Abstract: A multi-LED component comprises a component substrate comprising a common electrode, a first electrode, a second electrode, a plurality of first LEDs, and a plurality of second LEDs all disposed on the component substrate. Each first LED and each second LED comprises first and second LED contacts for providing power to each corresponding LED to cause the LED to emit light. The first LED contact of each first LED and each second LED is electrically connected to the common electrode. The second LED contacts of the first LEDs are electrically connected to the first electrode. The second LED contacts of the second LEDs are electrically connected to the second electrode so that the first LEDs are electrically connected in parallel and the second LEDs are electrically connected in parallel.

Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

Abstract: A multi-LED component comprises a component substrate comprising a common electrode, a first electrode, a second electrode, a plurality of first LEDs, and a plurality of second LEDs all disposed on the component substrate. Each first LED and each second LED comprises first and second LED contacts for providing power to each corresponding LED to cause the LED to emit light. The first LED contact of each first LED and each second LED is electrically connected to the common electrode. The second LED contacts of the first LEDs are electrically connected to the first electrode. The second LED contacts of the second LEDs are electrically connected to the second electrode so that the first LEDs are electrically connected in parallel and the second LEDs are electrically connected in parallel.

Abstract: A repairable matrix-addressed system includes a system substrate, an array of electrically conductive row lines, and an array of electrically conductive column lines disposed over the system substrate. The row lines extend over the system substrate in a row direction and the column lines extend over the system substrate in a column direction different from the row direction to define an array of non-electrically conductive intersections between the row lines and the column lines. An array of electrically conductive line segments is disposed over the system substrate. The line segments extend over the system substrate substantially parallel to the row direction and have a line segment length that is less than the distance between adjacent column lines. Each line segment is electrically connected to a column line. One or more devices are electrically connected to each row line and to each line segment adjacent to the row line.

Abstract: A repairable matrix-addressed system includes a system substrate, an array of electrically conductive row lines, and an array of electrically conductive column lines disposed over the system substrate. The row lines extend over the system substrate in a row direction and the column lines extend over the system substrate in a column direction different from the row direction to define an array of non-electrically conductive intersections between the row lines and the column lines. An array of electrically conductive line segments is disposed over the system substrate. The line segments extend over the system substrate substantially parallel to the row direction and have a line segment length that is less than the distance between adjacent column lines. Each line segment is electrically connected to a column line. One or more devices are electrically connected to each row line and to each line segment adjacent to the row line.