Flexible Heat Exchanger
An embodiment of the invention comprises a method for constructing a heat exchanger for cooling one or more semiconductor components. The method comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber. Channel segments are configured along the interior side of the first sheet, wherein each channel extends between the coolant chambers and two TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.
Latest IBM Patents:
- AUTO-DETECTION OF OBSERVABLES AND AUTO-DISPOSITION OF ALERTS IN AN ENDPOINT DETECTION AND RESPONSE (EDR) SYSTEM USING MACHINE LEARNING
- OPTIMIZING SOURCE CODE USING CALLABLE UNIT MATCHING
- Low thermal conductivity support system for cryogenic environments
- Partial loading of media based on context
- Recast repetitive messages
1. Field of the Invention
The disclosure relates generally to a liquid flow through (LFT) heat exchanger for cooling printed circuit boards (PCB) devices, or other semiconductor devices or components. More specifically, the invention pertains to a heat exchanger of the above type that is very flexible and may be readily adapted for use with semiconductor devices of varying heights or other dimensions.
2. Description of the Related Art
High performance computing systems are using ever increasing amounts of power at higher power densities. As a result, system cooling requirements have become more challenging, and it is necessary to consider solutions that use liquid cooling. Currently available liquid cooling approaches include heat pipe, vapor chamber, and liquid flow through (LFT) solutions. These solutions, however, tend to be quite costly.
In a system that uses liquid cooling, it may also be necessary to place components for removing heat in physical contact with semiconductor devices located on a PCB assembly or the like. However, adjacent semiconductor devices may be of different sizes. Moreover, two semiconductor devices that are of the same type may in fact have a dimension that is different for the two devices, even though such dimension is within the allowed tolerance for both devices. As a result, it may be difficult to provide heat exchanger components that can effectively be adapted to meet the size requirements encountered for these different devices. A thermal interface material (TIM) is typically used by practitioners to perform gap-filling functions (e.g. gels, greases, and thermal putties). However, this limits thermal transfer efficiency. Improvements are therefore necessary in the current state of the art.
SUMMARYAccording to one embodiment of the present invention, a method is provided for constructing a heat exchanger for cooling one or more semiconductor components. The method comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has an exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections. The side sections may respectively include resilient components that collectively enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively form a coolant chamber. A plurality of TCNs thus formed may accommodate different device heights since each TCN can be formed with varying geometries and each TCN mechanically functions substantially independently. Channel segments are configured along the interior side of the first sheet and/or second sheet, wherein each channel segment extends between the coolant chambers of two TCNs, or between the coolant chamber of a TCN and an input port or an output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN. The method further comprises a connector means to couple and decouple coolant flow to/from the invention.
As will be appreciated by one skilled in the art, the present invention may be embodied as a system or method. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely process embodiment (including design, fabrication, assembly and use steps, etc.) or an embodiment combining method and hardware aspects that may all generally be referred to herein as a process or an “assembly” or a “system.”
Embodiments of the invention provide a method and apparatus for removing heat from semiconductor devices or components, such as those on a single module or an entire PCB assembly. Embodiments enhance simplicity, reduce cost, and may be readily adapted for use with multiple semiconductor components that are adjacent to one another, but are of different sizes or dimensions from one another. Embodiments of the invention are also able to adapt to variations in height, or other critical dimension, that can occur among semiconductor devices of the same type.
Referring to
Each of the sheets 10 and 12 has an interior side, such as interior side 12a of sheet 12. The interior side 10a of sheet 10 is shown in
Referring further to
Planar contact member 14a is similarly supported for movement along the Z-axis by side sections 14b-14e, which are respectively positioned along the four sides of contact member 14a. Each side section 14b-14e is similar in construction and function to the side sections 16b-16e.
