Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together though at least one other interconnect level.

Abstract: A method and an apparatus for wireless communication are provided. The apparatus having a first latch having a first latch input and first latch output and a second latch having a second latch input, a second latch scan output, and a second latch data output. The second latch input is coupled to the first latch output. The apparatus further includes a selection component configured to select between a data input and a scan input based on a shift input. The selection component is coupled to the first latch input. The selection component includes a first NAND-gate, a second NAND-gate, and an OR-gate.

Abstract: A MOS device includes a first latch configured with one latch feedback F and configured to receive a latch input I and a latch clock C. The first latch is configured to output Q, where the output Q is a function of CF, IF, and IC, and the latch feedback F is a function of the output Q. The first latch may include a first set of transistors stacked in series in which the first set of transistors includes at least five transistors. The MOS device may further include a second latch coupled to the first latch. The second latch may be configured as a latch in a scan mode and as a pulse latch in a functional mode. The first latch may operate as a master latch and the second latch may operate as a slave latch during the scan mode.

Abstract: A CGC includes an enable module and a latch module. The enable module has an enable module input and an enable module output. The latch module has latch module inputs and a latch module output. The latch module inputs include a latch module clock input for receiving a clock and a latch module enable input for receiving the enable module output. The latch module enable input is coupled to the enable module output. The latch module is configured to enable and to disable the clock via the latch module output based on the enable module input. The latch module includes an internal enable node that is the latch module output. The latch module is configured to cause the internal enable node to transition from low to high as a function of the enable module output and ?C, where E is the internal enable node and C is the clock.

Abstract: A pulse generator includes a latch module for storing first/second states, a pulse clock module for generating a clock pulse, and a delay module for delaying the clock pulse at a second latch-module input. The latch module has a first latch-module input coupled to a clock, the second latch-module input, and a latch-module output. The pulse clock module has a first pulse-clock-module input coupled to the clock, a second pulse-clock-module input coupled to the latch-module output, and a pulse-clock-module output. The delay module is coupled between the latch-module output and second pulse-clock-module input or between the pulse-clock-module output and second latch-module input. The delay module provides functionally I1IA at a delay module output, where I1 is a function of I and IA is a function of IN0 and B0, and where I is a delay module input, B0 is a first input bit, and IN0 is a first net input.

Abstract: A MOS device includes a first latch configured with one latch feedback F and configured to receive a latch input I and a latch clock C. The first latch is configured to output Q, where the output Q is a function of CF, IF, and IC, and the latch feedback F is a function of the output Q. The first latch may include a first set of transistors stacked in series in which the first set of transistors includes at least five transistors. The MOS device may further include a second latch coupled to the first latch. The second latch may be configured as a latch in a scan mode and as a pulse latch in a functional mode. The first latch may operate as a master latch and the second latch may operate as a slave latch during the scan mode.

Abstract: A pulse generator includes a latch module for storing first/second states, a pulse clock module for generating a clock pulse, and a delay module for delaying the clock pulse at a second latch-module input. The latch module has a first latch-module input coupled to a clock, the second latch-module input, and a latch-module output. The pulse clock module has a first pulse-clock-module input coupled to the clock, a second pulse-clock-module input coupled to the latch-module output, and a pulse-clock-module output. The delay module is coupled between the latch-module output and second pulse-clock-module input or between the pulse-clock-module output and second latch-module input. The delay module provides functionally I1IA at a delay module output, where I1 is a function of I and IA is a function of IN0 and B0, and where I is a delay module input, B0 is a first input bit, and IN0 is a first net input.

Abstract: At least one critical path is determined of a plurality of paths in a network of logic elements. In addition, a plurality of original cells is determined in a critical path of the at least one critical path. Each intermediate output of the plurality of original cells is unconnected to any input external to the plurality of original cells. The plurality of original cells performs a particular logic function. Furthermore, the plurality of original cells are replaced with at least one replacement cell that performs the particular logic function. A number of cells of the at least one replacement cell is less than a number of cells of the plurality of original cells. The plurality of paths may be between a first memory stage and a second memory stage, and each of the at least one critical path may have a delay greater than a delay threshold.

Abstract: A CGC includes an enable module and a latch module. The enable module has an enable module input and an enable module output. The latch module has latch module inputs and a latch module output. The latch module inputs include a latch module clock input for receiving a clock and a latch module enable input for receiving the enable module output. The latch module enable input is coupled to the enable module output. The latch module is configured to enable and to disable the clock via the latch module output based on the enable module input. The latch module includes an internal enable node that is the latch module output. The latch module is configured to cause the internal enable node to transition from low to high as a function of the enable module output and ?C, where E is the internal enable node and C is the clock.

