Patents by Inventor Anton Leidl

Anton Leidl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190375630
    Abstract: A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.
    Type: Application
    Filed: June 6, 2019
    Publication date: December 12, 2019
    Inventors: Klaus Mayer, Christian Siegel, Anton Leidl, Wolfgang Pahl, Stefan Stufler
  • Patent number: 10142729
    Abstract: A microphone and a method for operating a Microphone are disclosed. In an embodiment the microphone includes a transducer and a mode controller. The microphone has a normal operating mode (MO) and a collapse mode (M1). The mode controller switches to the collapse mode (M1) when an output signal of the transducer reaches or exceeds a predefined threshold value and switches to the normal operating mode (MO) when the output signal reaches or falls below a predefined further threshold value (S1).
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: November 27, 2018
    Assignee: TDK CORPORATION
    Inventors: Jan Tue Ravnkilde, Christian Siegel, Matthias Jungkunz, Gino Rocca, Ivan Riis Nielsen, Anton Leidl, Pirmin Hermann Otto Rombach
  • Patent number: 10136226
    Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: November 20, 2018
    Assignee: TDK CORPORATION
    Inventors: Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach, Wolfgang Pahl, Anton Leidl, Armin Schober, Jürgen Portmann
  • Publication number: 20180269843
    Abstract: An integrated circuit, a circuit assembly and a method for operation the integrated circuit are disclosed. In embodiments the integrated circuit includes at least one supply voltage terminal configured to receive a supply voltage for operation the integrated circuit, at least one input terminal configured to receive an analog input signal corresponding to an audio signal, at least one output terminal configured to provide an analog output signal and a signal strength detector configured to detect a signal strength of the analog input signal provided at the at least one input terminal, wherein the integrated circuit is configured to amplify an audio signal based on the detected signal strength and to output a corresponding amplified signal at the at least one output terminal, wherein the integrated circuit comprises a signaling circuit configured to indicate an amplification setting of the integrated circuit at the at least one supply voltage terminal.
    Type: Application
    Filed: September 7, 2015
    Publication date: September 20, 2018
    Inventors: Pirmin Hermann Otto Rombach, Gino Rocca, Anton Leidl, Armin Schober
  • Publication number: 20180262173
    Abstract: An integrated circuit, a circuit assembly and a method for operation the integrated circuit are disclosed. In embodiments an integrated circuit includes at least one supply voltage terminal configured to receive a supply voltage for operation of the integrated circuit, at least one input terminal configured to receive an analog input signal corresponding to an audio signal, at least one output terminal configured to provide an analog output signal, a signal strength detector configured to detect a signal strength of the analog input signal provided at the at least one input terminal and a signaling circuit configured to indicate an amplification setting of the integrated circuit at the at least one output terminal, wherein the integrated circuit is configured to amplify the audio signal based on the detected signal strength and to output a corresponding amplified signal at the at least one output terminal.
    Type: Application
    Filed: May 11, 2018
    Publication date: September 13, 2018
    Inventors: Pirmin Hermann Otto Rombach, Gino Rocca, Anton Leidl, Armin Schober
  • Publication number: 20180244515
    Abstract: A MEMS device comprises a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.
    Type: Application
    Filed: September 30, 2015
    Publication date: August 30, 2018
    Inventors: Pirmin Hermann Otto Rombach, Kurt Rasmussen, Anton Leidl, Wolfgang Pahl, Dennis Mortensen
  • Publication number: 20170150253
    Abstract: A microphone and a method for operating a Microphone are disclosed. In an embodiment the microphone includes a transducer and a mode controller. The microphone has a normal operating mode (MO) and a collapse mode (M1). The mode controller switches to the collapse mode (M1) when an output signal of the transducer reaches or exceeds a predefined threshold value and switches to the normal operating mode (MO) when the output signal reaches or falls below a predefined further threshold value (S1).
