Patents by Inventor Andrew J. Ries

Andrew J. Ries has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7769458
    Abstract: A connector assembly for detachably connecting an electrical lead to an implantable medical device for emitting electrical pulses is provided. One or more deflectable connector clips are positioned inside or partially inside a compact housing that is designed to deflect the connector clips in a partially loaded state so that insertion of the terminal pin of an electrical lead causes a minor deflection of the spring clip, but results in high retention force. The positioning of the connector clip in the housing in a partially loaded state results in a relatively flat force deflection curve. The one or more connector clips are preferably electrically conducting metal and may be formed into a U-shape. The connector clips are generally positioned to provide multiple contact points with an inserted terminal pin of a lead.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: August 3, 2010
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jay Lahti
  • Publication number: 20100185262
    Abstract: An implantable medical device having an optical sensor selects the function of modular opto-electronic assemblies included in the optical sensor. Each assembly is provided with at least one light emitting device and at least one light detecting device. A device controller coupled to the optical sensor controls the function of each the assemblies. The controller executes a sensor performance test and selects at least one of the plurality of assemblies to operate as a light emitting assembly in response to a result of the performance test.
    Type: Application
    Filed: January 21, 2010
    Publication date: July 22, 2010
    Inventors: Jonathan L. Kuhn, Jonathan P. Roberts, Andrew J. Ries, James D. Reinke, Jeffrey M. Jelen, Robert M. Ecker, Timothy J. Davis, Can Cinbis, Thomas A. Anderson
  • Publication number: 20100137929
    Abstract: An implantable medical device (IMD) may include at least two separate lead connection assemblies, each with electrical connectors for connecting implantable leads to the IMD. In some examples, a IMD may include a first therapy module configured to generate a first electrical stimulation therapy and a second therapy module configured to generate a second electrical stimulation therapy for delivery to the patient. The IMD may include a first lead connection assembly including a first electrical connector electrically coupled to the first therapy module and a second lead connection assembly including a second electrical connector electrically coupled to the second therapy module. In some examples, the first and second lead connection assemblies are distributed around the outer perimeter of the IMD housing.
    Type: Application
    Filed: October 30, 2009
    Publication date: June 3, 2010
    Applicant: Medtronic, Inc.
    Inventors: Robert W. Libbey, William T. Donofrio, John E. Burnes, Paul G. Krause, Michael K. Berquist, Olivier Blandin, Michael Hudziak, William L. Johnson, John E. Nicholson, George Patras, Andrew J. Ries, Jeffrey Swanson, Paul Vahle, Thomas J. Olson, William K. Wenger, Michael R. Klardie, Samira Tahvildari
  • Patent number: 7717754
    Abstract: An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including a one or more traces extending through the shell; one or more conductive members positioned along the connector bore and electrically coupled to the traces; and sealing members positioned between the conductive members.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: May 18, 2010
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, George Patras, Thomas J. Olson
  • Patent number: 7668597
    Abstract: A feedthrough array for use in an implantable medical device is provided including an insulator, a plurality of conductive feedthrough pins extending through the insulator, and a ferrule including a flange extending inwardly from a ferrule sidewall along at least a majority of a length of a first ferrule side. A capacitor is disposed over the insulator and conductively coupled to the ferrule flange.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: February 23, 2010
    Assignee: Medtronic, Inc.
    Inventors: David B. Engmark, Andrew J. Ries
  • Patent number: 7654843
    Abstract: A medical device connector assembly and fabrication method are provided wherein the connector assembly includes a core element, a plurality of conductive members positioned along the core element, and a plurality of sealing members positioned between the conductive members, the sealing members having an outer surface supported by the core element.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: February 2, 2010
    Assignee: Medtronic, Inc.
    Inventors: Thomas J. Olson, Andrew J. Ries, George Patras, John D. Longtin
  • Publication number: 20100010560
    Abstract: Methods and apparatuses are provided for an electrical device that employs a feedthrough including a hermetic seal that seals an interior region of the electrical device. The electrical device includes an electrical contact disposed within the interior region of the electrical device, and a wire terminal that includes an encircled portion that is encircled by the feedthrough, and a first end that electrically connects with said electrical contact. When the electrical device is constructed, the first end of the wire terminal is coated with a conductive metal that is more resistant to oxidation than the wire terminal. The first end of the wire terminal is secured to the electrical contact using a mechanical device such as a crimping connector or a spring connector.
    Type: Application
    Filed: March 4, 2009
    Publication date: January 14, 2010
    Applicant: Medtronic, Inc.
