Patents by Inventor Arun Sharma

Arun Sharma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7759787
    Abstract: A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: July 20, 2010
    Assignee: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Vijayeshwar D. Khanna, Arun Sharma
  • Patent number: 7748895
    Abstract: A method (and system) of predicting a thermal state of a transient thermal system, includes combining sensor outputs and thermal parameters to construct a consistent set of estimates of internal temperature of a transient thermal system.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: July 6, 2010
    Assignee: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Arun Sharma
  • Patent number: 7732894
    Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
    Type: Grant
    Filed: February 13, 2008
    Date of Patent: June 8, 2010
    Assignee: International Business Machines Corporation
    Inventors: David Questad, Vijayeshwar D. Khanna, Jennifer V. Muney, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
  • Patent number: 7711968
    Abstract: A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: May 4, 2010
    Assignee: International Business Machines Corporation
    Inventors: Hien P. Dang, Arun Sharma, Sri M. Sri-Jayantha
  • Publication number: 20100090128
    Abstract: The present invention provides a color indicator dosimeter system to detect and quantify a dosage of ionizing radiation in a wide range wherein said system comprises phenolic glycoside as one of the components. The present invention also relates to a method for using dosimeter system as described hereinabove for detecting and quantifying a dosage of ionizing radiation in a wide range.
    Type: Application
    Filed: October 14, 2008
    Publication date: April 15, 2010
    Applicant: Secretary, Department of Atomic Energy
    Inventors: Sumit GUPTA, Suchandra Chatterjee, Prasad S. Variyar, Arun Sharma
  • Patent number: 7695961
    Abstract: The invention provides isolated mMafA polypeptides, nucleic acids, vectors and host cells containing them, which encode a novel insulin related transcription factor. Diagnostic methods, methods of selecting and differentiating insulin-producing cells, and methods of treatment utilizing compositions of the invention are also provided.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: April 13, 2010
    Assignee: Joslin Diabetes Center, Inc.
    Inventor: Arun Sharma
  • Patent number: 7695188
    Abstract: An apparatus for predicting a thermal state of a system including a semiconductor chip includes a plurality of sensors formed on the semiconductor chip for measuring a temperature at first locations of the semiconductor chip, a model developer for developing a model for estimating a temperature at second locations of the semiconductor chip which are other than the first locations, a mapping unit for mapping an instruction cache associated with the chip into a sequence of X-Y distributed quanta of heat packets, and a predicting unit for predicting a future temperature of the chip based on an execution of an instruction stream in the instruction cache.
    Type: Grant
    Filed: January 28, 2008
    Date of Patent: April 13, 2010
    Assignee: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Arun Sharma
  • Patent number: 7673158
    Abstract: A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: March 2, 2010
    Assignee: International Business Machines Corporation
    Inventors: Hien P. Dang, Arun Sharma, Sri M. Sri-Jayantha
  • Patent number: 7652596
    Abstract: The described embodiments provide a system that encodes a sequence of integers using a variable-length compression technique. During operation, the system scans the sequence of integers and observes the sizes of the integers to determine a threshold value, K, from the observed sizes. For a given integer of length N bits, if N?K is greater than zero, the system generates a tag for the encoded integer comprising a sequence of N?K zeros followed by a one, and generates a set of remaining bits for the encoded integer as a sequence of the N?1 least-significant bits which make up the integer. Otherwise, the system generates a tag for the encoded integer as a single one, and generates a set of remaining bits for the encoded integer by padding the N bits which make up the integer with zeros so that the set of remaining bits is K bits in length.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: January 26, 2010
    Assignee: Google Inc.
    Inventors: Arun Sharma, Dean Gaudet
  • Publication number: 20090313588
    Abstract: A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; an
    Type: Application
    Filed: October 29, 2008
    Publication date: December 17, 2009
    Inventors: Hien Phu Dang, Vijayeshwar Das Khanna, Arun Sharma, Sri M. Sri-Jayantha
  • Publication number: 20090312960
    Abstract: A method for characterizing thermomechanical properties of an organic substrate includes the steps of: receiving an image of the substrate, the image including a geometric description of the circuit layers of the substrate; selecting a given one of the circuit layers for processing; converting the image to a 2-D FEM image of the given circuit layer; repeating the steps of selecting a given one of the circuit layers and converting the image to a 2-D FEM image of the selected layer until all of the layers have been processed; combining all of the 2-D FEM images corresponding to the layers to form a 3-D FEM image representing at least a portion of the substrate; determining a coefficient of thermal expansion (CTE), modulus and/or Poisson's ratio of the 3-D FEM image; and constructing a 3-D representation of the substrate as a function of the CTE, modulus and/or Poisson's ratio of the 3-D FEM image.