    Type: Application
    Filed: May 20, 2014
    Publication date: May 25, 2017
    Inventors: Jan Tue Ravnkilde, Christian Siegel, Matthias Jungkunz, Gino Rocca, Ivan Riis Nielsen, Anton Leidl, Pirmin Hermann Otto Rombach
  • Patent number: 9278854
    Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: March 8, 2016
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Anton Leidl, Jürgen Portmann, Robert Eichinger, Christian Siegel, Karl Nicolaus, Thomas Wassner, Thomas Sedlmeier
  • Publication number: 20150326979
    Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.
    Type: Application
    Filed: December 18, 2012
    Publication date: November 12, 2015
    Inventors: Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach, Wolfgang Pahl, Anton Leidl, Armin Schober, Jürgen Portmann
  • Patent number: 9061888
    Abstract: Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: June 23, 2015
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Gregor Feiertag, Anton Leidl
  • Patent number: 9056760
    Abstract: The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: June 16, 2015
    Assignee: Epcos AG
    Inventors: Gregor Feiertag, Hans Krueger, Wolfgang Pahl, Anton Leidl
  • Publication number: 20150056725
    Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.
    Type: Application
    Filed: February 8, 2013
    Publication date: February 26, 2015
    Inventors: Wolfgang Pahl, Anton Leidl, Jürgen Portmann, Robert Eichinger, Christian Siegel, Karl Nicolaus, Thomas Wassner, Thomas Sedlmeier
  • Patent number: 8865499
    Abstract: The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: October 21, 2014
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Hans Krueger, Gregor Feiertag, Alois Stelzl, Anton Leidl, Stefan Seitz
  • Patent number: 8713789
    Abstract: A method of manufacturing a microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: May 6, 2014
    Assignee: Epcos AG
    Inventors: Anton Leidl, Wolfgang Pahl
  • Patent number: 8674464
    Abstract: A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: March 18, 2014
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Gregor Feiertag, Anton Leidl
  • Patent number: 8624466
    Abstract: A component (1) is proposed wherein the suspension of the component (1) is effected in a stress-reduced manner. The component (1) can rest on a membrane (4) or be held by a spring element (2). The membrane (4) or the spring element (2) is situated above a depression (6) or an opening (7) partially spanned by the membrane (4). Preferably, the membrane (4) has a modulus of elasticity that is less than or equal to the modulus of elasticity of the component (1) or of the substrate (3). The component (1) can be covered with metal electrodes (10) wholly or partially over the area on two sides.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: January 7, 2014
    Assignee: Epcos AG
    Inventors: Ansgar Schäufele, Anton Leidl, Wolfgang Sauer
  • Patent number: 8611566
    Abstract: A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: December 17, 2013
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Anton Leidl, Matthias Jungkunz, Andreas Beer
  • Publication number: 20130328448
    Abstract: A piezo actuator with protection against environmental influences comprises a layer stack (1) of piezoelectric material layers (10) and interposed electrode layers (20). The piezo actuator furthermore comprises a first and a second material layer (31, 32) composed in each case of a material which exhibits smaller amount of expansion. than the piezoelectric material layers (10) when a voltage is applied. to the electrode layers (20), and comprises a cover layer (50) composed of a metal material. The layer stack (1) is arranged between the first and second material layers (31, 32). The cover layer (50) surrounds the layer stack (1) and is sputtered onto the first and second material lavers (31, 32).
    Type: Application
    Filed: November 30, 2011
    Publication date: December 12, 2013
    Applicant: EPCOS AG
    Inventors: Reinhard Gabl, Wolfgang Pahl, Anton Leidl
  • Patent number: 8580613
    Abstract: On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: November 12, 2013
    Assignee: Epcos AG
    Inventors: Gregor Feiertag, Hans Krueger, Anton Leidl, Alois Stelzl
  • Patent number: 8582788
    Abstract: A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: November 12, 2013
    Assignee: EPCOS AG
    Inventors: Anton Leidl, Wolfgang Pahl, Ulrich Wolff