Abstract: The vapor drain is a device that permits steady state control of the composition of the atmosphere within a substantially sealed enclosure. For any fabricated enclosure the will be sources of vapor phase molecules: molecules evaporating from a deliberately installed lubricant reservoir, molecules outgassed from components, and molecules diffusing in from the outside world. The purpose of the vapor drain is to minimize the second two classes of molecules in the composition of the enclosure atmosphere as they are considered to be contaminants. An example application is a rigid disk magnetic data storage device which requires a monomelecular layer of lubricant on the disk and slider surfaces. The vapor drains suppresses the contaminant population by capturing a portion of all three sources of molecules in the vapor phase.

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water.

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with understanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water.

Abstract: An integrated circuit chip packaging structure, preferably having a semiconductor base substrate, i.e., silicon or gallium arsenide, alternating insulation and conductive layers on the base structure, at least two conductive layers being patterned into thin film wiring (i.e., thin film copper of approximately 5 microns), semiconductor integrated circuit chips connected to the upper-most patterned conductive layer, and means to connected the packaging structure to the next level of packaging (i.e., board or card).The thin film wiring layers typically each having coplanar ground, power and signal lines, with at least one power or ground line existing between coplanar signal lines to minimize cross talk. To facilitate efficient power distribution, lines of specific power levels of the patterned planes are connected to lines of the same power level on other patterned planes to form three dimensional power planes.

Abstract: A self-contained method and structure for partitioning, testing and diagnosing a multi-chip packaging structure. The method comprises the steps of electronically inhibiting all chips in the multi-chip package except for the chip or chips under test, creating a signature of the chip or chips under test by generating and applying random patterns to the chip or chips under test (referred to as the unit under test) and comparing the signature obtained to a "good machine" simulation signature. The structure comprises means for accomplishing the above method steps. A preferred structure comprises an semiconductor substrate having redundant self test circuitry built in and chips having ECIPT circuitry mounted on the semiconductor substrate. Either all or a portion of the self test circuitry, including the required multiplexers, etc., may be incorporated into the semiconductor substrate. ECIPT circuitry may also be built into the substrate below each chip site.

Abstract: A cooling structure for a semiconductor package wherein the cooling fluid is circulated over the cooling fins over short distances. The fluid flow is separated into multiple flow streams, passed over the fins for short distances and exhausted.

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is secured adheringly, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. The heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. The finned sheet may be efficiently fabricated by processes analogous to those used to make printed circuits.

Abstract: A method of joining a thermally conductive element to an electric circuit chip for cooling the chip includes initial steps of forming an oxide-free preform of a fusible metal alloy by extrusion of alloy between two mold blocks or plates. During the extrusion, the oxide coating is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill or section of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.

Abstract: Apparatus and methods are disclosed for inspecting unsintered single or multiple layer ceramic specimens containing or carrying metal paste patterns of the type commonly used to ultimately form laminated multilayer ceramic (MLC) carriers for large scale integrated (LSI) chips. A relatively large surface area of an unsintered ceramic specimen (large in comparison with the minimum feature size of the paste patterns) is temporarily electrically contacted with a conforming electrode. The conforming electrode makes non-damaging electrical contact to any metallic paste exposed at the contacted area. Electric charge is either collected or delivered by this electrode, depending upon the mode of operation.

Abstract: A method of manufacturing packages for LSI chips starts with the usual steps of punching holes in green sheets, screening patterning paste (adapted to form cermet conductors or the like after firing) onto the green sheets, and inspecting the green sheets optically. Here, subsets of green sheets are then stacked and compressed into sublaminates. The sublaminates are then functionally inspected electrically. Inspection is done by means of electromechanical contact, scanning electron microscope like techniques, or by other means of irradiating the conductors to energize them for electrical measurement. Measurement may be made between pairs of terminals on only one side of the device being tested, or on both sides of the device. Beams can be applied both top and bottom from a single source or plural sources. Measuring instruments employ various electromechanical techniques as well as electrons, light used photoelectrically, ions, or pneumatic ion jets.

Abstract: A method of manufacturing packages for LSI chips starts with the usual steps of punching holes in green sheets, screening patterning paste (adapted to form cermet conductors or the like after firing) onto the green sheet, and inspecting the green sheets optically. Here, subsets of green sheets are then stacked and compressed into sublaminates. The sublaminates are then functionally inspected electrically. Inspection is done by means of electromechanical contact, scanning electron microscope like techniques, or by other means of irradiating the conductors to energize them for electrical measurement. Measurement may be made between pairs of terminals on only one side of the device being tested, or on both sides of the device. Beams can be applied both top and bottom from a single source or plural sources. Measuring instruments employ various electromechanical techniques as well as electrons, light used photoelectrically, ions, or pneumatic ion jets.

Abstract: In a device for projecting a primary image from a transparency along an optical path and for altering the image by selectively directing a writing light source reversably along the optical path toward the transparency, a transparent recording film includes a pre-recorded primary image layer and a secondary layer annotatable by the marking light. The two layers are congruent, and in one embodiment comprise superimposed substrates which are joined mechanically. In another embodiment, the two layers are coated jointly on one substrate, and in a further embodiment the two layers are intimately mixed to form one bifunctional layer. Various means are disclosed whereby the primary image layer is unaffected by the marking light, and the annotatable secondary layer is unaffected by the projection illumination.

Abstract: An apparatus for altering an optically projected member includes a writing light which is directed at the apparent projected image of the member, which may be a transparency or workpiece or the like. The writing light is transmitted backwards through the projection optics, and is focussed to an intensely illuminated writing spot near the projection member. A recording member, such as a recording transparency which is sensitive to the writing light and insensitive to the projection beam, is disposed adjacent to the projection slide. The recording member is altered by the focussed writing light to form a locally marked area which becomes incorporated in the apparent projected image.