Abstract: A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

Abstract: A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.

Abstract: An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier.

Abstract: A component (1) is proposed wherein the suspension of the component (1) is effected in a stress-reduced manner. The component (1) can rest on a membrane (4) or be held by a spring element (2). The membrane (4) or the spring element (2) is situated above a depression (6) or an opening (7) partially spanned by the membrane (4). Preferably, the membrane (4) has a modulus of elasticity that is less than or equal to the modulus of elasticity of the component (1) or of the substrate (3). The component (1) can be covered with metal electrodes (10) wholly or partially over the area on two sides.

Abstract: A rotating motion sensor includes at least one electroacoustic resonator to stimulate a surface acoustic wave. The at least one electroacoustic resonator is configured so that rotation of the at least one electroacoustic resonator about an axis of rotation causes a change in resonance frequency of the at least one electroacoustic resonator. The at least one electroacoustic resonator includes oscillating structures configured to oscillate in a first direction that is a direction of propagation of the surface acoustic wave and/or a second direction that is transverse to the direction of propagation of the surface acoustic wave.

Abstract: Elements and methods for forming elements that operate with acoustic waves are disclosed. The element includes a piezoelectric electric substrate that has a first thermal coefficient of expansion, electrically conducting element structures on an upper side of the substrate, a compensation layer on an underside of the substrate, and an SiO2 layer over the element structures.

Abstract: The invention relates to a microphone membrane (M1) comprising two piezoelectric layers (PS1, PS2) with c-axes oriented in the same direction. A first electroconductive surface (E11) is formed in the central metal layer and subjected to a first electrical potential. The piezoelectric layers (PS1, PS2) are respectively arranged between the central metal layer (ML2) and an outer metal layer (ML1, ML3). In a preferred embodiment, the membrane (M1) has a largely symmetrical structure in terms of the layer sequence and the layer thickness thereof.

Abstract: An electrical component has electrically conducting structures placed on an electrically isolating or semiconductive substrate and component structures sensitive to a voltage or an electrical arcing and galvanically separated from one another. To prevent an arcing between the galvanically separated component structures, the component structures are short-circuited with a shunt line having a smaller cross-section than the remaining electrical conductor tracks. The shunt lines can be burnt through by application of an electrical current at any given time, whereby a galvanic separation of the component structures is effected, if necessary, for the function of the component.

Abstract: A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

Abstract: An apparatus including a piezoelectric substrate having at least one transducer electrode structure. The structure having a metallization formed by one or more metals with a mean specific density that is at least 50% higher than that of aluminum. The structure having a compensation layer that is applied fully or partially over the metallization. The compensation layer is of a material having a temperature dependence of elastic constants that counteracts the temperature coefficient of frequency of the substrate. The compensation layer has a thickness that is less than 15% of an acoustic wavelength of a wave capable of propagation in the structure.

Abstract: A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm.

Abstract: A capacitor with a multilayer structure on a ceramic or crystalline substrate is proposed that comprises at least one lower and one upper electrode as well as a tunable dielectric arranged therebetween in which resonant oscillation modes of bulk acoustic waves can be propagated, wherein, by suitable selection regarding material and thickness and a suitable number of layers in the multilayer structure, the latter is tuned such that the resonant frequencies of the oscillation modes lie outside of band ranges used in mobile telephones. Circuits with tunable capacitors that find multiple uses inside terminal devices for mobile communication are additionally proposed.

Abstract: An electrical module includes a base plate having an acoustic channel that opens into a first cavity at a first end and that is closed off by a microphone chip at a second end. The microphone chip borders a second cavity that opens to an exterior of the electrical module. The second cavity is separated from the acoustic channel by the microphone chip.

Abstract: An electrical component has electrically conducting structures placed on an electrically isolating or semiconductive substrate and component structures sensitive to a voltage or an electrical arcing and galvanically separated from one another. To prevent an arcing between the galvanically separated component structures, the component structures are short-circuited with a shunt line having a smaller cross-section than the remaining electrical conductor tracks. The shunt lines can be burnt through by application of an electrical current at any given time, whereby a galvanic separation of the component structures is effected, if necessary, for the function of the component.

Abstract: For a component operating with acoustic waves, it is proposed to arrange the electrode structure over a mechanically stable adaptation layer that serves to dissipate the electromechanical stresses. Further improvements of the output compatibility are achieved with additional intermediate layers and passivation layers applied on the sides or the entire surface over the electrode structure.

Abstract: Elements and methods for forming elements that operate with acoustic waves are disclosed. The element includes a piezoelectric electric substrate that has a first thermal coefficient of expansion, electrically conducting element structures on an upper side of the substrate, a compensation layer on an underside of the substrate, and an SiO2 layer over the element structures.

Abstract: An electrical component has electrically conducting structures placed on an electrically isolating or semiconductive substrate and component structures sensitive to a voltage or an electrical arcing and galvanically separated from one another. To prevent an arcing between the galvanically separated component structures, the component structures are short-circuited with a shunt line having a smaller cross-section than the remaining electrical conductor tracks. The shunt lines can be burnt through by application of an electrical current at any given time, whereby a galvanic separation of the component structures is effected, if necessary, for the function of the component.

Abstract: For a component operating with acoustic waves, it is proposed to arrange the electrode structure over a mechanically stable adaptation layer that serves to dissipate the electromechanical stresses. Further improvements of the output compatibility are achieved with additional intermediate layers and passivation layers applied on the sides or the entire surface over the electrode structure.

Abstract: SAW component with improved temperature coefficient of frequency To reduce losses in a SAW component assembled on a piezoelectric substrate (S), the mass load on the metallization (M) is increased until the propagation velocity of the surface wave comes to rest below the propagation velocity of the fast shear wave. To limit the increase in the temperature coefficient of frequency in this process, a metallization with a significantly higher specific density than [that of] Al is used. The temperature coefficient of frequency of the component is simultaneously reduced by a compensation layer (K) applied to essentially the entire surface, said compensation layer being made of a material having a temperature dependency of the elastic coefficient that counteracts that of the substrate-metallization combination.

Abstract: A device for determining whether a lubricant to be examined effects the formation of a deposit on a sensor element has a sensor element for detecting values of at least one physical parameter of the lubricant. The sensor element is in contact with the lubricant. Furthermore, there is provided a potential difference source for applying a potential difference between the sensor element and the lubricant. Moreover, there is provided an evaluator for evaluating at least two values of the physical parameter which are detected at different potential states between the sensor element and the lubricant in order to thus determine whether the lubricant causes a deposit formation on the sensor element.