstract: An implantable medical device system is configured to deliver cardiac pacing by receiving a cardiac electrical signal by sensing circuitry of a first device via a plurality of sensing electrodes, identifying by a control module of the first device a first cardiac event from the cardiac electrical signal, setting a first pacing interval in response to identifying the first cardiac event, controlling a power transmitter of the first device to transmit power upon expiration of the first pacing interval, receiving the transmitted power by a power receiver of a second device; and delivering at least a portion of the received power to a patient's heart via a first pacing electrode pair of the second device coupled to the power receiver.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: August 15, 2017
    Assignee: Medtronic, Inc.
    Inventors: Robert W Stadler, Zhongping Yang, Sarah A Audet, James K Carney, James D Reinke, Andrew J Ries, John D Wahlstrand
  • Patent number: 9675808
    Abstract: An implantable medical device includes a housing forming an internal cavity, the housing defining a profile with a height and a width and further defining a thickness perpendicular to its profile. The thickness of the housing is shorter than both the height and the width of the profile of the housing. The implantable medical device further includes at least one battery within the internal cavity, at least one capacitor adjacent the battery within the internal cavity, the capacitor and the battery being located along a common plane within the internal cavity, and circuitry within the internal cavity. The circuitry extends over both the battery and the capacitor within the internal cavity such that the circuitry is in a stacked arrangement relative to the battery and the capacitor.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: June 13, 2017
    Assignee: Medtronic, Inc.
    Inventors: David B. Engmark, Andrew J. Ries, Todd H. Schaefer
  • Patent number: 9649500
    Abstract: A method for manufacturing a medical device housing includes deforming an inner surface of a shield member to produce a seam area along the inner surface. The shield member has an inner surface and an outer surface spaced apart by a shield thickness. A seam seals the inner surface seam area of the shield member to a second shield member. The shield member inner surface has a bend extending to an interior edge of the seam.
    Type: Grant
    Filed: April 21, 2014
    Date of Patent: May 16, 2017
    Assignee: Medtronic, Inc.
    Inventor: Andrew J. Ries
  • Publication number: 20170127543
    Abstract: Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.
    Type: Application
    Filed: October 21, 2016
    Publication date: May 4, 2017
    Inventors: John K. Day, Michael J. Nidelkoff, Kris A. Peterson, Andrew J. Ries, David A. Ruben, Craig L. Wiklund
  • Patent number: 9403022
    Abstract: An implantable medical device includes a housing; at least one module enclosed within the housing and configured to at least one of generate an electrical stimulation therapy for delivery to a patient or monitor a physiological parameter of the patient; one or more feedthroughs extending through the housing; a header assembly including one or more electrical connectors electrically coupled to the module via the feedthroughs; and a preformed gasket compressed between the housing and the header assembly forming a seal to electrically isolate the feedthroughs from an external environment.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: August 2, 2016
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, David B. Engmark, John E. Kast, Jean-Francois Fischer
  • Patent number: 9401562
    Abstract: An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including one or more traces extending through apertures in the connector shell. One or more conductive members, positioned along the connector bore, are electrically coupled to the traces. The sealing members are positioned between the conductive members.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: July 26, 2016
    Assignee: Medtronic, Inc.
    Inventors: Andrew J Ries, Jeffrey A Swanson, George A Patras
  • Patent number: 9362660
    Abstract: An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including one or more traces extending through apertures in the connector shell. One or more conductive members, positioned along the connector bore, are electrically coupled to the traces. The sealing members are positioned between the conductive members.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: June 7, 2016
    Assignee: Medtronic, Inc.
    Inventors: Andrew J Ries, Jeffrey A Swanson, George A Patras
  • Publication number: 20160067512
    Abstract: Implantable medical device systems of the present disclosure may include a subcutaneous implantable cardioverter defibrillator (SICD) that is powered by a multi-cell power source that is connected to a transformer and power conversion circuitry to charge one or more relatively small, but powerful, high voltage capacitors to provide a relatively high discharge voltage. The SICD includes electrical isolation for the multi-cell power source to protect against cross-charging between the cells during the operational lifetime of the SICD.
    Type: Application
    Filed: September 3, 2015
    Publication date: March 10, 2016
    Inventors: John D Norton, Andrew J. Ries, Randolph E Crutchfield
  • Publication number: 20160023012
    Abstract: An implantable medical device housing has an outer surface and an inner surface that defines an interior cavity. A wire is coupled to the housing outer surface. The wire wholly defines an open aperture for receiving a fixation member. The wire includes a first wire end, a second wire end, and an annular loop between the first and second ends. A cover extends over at least the first end and the second end of the wire.
    Type: Application
    Filed: July 23, 2014
    Publication date: January 28, 2016
    Inventors: Andrew J. Ries, Richard P. Nelson, Kamal Deep Mothilal
  • Publication number: 20160028181
    Abstract: An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including one or more traces extending through apertures in the connector shell. One or more conductive members, positioned along the connector bore, are electrically coupled to the traces. The sealing members are positioned between the conductive members.
    Type: Application
    Filed: April 23, 2015
    Publication date: January 28, 2016
    Inventors: Andrew J. Ries, Jeffrey A. Swanson, George A. Patras
  • Patent number: 9242108
    Abstract: Structures and methods relating to electrodes for incorporation into a feedthrough with a profile adapted for subcutaneous sensing of physiologic and cardiac signals. Electrode assemblies are adapted for integration with feedthroughs and provide reliable insulation from the implantable medical device housing. Various structures and manufacturing processes are implemented to provide a large sensing surface with a low profile. The subcutaneous sensing electrode assembly can provide a leadless sensing system and further enhances installation and follow-up procedures.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: January 26, 2016
    Assignee: Medtronic, Inc.
    Inventors: Eric John Wengreen, Andrew J. Ries, David J. Saltzman, Randy S. Roles, Scott J. Robinson, David B. Engmark, John Eric Lovins
  • Patent number: 9220902
    Abstract: An implantable medical device includes two conductive enclosures that are attached together, wherein the first enclosure contains electronics, and the second enclosure contains a power source. The second enclosure, all or a portion of which is located outside the first enclosure, includes an inner layer, an outer layer, and a header plate, all of which are configured to provide redundant sealing for the power source. The inner and outer layers, formed by separate metal sheets nested one within the other, are preferably in direct mechanical and electrical contact. The first sheet, which forms the inner layer, approximately conforms to a profile of the power source, located therein, and the second sheet, which forms the outer layer, conforms to a profile of the first sheet. An insulative housing, which contains connector contacts of the device, is directly secured to the first and second conductive enclosures, for example, by mounting brackets.
    Type: Grant
    Filed: February 13, 2014
    Date of Patent: December 29, 2015
    Assignee: Medtronic, Inc.
    Inventors: Andrew J Ries, Terrence J Snyder, Iryna M Levina, Robert A Munoz, Eric J Wengreen, John E Lovins
  • Publication number: 20150306402
    Abstract: An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including one or more traces extending through apertures in the connector shell. One or more conductive members, positioned along the connector bore, are electrically coupled to the traces. The sealing members are positioned between the conductive members.
    Type: Application
    Filed: April 23, 2015
    Publication date: October 29, 2015
    Inventors: Andrew J. Ries, Jeffrey A. Swanson, George A. Patras