Patents by Inventor Arthur R. Zingher

Arthur R. Zingher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9748414
    Abstract: A self-activated front surface bias for photovoltaic solar cell assembly is provided. The solar cell assembly comprises a front surface electrical bias activated by electrical energy generated by the solar cell assembly. The front surface bias improves generation efficiency for said solar cell assembly.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: August 29, 2017
    Inventor: Arthur R. Zingher
  • Publication number: 20130125950
    Abstract: A self-activated front surface bias for photovoltaic solar cell assembly is provided. The solar cell assembly comprises a front surface electrical bias activated by electrical energy generated by the solar cell assembly. The front surface bias improves generation efficiency for said solar cell assembly.
    Type: Application
    Filed: May 21, 2012
    Publication date: May 23, 2013
    Applicant: SOLEXEL, INC.
    Inventor: Arthur R. Zingher
  • Patent number: 8148202
    Abstract: One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: April 3, 2012
    Assignee: Oracle America, Inc.
    Inventors: Ashok V. Krishnamoorthy, Arthur R. Zingher, Robert J. Drost
  • Patent number: 8074168
    Abstract: The disclosed embodiments automate context-compensated rendering of text in a graphical environment. In the disclosed embodiments, the system first receives a specification of the graphical environment that includes text to be rendered in the graphical environment. Next, the system determines the parameters of the local environment near the text (e.g., character size and perturbations for perspective and tilt, pixel density, adjacent (local or background) color and brightness, illumination and shadow effects, etc.). The system then dynamically renders text to compensate for those parameters, in order to display the text more clearly.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: December 6, 2011
    Assignee: Oracle America, Inc.
    Inventors: Arthur R. Zingher, Hideya Kawahara
  • Patent number: 8072772
    Abstract: An apparatus includes a two-dimensional array of single-chip modules (SCMs) and at least one component. A respective SCM in the array includes at least a semiconductor die that is configured to communicate data signals by capacitive coupling using one or more proximity connectors in a first set of proximity connectors. The first set of proximity connectors are coupled to the semiconductor die. A second set of proximity connectors is coupled to at least the one component. At least the one component is coupled to semiconductor dies in two or more SCMs using one or more proximity connectors in the second set of proximity connectors thereby enabling communication of the data signals by capacitive coupling.
    Type: Grant
    Filed: February 22, 2006
    Date of Patent: December 6, 2011
    Assignee: Oracle America, Inc.
    Inventor: Arthur R. Zingher
  • Publication number: 20110136297
    Abstract: One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.
    Type: Application
    Filed: February 14, 2011
    Publication date: June 9, 2011
    Applicant: ORACLE INTERNATIONAL CORPORATION
    Inventors: Ashok V. Krishnamoorthy, Arthur R. Zingher, Robert J. Drost
  • Patent number: 7915699
    Abstract: One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: March 29, 2011
    Assignee: Oracle America, Inc.
    Inventors: Ashok V. Krishnamoorthy, Arthur R. Zingher, Robert J. Drost
  • Patent number: 7838409
    Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: November 23, 2010
    Assignee: Oracle America, Inc.
    Inventors: Arthur R. Zingher, Bruce M. Guenin, Ronald Ho, Robert J. Drost
  • Publication number: 20100275971
    Abstract: A solar receiver and system is provided that generates electrical power generation from very highly concentrated sunlight. The system has advantages in: cooling and packaging for electrical power devices; electrical circuit impedance; and low frequency and high frequency electrical properties. In one example, a Photo-voltaic Many Cell Module (“PvMcm”) includes a large substrate with many photo-voltaic (“PV”) cells mounted in a dense array. This substrate has a core of solid molybdenum, insulated on both faces with aluminum nitride. Atop this is one layer of molybdenum printed wire. This electrically connects the PV cells. Atop this is another dielectric layer. This substrate provides excellent thermal resistivity. This receiver also includes a Switch Many Chip Module (“SwMcm”) to convert DC to AC electrical power. This includes a second substrate that carries power switches mounted tightly on one surface. This substrate includes a metal core, ceramic insulation and several layers of printed wiring.
    Type: Application
    Filed: April 6, 2009
    Publication date: November 4, 2010
    Inventor: Arthur R Zingher
  • Patent number: 7813815
    Abstract: An integrated circuit contains within the chip one or more measuring devices that provide a digital value corresponding to respective physical operating parameters of the chip. The digital values can be communicated to other devices using an interrupt handler.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: October 12, 2010
    Assignee: International Business Machines Corporation
    Inventors: Herschel Ainspan, Philip G. Emma, Rick A. Rand, Arthur R Zingher
  • Publication number: 20100129999
    Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.