    Inventors: William J. Taylor, Lynn M. Seifried, William D. Wolf, Andrew J. Ries, John E. Kast
  • Patent number: 7647111
    Abstract: A connector assembly for detachably coupling a proximal end of a lead and an implantable medical device. The connector assembly includes a deflectable connector clip having a first arm, a second arm and a top portion extending between the first arm and the second arm. The first arm and the second arm detachably position the proximal end of the lead within the implantable medical device. A housing portion has a first deflection portion that deflects the connector clip from a first position corresponding to a first distance between the first arm and the second arm, to a second position corresponding to a second distance between the first arm and the second arm. Subsequent advancement of the lead through the first and second arms further deflects the connector clip from the second position to a third position, which transfers all of the spring force of the connector clip to the lead.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: January 12, 2010
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Robert L. Olson, John E. Kast, Jeffrey J. Clayton, Randy S. Roles
  • Publication number: 20090266573
    Abstract: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.
    Type: Application
    Filed: April 25, 2008
    Publication date: October 29, 2009
    Inventors: David B. Engmark, Gary M. Grose, Todd H. Schaefer, Thomas I. Ceballos, Andrew J. Ries
  • Patent number: 7601033
    Abstract: An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including a one or more traces extending through the shell; one or more conductive members positioned along the connector bore and electrically coupled to the traces; and sealing members positioned between the conductive members.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: October 13, 2009
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, George Patras, Thomas J. Olson
  • Publication number: 20090163974
    Abstract: Methods and apparatuses are provided for an electrical device that employs a feedthrough including a hermetic seal that seals an interior region of the electrical device. The electrical device includes an electrical contact disposed within the interior region of the electrical device, and a wire terminal that includes an encircled portion that is encircled by the feedthrough, and a first end that electrically connects with said electrical contact. When the electrical device is constructed, the first end of the wire terminal is coated with a conductive metal that is more resistant to oxidation than the wire terminal. The first end of the wire terminal is secured to the electrical contact using a mechanical device such as a crimping connector or a spring connector.
    Type: Application
    Filed: March 4, 2009
    Publication date: June 25, 2009
    Applicant: Medtronic, Inc.
    Inventors: William J. Taylor, Lynn M. Seifried, William D. Wolf, Andrew J. Ries, John E. Kast
  • Publication number: 20090156905
    Abstract: An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.
    Type: Application
    Filed: May 7, 2008
    Publication date: June 18, 2009
    Inventors: Andrew J. Ries, Jeffrey O. York, Stephen R. Belcher, Jeffrey M. Jelen
  • Patent number: 7537493
    Abstract: A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: May 26, 2009
    Assignee: Medtronics, Inc.
    Inventors: Andrew J. Ries, Jay K. Lahti, George Patras, John D. Longtin, Bryan J. Zart
  • Patent number: 7526339
    Abstract: IPG connector headers for implantable medical devices are provided. In one embodiment of the invention, an IPG connector header having a header bore for receiving and making electrical connection to a lead connector assembly of an implantable medical device comprises a non-conductive header base and a plurality of electrically conductive header connector elements disposed within the header base. A plurality of electrically insulative fluid seals are interposed between the header connector elements. Each fluid seal has a fluid seal bore and is formed from an elastomeric material and an additive. The additive is formulated to reduce the frictional forces required to insert the lead connector assembly through the fluid seal bores of the fluid seals.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: April 28, 2009
    Assignee: Medtronic, Inc.
    Inventors: Jay K. Lahti, Andrew J. Ries, Hui J. Jin, David G Schaenzer
  • Publication number: 20090017700
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Application
    Filed: September 24, 2008
    Publication date: January 15, 2009
    Applicant: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Patent number: 7472505
    Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: January 6, 2009
    Assignee: Medtronic, Inc.
    Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
  • Publication number: 20080319503
    Abstract: An implantable medical device system includes a medical electrical lead having a connector assembly and a connector bore for receiving the lead connector assembly. The lead includes a distal portion having a first outer diameter and a distal sealing member, an intermediate portion having a second outer diameter smaller than the first outer diameter, and a connector pin extending from the intermediate portion, the connector pin having an outer diameter corresponding to a DF-1 standard.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 25, 2008
    Inventors: Jordon D. Honeck, Andrew J. Ries, Karel F.A.A. Smits
  • Publication number: 20080268720
    Abstract: A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.
    Type: Application
    Filed: July 11, 2008
    Publication date: October 30, 2008
    Inventors: ANDREW J. RIES, JAY K. LAHTI, GEORGE PATRAS, JOHN D. LONGTIN, BRYAN J. ZART
  • Patent number: 7413482
    Abstract: A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: August 19, 2008
    Assignee: Medtronic, Inc.
    Inventors: Andrew J. Ries, Jay K. Lahti, George Patras, John D. Longtin, Bryan J. Zart
  • Publication number: 20080139053
    Abstract: An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including a one or more traces extending through the shell; one or more conductive members positioned along the connector bore and electrically coupled to the traces; and sealing members positioned between the conductive members.
    Type: Application
    Filed: December 7, 2006
    Publication date: June 12, 2008
    Inventors: Andrew J. Ries, George patras, Thomas J. Olson