Abstract: Systems and methods are provided for obtaining and using nonvolatile memory (“NVM”) health information. Health information can include a variety of information associated with the performance and reliability of portions of an NVM device, such as the number of errors detected in a portion of NVM or the amount of time required to read from or program a portion of nonvolatile memory. During operation, address specific health information may be stored passively on a host device and provided as part of a command to a memory controller. The memory controller may extract the health information from the command and use the information to execute access requests. After an access request is completed, the memory controller can update the health information and transmit the information back to the host device.

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract: Systems and methods are provided for stacked semiconductor memory devices. The stacked semiconductor memory devices can include a nonvolatile memory controller, a number of nonvolatile memory dies arranged in a stacked configuration, and a package substrate. The memory controller and the memory dies can be coupled to each other with vias that extend through the package substrate. A vertical interconnect process may be used to electrically connect the nonvolatile memory dies to each other, as well as other system components. The memory controller may be flip-chip bonded to external circuitry, such as another semiconductor device or a printed circuit board.

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract: System and methods for proactively refreshing portions of a nonvolatile memory including a memory system that proactively refreshes a portion of nonvolatile memory based on data associated with the portion. The data may include the time elapsed since the portion was last refreshed, the number of times the portion has been cycled, and the average operating temperature of the nonvolatile memory. A portion of nonvolatile memory, when meeting certain criteria determined from the data, may be proactively refreshed during a downtime when the nonvolatile memory is not otherwise being accessed.

Abstract: Systems and methods for nonvolatile memory (“NVM”) performance throttling are disclosed. Performance of an NVM system may be throttled to achieve particular data retention requirements. In particular, because higher storage temperatures tend to reduce the amount of time that data may be reliably stored in an NVM system, performance of the NVM system may be throttled to reduce system temperatures and increase data retention time.

Abstract: A nonvolatile memory (“NVM”) buffer is incorporated into an NVM system between a volatile memory buffer and an NVM to decrease the size of the volatile memory buffer and organize data for programming to the NVM. Heterogeneous data paths may be are used for write and read operations such that the nonvolatile memory buffer is used only in certain situations.

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract: Systems and methods are provided for improved communications in a nonvolatile memory (“NVM”) system. The system can toggle between multiple communications channels to provide point-to-point communications between a host device and NVM dies included in the system. The host device can toggle between multiple communications channels that extend to one or more memory controllers of the system, and the memory controllers can toggle between multiple communications channels that extend to the NVM dies. Power islands may be incorporated into the system to electrically isolate system components associated with inactive communications channels.

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract: This document generally describes systems, devices, methods, and techniques for obtaining debug information from a memory device. Debug information can include a variety of information associated with a memory device that can be used for debugging the device, such as a sequence of operations performed by the memory device and information regarding errors that have occurred (e.g., type of error, component of memory device associated with error). A memory device can be instructed by a host to obtain and provide debug information to the host. A memory device can be configured to obtain particular debug information using a variety of features, such as triggers. For instance, a memory device can use a trigger to collect debug information related to failed erase operations.

Abstract: In one implementation, a memory subsystem includes non-volatile memory, a memory controller that is communicatively connected to the non-volatile memory over a first bus, a host interface through which the memory controller communicates with a host controller over a second bus, and a joint test action group (JTAG) interface that provides the host controller with access to state information associated with the memory controller. The memory subsystem can be configured to be coupled to a board-level memory device that includes the host controller.

Abstract: Systems and methods are provided for stacked semiconductor memory devices. The stacked semiconductor memory devices can include a nonvolatile memory controller, a number of nonvolatile memory dies arranged in a stacked configuration, and a package substrate. The memory controller and the memory dies can be coupled to each other with vias that extend through the package substrate. A vertical interconnect process may be used to electrically connect the nonvolatile memory dies to each other, as well as other system components. The memory controller may be flip-chip bonded to external circuitry, such as another semiconductor device or a printed circuit board.

Abstract: Systems and methods for providing early hinting to nonvolatile memory charge pumps are disclosed. Charge pumps associated with one or more nonvolatile memory dies can be proactively activated based on a determination that a command queue of access requests contains at least a threshold number of consecutive access requests of the same type. Based on analysis of the command queue, the memory controller can transmit an early hint command to a nonvolatile memory die to proactively activate its charge pump to provide a voltage suitable for executing the consecutive access requests of the same type.

Abstract: The disclosed architecture uses address mapping to map a block address on a host interface to an internal block address of a non-volatile memory (NVM) device. The block address is mapped to an internal chip select for selecting a Concurrently Addressable Unit (CAU) identified by the block address. The disclosed architecture supports generic NVM commands for read, write, erase and get status operations. The architecture also supports an extended command set for supporting read and write operations that leverage a multiple CAU architecture.

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract: Memory systems and methods for creating the same are disclosed. The memory systems can include pairs of IC packages mounted on either side of a system substrate. Contacts formed on the IC packages can be communicatively coupled with contacts of a paired IC package using vias that extend through the system substrate. The IC packages can further communicate with a controller mounted on one side of the system substrate using the vias as well as conductive traces formed in the system substrate.