As stated above, the provision of two TCNs as shown by
In order to carry out a heat removal function, it is necessary to provide a flow of coolant fluid to and away from each of the TCNs and their respective planar contact members 14a and 16a. Accordingly, in addition to forming the TCNs 14 and 16 in sheet 10, a coolant flow channel is also formed therein. More particularly,
Referring to
Referring further to
Referring again to
In joining metal foil sheets 10 and 12 together, laser welding may be used to join regions of sheets 10 and 12 that surround or are proximate to TCNs 14 and 16, and also to channel segments 18-22. This will ensure the formation of very tight seals for the fluid containing chambers 24 and 26 and the channel segments. The edges of sheets 10 and 12 may be joined by means of laser welding, or may alternatively be joined by means of an adhesive, or by a metallurgical process such as soldering.
Referring now to
Referring further to
Side sections 16b and 16d, while not shown in
Referring further to
Side sections 14b and 14d, while not shown in
Referring to
Similarly,
It is to be appreciated that semiconductor devices 46 and 48 shown in
To illustrate a further benefit provided by embodiments of the invention,
In a modification of the embodiment shown in
In a further modification, before or after forming any TCNs or channel segments, the interior sides of both sheets 10 and 12 would be coated with a metal referred to as a barrier metal. This metal does not react with the liquid that is to be used as the coolant fluid. Use of the barrier metal thus reduces interior corrosion of the heat exchanger.
In yet another modification, the cross-sections of one or more channel segments could be made larger than the cross-sections of other sections, to increase the rate at which coolant flows away from a particular TCN. For example, if coolant is flowing from channel end 22a, through respective channel segments and TCNs 14 and 16 to channel end 22a, the diameter of channel segment 18 could be made greater than the diameter of segment 22. This would increase the rate at which coolant flowed away from TCN 16, and would thus increase the capacity of TCN 16 to dissipate heat. As an alternative, two or more channel segments could be formed in sheet 10, to carry heat away from TCN 16.
Referring to
By placing the structure 54 in the coolant chamber of TCN 52, coolant flowing through the chamber will become quite turbulent. This turbulence, in turn, will cause the fluid to be much more effective in dissipating heat that has been transferred to fluid in the chamber, from a semiconductor device in contact with member 52a.
Referring to
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the Claims below are intended to include any structure, material, or act for performing the function in combination with other Claimed elements as specifically Claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
The invention can take the form of an entirely hardware embodiment, an entirely method embodiment or an embodiment containing both hardware and method elements. In a preferred embodiment, the invention is implemented in process, which includes but is not limited to real components and parts and specific process steps to design, fabricate and utilize the invention.
The description of the present invention has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention, the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims
1. A method for constructing a heat exchanger for cooling one or more semiconductor components, said method comprising the steps of:
- providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has an exterior side and an interior side;
- forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections and contact member of a TCN collectively forming a coolant chamber;
- configuring channel segments along the interior side of the first sheet, wherein each channel segment extends between the coolant chambers of two or more TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively; and
- joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.
2. The method of claim 1, wherein:
- the side sections of at least one of said TCNs respectively include resilient components that collectively enable the contact member of the TCN to move toward and away from the exterior side of the first sheet.
3. The method of claim 1, wherein:
- a plurality of TCNs are formed in said first sheet, wherein each TCN has a dimension measured along a Z-axis that is orthogonal to said first sheet, and the Z-axis dimension of one of said TCNs is different from the Z-axis dimension of another of said
4. The method of claim 1, wherein:
- the resilient component of each of said side sections comprises a bellows structure.
5. The method of claim 1, wherein:
- one or more TCNs are formed in the second sheet, wherein each TCN formed in the second sheet extends outward from the exterior side of the second sheet, and comprises a planar contact member and one or more side sections.
6. The method of claim 1, wherein:
- the cross-section of one or more of said channel segments is made different from the cross-section of one or more other channel segments in order to cause said coolant to flow out of the coolant chamber of at least one of said TCNs at a different rate than it flows out of the coolant chamber of another of said TCNs.