    Type: Application
    Filed: January 12, 2010
    Publication date: May 27, 2010
    Applicant: SUN MICROSYSTEMS, INC.
    Inventors: Arthur R. Zingher, Bruce M. Guenin, Ronald Ho, Robert J. Drost
  • Patent number: 7671449
    Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.
    Type: Grant
    Filed: May 4, 2006
    Date of Patent: March 2, 2010
    Assignee: Sun Microsystems, Inc.
    Inventors: Arthur R. Zingher, Bruce M. Guenin, Ronald Ho, Robert J. Drost
  • Patent number: 7659619
    Abstract: A device includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to the first surface. The first semiconductor die is configured to have a flexibility compliance greater than a first pre-determined value in a direction substantially perpendicular to a plane including the plurality of proximity connectors in order to reduce misalignment in the direction between the plurality of proximity connectors and additional proximity connectors on another device.
    Type: Grant
    Filed: October 12, 2005
    Date of Patent: February 9, 2010
    Assignee: Sun Microsystems, Inc.
    Inventors: Arthur R. Zingher, Robert J. Moffat, Ronald Ho
  • Patent number: 7649245
    Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. By matching the wire line size in the flexible bridge to the size of circuits and/or signal pads on the chip and on the second component, the system allows signals to be sent between the circuits on the chip and the second component without having to change the scale of the interconnect, thereby alleviating wireability and bandwidth limitations of conventional chip packaging technologies.
    Type: Grant
    Filed: May 4, 2006
    Date of Patent: January 19, 2010
    Assignee: Sun Microsystems, Inc.
    Inventors: Arthur R. Zingher, Bruce M. Guenin, Ronald Ho, Robert J. Drost
  • Patent number: 7612459
    Abstract: A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.
    Type: Grant
    Filed: May 8, 2008
    Date of Patent: November 3, 2009
    Assignee: Sun Microsystems, Inc.
    Inventors: Arthur R. Zingher, Bruce M. Guenin, Edward L. Follmer
  • Patent number: 7554195
    Abstract: A device includes a first semiconductor die having a first surface and a second surface, a cable coupled to the first semiconductor die, and at least one memory device coupled to the cable. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to and/or coupled to the first surface.
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: June 30, 2009
    Assignee: Sun Microsystems, Inc.
    Inventors: Arthur R. Zingher, Ashok Krishnamoorthy
  • Patent number: 7483248
    Abstract: One embodiment of the present invention provides a system that detects changes in power-supply current within an integrated circuit (IC) chip. During operation, the system monitors an induced current through a detection loop. This detection loop is situated at least partially within the IC chip in close proximity to a power-supply current for the IC chip, so that a change in the power-supply current changes a magnetic field passing through the detection loop, thereby inducing a corresponding current through the detection loop. The system then generates a control signal based on the induced current, so that changes in the power-supply current cause the control signal to change. In addition, the system uses the control signal to control circuits within the IC chip.
    Type: Grant
    Filed: May 19, 2005
    Date of Patent: January 27, 2009
    Assignee: Sun Microsystems, Inc.
    Inventors: Ronald Ho, Robert J. Drost, Arthur R. Zingher
  • Publication number: 20080203551
    Abstract: A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.
    Type: Application
    Filed: May 8, 2008
    Publication date: August 28, 2008
    Applicant: Sun Microsystems, Inc.
    Inventors: Arthur R. Zingher, Bruce M. Guenin, Edward L. Follmer
  • Patent number: 7397136
    Abstract: A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: July 8, 2008
    Assignee: Sun Microsystems, Inc.
    Inventors: Arthur R. Zingher, Bruce M. Guenin, Edward L. Follmer
  • Publication number: 20080077780
    Abstract: The software debugging system provides a processor that is executing a software process, and the software process has a bug or other failure. A fast-response reporter circuit connects to a low level asset in the processor, such as a reorder buffer, commit buffer, or high speed data path. The fast response reporter circuit is configured to selectively extract data from the low-level asset, and the extracted data is transmitted to an evidence file for review and analysis. In one arrangement, a fast-response sentry circuit also connects to a low-level asset in the processor, and is configured to monitor for a predefined event. When the predefined event occurs, the fast-response sentry circuit causes an action to occur, such as activation of the reporter fast-response circuit.
    Type: Application
    Filed: July 23, 2004
    Publication date: March 27, 2008
    Inventor: Arthur R. Zingher