Patents by Inventor António José Marques Trindade
António José Marques Trindade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10832934Abstract: A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. Each sacrificial portion is exposed through an opening. A micro-device is disposed on each sacrificial portion and laterally attached to an anchor by a multi-layer tether. In certain embodiments, a micro-device structure is constructed by providing the source substrate, disposing micro-devices on each sacrificial portion, depositing a first tether layer over at least a portion of the source substrate and the micro-device, depositing a second tether layer over the first tether layer, and patterning the first tether layer and the second tether layer to form (i) a multi-layer tether for each of the micro-devices such that the multi-layer tether laterally attaches the micro-device to one of the anchors, and (ii) an opening exposing each of the sacrificial portions.Type: GrantFiled: June 14, 2018Date of Patent: November 10, 2020Assignee: X Display Company Technology LimitedInventors: António José Marques Trindade, Christopher Andrew Bower
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Publication number: 20200339414Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.Type: ApplicationFiled: April 7, 2020Publication date: October 29, 2020Inventors: Raja Fazan Gul, Ronald S. Cok, Steven Kelleher, António José Marques Trindade, Alin Mihai Fecioru, David Gomez, Christopher Andrew Bower, Salvatore Bonafede, Matthew Alexander Meitl
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Patent number: 10790173Abstract: A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.Type: GrantFiled: December 3, 2018Date of Patent: September 29, 2020Assignee: X Display Company Technology LimitedInventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
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Publication number: 20200286747Abstract: A component source wafer comprises printable components having adhesive disposed on a backside of the printable components. A wafer substrate comprises a sacrificial layer having recessed portions and anchors. A component is disposed entirely over each recessed portion. A tether physically connects each component to at least one of the anchors. A layer of adhesive is disposed on a side of the component adjacent to the recessed portion. Each component is suspended over the wafer substrate and the recessed portion defines a gap separating the component from the wafer substrate.Type: ApplicationFiled: March 3, 2020Publication date: September 10, 2020Inventors: António José Marques Trindade, Raja Fazan Gul, Ronald S. Cok
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Publication number: 20200177149Abstract: A method of making a micro-module structure comprises providing a substrate, the substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.Type: ApplicationFiled: December 3, 2018Publication date: June 4, 2020Inventors: António José Marques Trindade, Raja Fazan Gul, Robert R. Rotzoll, Alexandre Chikhaoui, David Gomez, Ronald S. Cok
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Publication number: 20200176285Abstract: A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.Type: ApplicationFiled: December 3, 2018Publication date: June 4, 2020Inventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
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Publication number: 20200176286Abstract: A module structure comprises a patterned substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post. The component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.Type: ApplicationFiled: December 3, 2018Publication date: June 4, 2020Inventors: Robert R. Rotzoll, António José Marques Trindade, Raja Fazan Gul, Alexandre Chikhaoui, David Gomez, Ronald S. Cok
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Publication number: 20200176670Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: ApplicationFiled: December 3, 2018Publication date: June 4, 2020Inventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
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Publication number: 20200176671Abstract: A cavity structure comprises a cavity substrate comprising a substrate surface, one or more cavity walls extending from the substrate surface, a cap disposed on the one or more cavity walls, and at least a portion of a module tether physically attached to the cavity substrate. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume, for example enclosing a vacuum, air, an added gas, or a liquid. The cavity structure can be a micro-transfer printable structure provided on a cavity structure source wafer. A plurality of cavity structures can be disposed on a destination substrate, for example by transfer printing, dry contact printing, or micro-transfer printing.Type: ApplicationFiled: March 8, 2019Publication date: June 4, 2020Inventors: Ronald S. Cok, António José Marques Trindade, Raja Fazan Gul, Robert R. Rotzoll, Alexandre Chikhaoui
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Patent number: 10600671Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: GrantFiled: July 3, 2019Date of Patent: March 24, 2020Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
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Publication number: 20190385886Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: ApplicationFiled: August 19, 2019Publication date: December 19, 2019Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
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Publication number: 20190385885Abstract: A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. Each sacrificial portion is exposed through an opening. A micro-device is disposed on each sacrificial portion and laterally attached to an anchor by a multi-layer tether. In certain embodiments, a micro-device structure is constructed by providing the source substrate, disposing micro-devices on each sacrificial portion, depositing a first tether layer over at least a portion of the source substrate and the micro-device, depositing a second tether layer over the first tether layer, and patterning the first tether layer and the second tether layer to form (i) a multi-layer tether for each of the micro-devices such that the multi-layer tether laterally attaches the micro-device to one of the anchors, and (ii) an opening exposing each of the sacrificial portions.Type: ApplicationFiled: June 14, 2018Publication date: December 19, 2019Inventor: António José Marques Trindade
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Publication number: 20190326149Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: ApplicationFiled: July 3, 2019Publication date: October 24, 2019Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
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Patent number: 10431487Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: GrantFiled: November 15, 2018Date of Patent: October 1, 2019Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
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Patent number: 10395966Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: GrantFiled: April 3, 2018Date of Patent: August 27, 2019Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
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Publication number: 20190088526Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: ApplicationFiled: November 15, 2018Publication date: March 21, 2019Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
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Patent number: 10224231Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: GrantFiled: November 14, 2017Date of Patent: March 5, 2019Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
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Publication number: 20180323178Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.Type: ApplicationFiled: July 18, 2018Publication date: November 8, 2018Inventors: Matthew Meitl, Brook Raymond, Ronald S. Cok, Christopher Andrew Bower, Salvatore Bonafede, Erich Radauscher, Carl Ray Prevatte, Jr., António José Marques Trindade, Tanya Yvette Moore
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Publication number: 20180286734Abstract: A method of micro-transfer printing a micro-device from a support substrate comprises providing the micro-device, forming a pocket in or on the support substrate, providing a release layer over the micro-device or the pocket, optionally providing a base layer on a side of the release layer opposite the micro-device, disposing the micro-device in the pocket with the release layer between the micro-device and the support substrate so that no portion of the support substrate or the optional base layer is in contact with the micro-device, etching the release layer to completely separate the micro-device from the support substrate or the optional base layer, providing a stamp having a conformable stamp post and pressing the stamp post against the separated micro-device to adhere the micro-device to the stamp post, and removing the stamp and micro-device from the support substrate.Type: ApplicationFiled: March 27, 2018Publication date: October 4, 2018Inventors: Matthew Meitl, Brook Raymond, Ronald S. Cok, Christopher Andrew Bower, Salvatore Bonafede, Erich Radauscher, Carl Ray Prevatte, JR., António José Marques Trindade, Tanya Yvette Moore
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Publication number: 20180226287Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: ApplicationFiled: April 3, 2018Publication date: August 9, 2018Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte