Patents by Inventor Anton Leidl

Anton Leidl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8571239
    Abstract: A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the ?3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: October 29, 2013
    Assignee: Epcos AG
    Inventors: Gregor Feiertag, Anton Leidl, Wolfgang Pahl, Matthias Winter, Christian Siegel
  • Patent number: 8553920
    Abstract: An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: October 8, 2013
    Assignee: EPCOS AG
    Inventors: Gregor Feiertag, Anton Leidl
  • Publication number: 20130140656
    Abstract: The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO1) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (SO1) is closed; and a second sound inlet opening (SO2) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (SO1) is prepared but closed.
    Type: Application
    Filed: July 7, 2011
    Publication date: June 6, 2013
    Applicant: EPCOS AG
    Inventors: Wolfgang Pahl, Hans Krueger, Gregor Feiertag, Alois Stelzl, Anton Leidl, Stefan Seitz
  • Publication number: 20130119492
    Abstract: The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.
    Type: Application
    Filed: January 24, 2011
    Publication date: May 16, 2013
    Applicant: EPCOS AG
    Inventors: Gregor Feiertag, Hans Krueger, Wolfgang Pahl, Anton Leidl
  • Patent number: 8432007
    Abstract: A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: April 30, 2013
    Assignee: EPCOS AG
    Inventors: Anton Leidl, Hans Krueger, Alois Stelzl, Wolfgang Pahl, Stefan Seitz
  • Patent number: 8393214
    Abstract: A rotating motion sensor includes at least one electroacoustic resonator to stimulate a surface acoustic wave. The at least one electroacoustic resonator is configured so that rotation of the at least one electroacoustic resonator about an axis of rotation causes a change in resonance frequency of the at least one electroacoustic resonator. The at least one electroacoustic resonator includes oscillating structures configured to oscillate in a first direction that is a direction of propagation of the surface acoustic wave and/or a second direction that is transverse to the direction of propagation of the surface acoustic wave.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: March 12, 2013
    Assignee: EPCOS AG
    Inventors: Werner Ruile, Anton Leidl
  • Publication number: 20120275634
    Abstract: A microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed.
    Type: Application
    Filed: April 26, 2011
    Publication date: November 1, 2012
    Applicant: EPCOS AG
    Inventors: Anton Leidl, Wolfgang Pahl
  • Publication number: 20120224726
    Abstract: A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.
    Type: Application
    Filed: March 1, 2011
    Publication date: September 6, 2012
    Applicant: EPCOS AG
    Inventors: Wolfgang Pahl, Anton Leidl, Matthias Jungkunz, Andreas Beer
  • Patent number: 8184845
    Abstract: An electrical module includes a base plate having an acoustic channel that opens into a first cavity at a first end and that is closed off by a microphone chip at a second end. The microphone chip borders a second cavity that opens to an exterior of the electrical module. The second cavity is separated from the acoustic channel by the microphone chip.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: May 22, 2012
    Assignee: Epcos AG
    Inventors: Anton Leidl, Wolfgang Pahl, Ulrich Wolff
  • Patent number: 8169041
    Abstract: A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
    Type: Grant
    Filed: November 6, 2006
    Date of Patent: May 1, 2012
    Assignee: EPCOS AG
    Inventors: Wolfgang Pahl, Anton Leidl, Stefan Seitz, Hans Krueger, Alois Stelzl
  • Publication number: 20120093346
    Abstract: A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the ?3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.
    Type: Application
    Filed: October 27, 2011
    Publication date: April 19, 2012
    Applicant: EPCOS AG
    Inventors: Gregor Feiertag, Anton Leidl, Wolfgang Pahl, Matthias Winter, Christian Siegel
  • Publication number: 20110298064
    Abstract: Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.
    Type: Application
    Filed: July 26, 2011
    Publication date: December 8, 2011
    Applicant: EPCOS AG
    Inventors: Wolfgang Pahl, Gregor Feiertag, Anton Leidl
  • Publication number: 20110233690
    Abstract: On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.
    Type: Application
    Filed: June 16, 2009
    Publication date: September 29, 2011
    Applicant: Epcos AG
    Inventors: Gregor Feiertag, Hans Krueger, Anton Leidl, Alois Stelzl
  • Patent number: 8009407
    Abstract: A capacitor includes a multi layer structure on a ceramic or crystalline substrate. The multilayer structure includes a lower electrode, an upper electrode, and a dielectric that is tunable by a voltage applied to the electrodes. The multilayer structure is configured such that resonant oscillation modes of bulk acoustic waves can be propagated in the multilayer structure and such that the resonant frequencies of the oscillation modes are outside a first band range of between 810 and 1000 MHz, second band range of between 1700 and 2205 MHz and third band range of between 2400 and 2483.5 MHz.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: August 30, 2011
    Assignee: Epcos AG
    Inventors: Anton Leidl, Wolfgang Sauer, Stefan Seitz
  • Patent number: 7998805
    Abstract: An electrical component has electrically conducting structures placed on an electrically isolating or semiconductive substrate and component structures sensitive to a voltage or an electrical arcing and galvanically separated from one another. To prevent an arcing between the galvanically separated component structures, the component structures are short-circuited with a shunt line having a smaller cross-section than the remaining electrical conductor tracks. The shunt lines can be burnt through by application of an electrical current at any given time, whereby a galvanic separation of the component structures is effected, if necessary, for the function of the component.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: August 16, 2011
    Assignee: EPCOS AG
    Inventors: Thomas Baier, Waldemar Gawlik, Günter Kovacs, Anton Leidl, Christian Math, Werner Ruile
  • Publication number: 20110186943
    Abstract: A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
    Type: Application
    Filed: March 30, 2011
    Publication date: August 4, 2011
    Applicant: EPCOS AG
    Inventors: Wolfgang Pahl, Anton Leidl, Stefan Seitz, Hans Krueger, Alois Stelzl
  • Publication number: 20110018076
    Abstract: A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.
    Type: Application
    Filed: July 23, 2010
    Publication date: January 27, 2011
    Inventors: Wolfgang Pahl, Gregor Feiertag, Anton Leidl
  • Publication number: 20100272302
    Abstract: An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier.
    Type: Application
    Filed: October 26, 2009
    Publication date: October 28, 2010
    Inventors: Gregor Feiertag, Anton Leidl
  • Publication number: 20100176899
    Abstract: A component (1) is proposed wherein the suspension of the component (1) is effected in a stress-reduced manner. The component (1) can rest on a membrane (4) or be held by a spring element (2). The membrane (4) or the spring element (2) is situated above a depression (6) or an opening (7) partially spanned by the membrane (4). Preferably, the membrane (4) has a modulus of elasticity that is less than or equal to the modulus of elasticity of the component (1) or of the substrate (3). The component (1) can be covered with metal electrodes (10) wholly or partially over the area on two sides.
    Type: Application
    Filed: June 13, 2008
    Publication date: July 15, 2010
    Applicant: EPCOS AG
    Inventors: Ansgar Schäufele, Anton Leidl, Wolfgang Sauer
  • Publication number: 20090255337
    Abstract: A rotating motion sensor includes at least one electroacoustic resonator to stimulate a surface acoustic wave. The at least one electroacoustic resonator is configured so that rotation of the at least one electroacoustic resonator about an axis of rotation causes a change in resonance frequency of the at least one electroacoustic resonator. The at least one electroacoustic resonator includes oscillating structures configured to oscillate in a first direction that is a direction of propagation of the surface acoustic wave and/or a second direction that is transverse to the direction of propagation of the surface acoustic wave.
    Type: Application
    Filed: August 7, 2007
    Publication date: October 15, 2009
    Inventors: Werner Ruile, Anton Leidl