    Type: Application
    Filed: October 29, 2008
    Publication date: December 17, 2009
    Inventors: Hien Phu Dang, Vijaveshwar Das Khanna, Arun Sharma, Sri M. Sri-Jayantha
  • Publication number: 20090310848
    Abstract: A method for characterizing thermomechanical properties of an organic substrate is provided.
    Type: Application
    Filed: October 29, 2008
    Publication date: December 17, 2009
    Inventors: Hien Phu Dang, Arun Sharma, Sri M. Sri-Jayantha
  • Patent number: 7612167
    Abstract: The present invention relates to novel human hiwi protein and genes that encode such proteins. The invention is directed toward the isolation and characterization of human hiwi proteins. The invention specifically provides isolated complementary DNA copies of mRNA corresponding to a human hiwi gene. Also provided are recombinant expression constructs capable of expressing the human hiwi gene of the invention in cultures of transformed prokaryotic and eukaryotic cells, as well as such cultures of transformed cells that synthesize the human hiwi proteins encoded therein. The invention also provides methods for isolating human hematopoietic stem cells.
    Type: Grant
    Filed: May 31, 2005
    Date of Patent: November 3, 2009
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Arun Sharma, Ronald Hoffman
  • Patent number: 7609000
    Abstract: A system that encodes a sequence of integers using a variable-length compression technique is described. During operation, the system scans the sequence of integers and observes the sizes of the integers to determine a threshold value K from the observed sizes. For a given integer which is N bits in length, if N?K is greater than or equal to zero, the system generates a tag for the encoded integer which comprises a sequence of N?K zeros followed by a one, and generates a set of remaining bits for the encoded integer as a sequence of the N bits which make up the integer. Otherwise, if N?K is less than zero, the system generates a tag for the encoded integer as a single one, and generates a set of remaining bits for the encoded integer by padding the N bits which make up the integer with zeros so that the set of remaining bits is K bits in length.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: October 27, 2009
    Assignee: Google Inc.
    Inventor: Arun Sharma
  • Publication number: 20090265028
    Abstract: A process for large scale production of a laminated organic substrate having reduced thermal warp.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 22, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sri M. Sri-Jayantha, Arun Sharma, Vijayeshwar D. Khanna, Hien P. Dang, David J. Russell, Douglas O. Powell
  • Patent number: 7590820
    Abstract: A machine-accessible medium may contain program instructions that, when executed by a processor, may cause the processor to perform at least one operation including searching a virtual hash page table (VHPT) using a region identifier and a virtual page number of a virtual address, and a default page size corresponding to the region identifier to locate a virtual address translation in the VHPT. The operation performed may further include searching the VHPT using the region identifier, the virtual page number, and at least one utilized page size to locate a virtual address translation in the VHPT if a virtual address translation is not located during the search of the VHPT using the region identifier, virtual page number, and default page size. The operation performed may also include inserting the located virtual address translation into a translation cache once a virtual address translation is located.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: September 15, 2009
    Assignee: Intel Corporation
    Inventors: Yaozu Dong, Arun Sharma, Xiaoyan Feng, Rohit Seth
  • Patent number: 7583044
    Abstract: A servo control system micro-electromechanical systems (MEMS)-based motion control system (and method therefor), includes a motion generator having an inherent stiffness component.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: September 1, 2009
    Assignee: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Hien Dang, Arun Sharma, Evangelos S. Eleftheriou, Mark A. Lantz, Charalampos Pozidis
  • Publication number: 20090141740
    Abstract: Techniques for multiple protocol cross layer customized QoS propagation and mapping are described herein. In one embodiment of the invention, a first QoS code of a packet is determined, the packet having a first encapsulation layer and a second encapsulation layer, the first QoS code being included within the first encapsulation of the packet. From application of a first cross layer QoS map to the first QoS code, determining that the second encapsulation layer of the packet should be used in determining a QoS classification. The reference point to the second encapsulation layer is stored. The QoS classification is determined with use of the reference point. A representation of the QoS classification is stored in a QoS descriptor and the QoS descriptor is used to influence processing of the packet. Other methods and apparatuses are also described.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 4, 2009
    Inventors: Pritam Baruah, Arun Sharma, Timothy J. Lynch, Ramanathan Lakshmikanthan, Peter Arberg
  • Publication number: 20090114429
    Abstract: A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.
    Type: Application
    Filed: November 6, 2007
    Publication date: May 7, 2009
    Applicant: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Vijayeshwar D. Khanna, Arun Sharma
  • Patent number: 7524492
    Abstract: The invention provides isolated mMafA polypeptides, nucleic acids, vectors and host cells containing them, which encode a novel insulin related transcription factor. Diagnostic methods, methods of selecting and differentiating insulin-producing cells, and methods of treatment utilizing compositions of the invention are also provided.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: April 28, 2009
    Assignee: Joslin Diabetes Center, Inc.
    Inventor: Arun Sharma