Patents by Inventor Arun Virupaksha Gowda

Arun Virupaksha Gowda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240266270
    Abstract: A semiconductor assembly includes a semiconductor device and a POL-RDL package coupled to said device. The device includes an upper surface, a gate pad and at least one source pad disposed on said upper surface. The POL-RDL package includes a dielectric layer having at least one source pad electrically coupled to said at least one source pad of said device and at least one contact pad disposed. At least one trace connection having a resistivity value electrically couples said at least one source pad of said POL-RDL package to said at least one contact pad.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 8, 2024
    Inventors: Arun Virupaksha Gowda, Ljubisa D. Stevanovic, Christopher James Kapusta, Robert Dwayne Gossman, Risto Ilkka Sakari Tuominen
  • Patent number: 12034033
    Abstract: A semiconductor device package comprises a semiconductor switching device having a body, including a first side, and an opposing second side coupled to a substrate. A gate terminal is defined on the semiconductor switching device body first side, the gate terminal having a first side, and an opposing second side facing the semiconductor switching device body. A first gate resistor is disposed on the gate terminal first side, and coupled electrically in series with the gate terminal.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: July 9, 2024
    Assignee: GE Aviation Systems LLC
    Inventor: Arun Virupaksha Gowda
  • Publication number: 20230420901
    Abstract: The disclosure relates to an apparatus for connecting an electronic component to a conductor. A housing includes at least one slot and defines at least one component chamber for carrying the electronic component. A liquid coolant can pass through the housing. A pair of conductive members extends from the housing through the at least one slot and can be releasably inserted into a channel defined in a support assembly. The support assembly facilitates an electrical connection between the conductive members and corresponding conductive contact members connected to a respective power supply or electrical load. The support assembly can provide an inward sealing force to a seal on the housing circumscribing the pair of conductive members.
    Type: Application
    Filed: June 22, 2022
    Publication date: December 28, 2023
    Inventors: Christopher James Kapusta, David Richard Esler, Arun Virupaksha Gowda, Brian Magann Rush, Liang Yin, Richard Anthony Eddins, Liqiang Yang, Judd Everett Swanson
  • Publication number: 20230238423
    Abstract: A semiconductor device package comprises a semiconductor switching device having a body, including a first side, and an opposing second side coupled to a substrate. A gate terminal is defined on the semiconductor switching device body first side, the gate terminal having a first side, and an opposing second side facing the semiconductor switching device body. A first gate resistor is disposed on the gate terminal first side, and coupled electrically in series with the gate terminal.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 27, 2023
    Inventor: Arun Virupaksha Gowda
  • Publication number: 20230238301
    Abstract: A power overlay (POL) module includes a semiconductor device having a body, including a first side and an opposing second side. A first contact pad defined on the semiconductor device first side and a dielectric layer, having a first side and an opposing second side defining a set of first apertures therethrough, is disposed facing the semiconductor device first side. The POL module, includes a metal interconnect layer, having a first side and an opposing second side, the metal interconnect layer second side is disposed on the dielectric layer first side) and extends through the set of first apertures to define a set of vias electrically coupled to the first contact pad. An enclosure defining an interior portion is coupled to the metal interconnect layer first side, and a phase change material (PCM) is disposed in the enclosure interior portion.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 27, 2023
    Inventors: Rinaldo Luigi Miorini, Arun Virupaksha Gowda, Naveenan Thiagarajan, Brian Magann Rush
  • Patent number: 11605609
    Abstract: A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: March 14, 2023
    Assignee: General Electric Company
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Shakti Singh Chauhan
  • Patent number: 11177204
    Abstract: An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: November 16, 2021
    Assignee: General Electric Company
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Nancy Cecelia Stoffel, Risto Ilkka Tuominen
  • Patent number: 10770444
    Abstract: An electronics package includes an insulating substrate, a first electrical component coupled to a first surface of the insulating substrate, and a first conductor layer formed on the first surface of the insulating substrate. A second conductor layer is formed on a second surface of the insulating substrate, opposite the first surface, the second conductor layer extending through vias in the insulating substrate to contact at least one contact pad of the first electrical component and couple with the first conductor layer. The electronics package also includes a second electrical component having at least one contact pad coupled to the first conductor layer. The first conductor layer has a thickness greater than a thickness of the second conductor layer.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: September 8, 2020
    Assignee: General Electric Company
    Inventors: Risto Ilkka Tuominen, Arun Virupaksha Gowda
  • Patent number: 10700035
    Abstract: An electronics package includes an insulating substrate, a first electrical component coupled to a bottom surface of the insulating substrate, and a first conductor layer formed adjacent the bottom surface of the insulating substrate. The electronics package also includes a second conductor layer formed on a top surface of the insulating substrate and extending through a plurality of vias in the insulating substrate to electrically couple with the first electrical component and the first conductor layer. A second electrical component is electrically coupled to the first conductor layer and the first electrical component and the second electrical component are positioned in a stacked arrangement.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: June 30, 2020
    Assignee: General Electric Company
    Inventors: Risto Ilkka Tuominen, Arun Virupaksha Gowda
  • Publication number: 20200185349
    Abstract: A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.