7. The method of claim 1, wherein:
- selected structure is placed in a given coolant chamber, to cause turbulence of coolant flowing through the given coolant chamber.
8. The method of claim 1, wherein:
- said TCNs and channel segments are formed in the first sheet by means of an embossing process.
9. The method of claim 1, wherein:
- a laser welding process is used to join said first and second sheets together at regions that respectively surround each of said TCNs and each of said channel segments.
10. The method of claim 1, wherein:
- prior to forming said TCNs and configuring said channel segments, the interior sides of said first and second sheets are each coated with a selected barrier metal that does not react with said coolant.
11. The method of claim 1, wherein:
- said channel segments and coolant chambers collectively define a path of flow for said coolant from said input port to said output port.
12. Heat exchanger apparatus for cooling one or more semiconductor components, said apparatus comprising:
- a first planar sheet of specified thermally conductive foil that has an exterior side and an interior side, wherein one or more thermal contact nodes (TCNs) are formed in the first sheet, each TCN extending outward from the exterior side of the first sheet and comprising a planar contact member and one or more side sections, the side sections respectively including resilient components that collectively enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, the side sections and contact member of a TCN collectively forming a coolant chamber, and a channel segment is configured along the interior side of the first sheet, wherein each channel segment extends between the coolant chambers of two or more TCNs, or between the coolant chamber of a TCN and an input port or an output port, selectively;
- a second planar sheet of said specified thermally conductive foil that has an exterior side and an interior side; and
- means for joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.
13. The apparatus of claim 12, wherein:
- the resilient component of each side section comprises a bellows structure.
14. The apparatus of claim 12, wherein:
- the cross-section of one or more of the channel segments is made different from the cross-section of at least one or more other channel segments, in order to cause said coolant to flow out of the coolant chamber of one or more of said TCNs at a different rate than it flows out of the coolant chamber of another of said TCNs.
15. The apparatus of claim 12, wherein:
- selected liquid flow turbulence structure is placed in a given coolant chamber, to cause turbulence of coolant flowing through the given coolant chamber in order to increase the thermal transfer efficiency of the TCN.
16. The apparatus of claim 12, wherein:
- said TCNs and channel segments are formed in the first sheet by means of an embossing process.
17. The apparatus of claim 12, wherein:
- prior to forming said TCNs and configuring said channel segments, the interior sides of the first and second sheets are each coated with a selected barrier metal that does not react with said coolant.
18. A method for constructing a heat exchanger for cooling one or more semiconductor components, said method comprising the steps of:
- providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has an exterior side and an interior side;
- forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections and contact member of a TCN collectively forming a coolant chamber;
- configuring channel segments along the interior side of the first sheet, wherein each channel segment extends between the coolant chambers of two or more TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively;
- joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN;
- an input coolant connector joined to said input port for receiving coolant from a coolant circulating mechanism; and
- an output coolant connector joined to said output port for returning coolant to the coolant circulating mechanism.
19. The method of claim 18, wherein:
- a first one of said TCNs is adapted to contact a first semiconductor component, and a second one of said TCNs is adapted to contact a second semiconductor component, wherein said first and second semiconductor components are adjacent to each other, and have respective height dimensions that are different from each other.
20. The method of claim 18, wherein:
- the side sections of at least one of said TCNs respectively include resilient components that collectively enable the contact member of the TCN to move toward and away from the exterior side of the first sheet.
Type: Application
Filed: Jun 11, 2010
Publication Date: Dec 15, 2011
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
Inventors: Maurice F. Holahan (Lake City, MN), Eric V. Kline (Rochester, MN), Paul N. Krystek (Highland, NY), Michael R. Rasmussen (Mazeppa, MN), Arvind K. Sinha (Rochester, MN), Stephen M. Zins (Oronoco, MN)
Application Number: 12/814,175
International Classification: F28F 21/00 (20060101); B21D 53/02 (20060101);