Abstract: In one embodiment, a method for signal delay in a scan path comprises, in a scan mode, delaying a scan signal in the scan path by propagating the scan signal through a plurality of delay devices coupled in series, wherein a first one of the delay devices is powered by a first voltage, a second one of the delay devices is powered by a second voltage, and the second voltage is greater than the first voltage. The method also comprises, in a functional mode, disabling the delay devices.

Abstract: A transistor cell is provided that includes a dummy gate overlaying a continuous oxide definition (OD) region. A first portion of the OD region adjacent a first side of the dummy forms the drain. The cell includes a local interconnect structure that couples the dummy gate and a portion of the OD region adjacent a second opposing side of the dummy gate to a source voltage.

Abstract: A CMOS device including a standard cell includes first and second transistors with a gate between the first and second transistors. One active region extends between the first and second transistors and under the gate. In a first configuration, when drains/sources of the first and second transistors on the sides of the gate carry the same signal, the drains/sources are connected together and to the gate. In a second configuration, when a source of the first transistor on a side of the gate is connected to a source voltage and a drain/source of the second transistor on the other side of the gate carries a signal, the source of the first transistor is connected to the gate. In a third configuration, when sources of the first and second transistors on the sides of the gate are connected to a source voltage, the gate floats.

Abstract: A transistor cell is provided that includes a dummy gate overlaying a continuous oxide definition (OD) region. A first portion of the OD region adjacent a first side of the dummy forms the drain. The cell includes a local interconnect structure that couples the dummy gate and a portion of the OD region adjacent a second opposing side of the dummy gate to a source voltage.

Abstract: A CMOS device including a standard cell includes first and second transistors with a gate between the first and second transistors. One active region extends between the first and second transistors and under the gate. In a first configuration, when drains/sources of the first and second transistors on the sides of the gate carry the same signal, the drains/sources are connected together and to the gate. In a second configuration, when a source of the first transistor on a side of the gate is connected to a source voltage and a drain/source of the second transistor on the other side of the gate carries a signal, the source of the first transistor is connected to the gate. In a third configuration, when sources of the first and second transistors on the sides of the gate are connected to a source voltage, the gate floats.

Abstract: Techniques for fixing hold violations using metal-programmable cells are described herein. In one embodiment, a system comprises a first flip-flop, a second flip-flop, and a data path between the first and second flip-flops. The system further comprises a metal-programmable cell connected to the data path, wherein the metal-programmable cell is programmed to implement at least one capacitor to add a capacitive load to the data path. The capacitive load adds delay to the data path that prevents a hold violation at one of the first and second flip-flops.

Abstract: A standard cell CMOS device includes a first power rail extending across the standard cell. The first power rail is connected to one of a first voltage or a second voltage less than the first voltage. The device further includes a second power rail extending across the standard cell. The second power rail is connected to an other one of the first voltage or the second voltage. The second power rail includes a metal x layer interconnect and a set of metal x?1 layer interconnects connected to the metal x layer interconnect. The device further includes a set of CMOS transistor devices between the first and second power rails and powered by the first and second power rails. The device further includes an x?1 layer interconnect extending under and orthogonal to the second power rail. The x?1 layer interconnect is coupled to the set of CMOS transistor devices.

Abstract: Techniques for reducing scan overhead in a scannable flop tray are described herein. In one embodiment, a scan circuit for a flop tray comprises a tri-state circuit configured to invert an input data signal and output the inverted data signal to an input of a flip-flop of the flop tray in a normal mode, and to block the data signal from the input of the flip-flop in a scan mode. The scan circuit also comprises a pass gate configured to pass a scan signal to the input of the flip-flop in the scan mode, and to block the scan signal from the input of the flip-flop in the normal mode.

Abstract: Techniques for resolving a metastable state in a synchronizer are described herein. In one embodiment, a circuit for resolving a metastable state in a synchronizer comprises a signal delay circuit coupled to a node of the synchronizer, wherein the signal delay circuit is configured to delay a data signal at the node to produce a delayed data signal, and a transmission circuit coupled to the signal delay circuit, wherein the transmission circuit is configured to couple the delayed data signal to the node after a delay from a first edge of a clock signal.

Abstract: A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together though at least one other interconnect level.

Abstract: A CMOS device with a plurality of PMOS transistors each having a PMOS drain and a plurality of NMOS transistors each having an NMOS drain includes a first interconnect on an interconnect level extending in a length direction to connect the PMOS drains together. A second interconnect on the interconnect level extends in the length direction to connect the NMOS drains together. A set of interconnects on at least one additional interconnect level couple the first interconnect and the second interconnect together. A third interconnect on the interconnect level extends perpendicular to the length direction and is offset from the set of interconnects to connect the first interconnect and the second interconnect together.