    Type: Application
    Filed: February 12, 2020
    Publication date: June 11, 2020
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Shakti Singh Chauhan
  • Patent number: 10607957
    Abstract: A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: March 31, 2020
    Assignee: General Electric Company
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Shakti Singh Chauhan
  • Patent number: 10607929
    Abstract: An electronics package includes an interconnect assembly comprising a first insulating substrate, a first wiring layer formed on a lower surface of the first insulating substrate, and at least one through hole extending through the first insulating substrate and the first wiring layer. The electronics package also includes an electrical component assembly comprising an electrical component having an active surface coupled to an upper surface of the first insulating substrate opposite the lower surface. The active surface of the electrical comprises at least one metallic contact pad. At least one conductive stud is coupled to the at least one metallic contact pad and is positioned within the at least one through hole. A conductive plug contacts the first wiring layer and extends into the at least one through hole to at least partially surround the at least one conductive stud.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: March 31, 2020
    Assignee: General Electric Company
    Inventors: Christopher James Kapusta, Kaustubh Ravindra Nagarkar, Arun Virupaksha Gowda, James Wilson Rose
  • Patent number: 10553556
    Abstract: An electronics package includes an insulating substrate and electrical components coupled to a first surface of the insulating substrate. A multi-thickness conductor layer is formed on a second surface of the insulating substrate opposite the first surface. The multi-thickness conductor layer extends through vias in the insulating substrate to connect with contact pads of the electrical components. The multi-thickness conductor layer has a first thickness in a region proximate the first electrical component and a second thickness in a region proximate the second electrical component, the first thickness greater than the second thickness. The electronics package also includes a first redistribution layer having a conductor layer formed atop a portion of the multi-thickness conductor layer having the second thickness. A top surface of the conductor layer is co-planar with or substantially co-planar with a top surface of a portion of the multi-thickness conductor layer having the first thickness.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: February 4, 2020
    Assignee: General Electric Company
    Inventors: Risto Ilkka Tuominen, Arun Virupaksha Gowda
  • Patent number: 10453786
    Abstract: An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: October 22, 2019
    Assignee: General Electric Company
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Nancy Cecelia Stoffel, Risto Ilkka Tuominen
  • Publication number: 20190311981
    Abstract: An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.
    Type: Application
    Filed: June 21, 2019
    Publication date: October 10, 2019
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Nancy Cecelia Stoffel, Risto Ilkka Tuominen
  • Patent number: 10312194
    Abstract: An electronics package includes an insulating substrate, a first electrical component coupled to a top surface of the insulating substrate, and a second electrical component coupled to a bottom surface of the insulating substrate. A first conductor layer is formed on the bottom surface of the insulating substrate and extends through a via formed therethrough to contact a contact pad of the first electrical component, with a portion of the first conductor layer positioned between the insulating substrate and the second electrical component. A second conductor layer is formed on the top surface of the insulating substrate and extends through another via formed therethrough to electrically couple with the first conductor layer and to contact a contact pad of the second electrical component.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: June 4, 2019
    Assignee: General Electric Company
    Inventors: Risto Ilkka Tuominen, Arun Virupaksha Gowda
  • Publication number: 20190148279
    Abstract: An electronics package includes an interconnect assembly comprising a first insulating substrate, a first wiring layer formed on a lower surface of the first insulating substrate, and at least one through hole extending through the first insulating substrate and the first wiring layer. The electronics package also includes an electrical component assembly comprising an electrical component having an active surface coupled to an upper surface of the first insulating substrate opposite the lower surface. The active surface of the electrical comprises at least one metallic contact pad. At least one conductive stud is coupled to the at least one metallic contact pad and is positioned within the at least one through hole. A conductive plug contacts the first wiring layer and extends into the at least one through hole to at least partially surround the at least one conductive stud.
    Type: Application
    Filed: December 21, 2018
    Publication date: May 16, 2019
    Inventors: Christopher James Kapusta, Kaustubh Ravindra Nagarkar, Arun Virupaksha Gowda, James Wilson Rose
  • Patent number: 10269688
    Abstract: A semiconductor device module includes a dielectric layer, a semiconductor device having a first surface coupled to the dielectric layer, and a conducting shim having a first surface coupled to the dielectric layer. The semiconductor device also includes an electrically conductive heatspreader having a first surface coupled to a second surface of the semiconductor device and a second surface of the conducting shim. A metallization layer is coupled to the first surface of the semiconductor device and the first surface of the conducting shim. The metallization layer extends through the dielectric layer and is electrically connected to the second surface of the semiconductor device by way of the conducting shim and the heatspreader.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: April 23, 2019
    Assignee: General Electric Company
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Shakti Singh Chauhan
  • Patent number: 10204881
    Abstract: A power overlay (POL) structure includes a power device having at least one upper contact pad disposed on an upper surface of the power device, and a POL interconnect layer having a dielectric layer coupled to the upper surface of the power device and a metallization layer having metal interconnects extending through vias formed through the dielectric layer and electrically coupled to the at least one upper contact pad of the power device. The POL structure also includes at least one copper wirebond directly coupled to the metallization layer.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: February 12, 2019
    Assignee: General Electric Company
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee
  • Patent number: RE48015
    Abstract: An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more support elements having a first surface and a second surface, and one or more spring elements having a first end and a second end, and wherein first ends of the one or more spring elements are coupled to the first surface or the second surface of a respective support element.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: May 26, 2020
    Assignee: General Electric Company
    Inventors: Gamal Refai-Ahmed, David Mulford Shaddock, Arun Virupaksha Gowda, John Anthony Vogel, Christian Michael Giovanniello