Patents by Inventor Arye Rosen

Arye Rosen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4021750
    Abstract: A broad-band microwave amplifier including a semiconductor TRAPATT diode generating a microwave signal at its fundamental, second and third harmonic frequencies. Energy is extracted at the second harmonic frequency and a certain impedance loading is provided at the fundamental and third harmonic frequencies by an open-ended tapered microstrip idler circuit connected in parallel with the diode. The tapered idler circuit also provides a predetermined relatively small rate of change of impedance with respect to frequency changes to obtain a wide instantaneous bandwidth of the amplifier.
    Type: Grant
    Filed: December 24, 1975
    Date of Patent: May 3, 1977
    Assignee: RCA Corporation
    Inventors: Pang-Ting Ho, Arye Rosen
  • Patent number: 4005372
    Abstract: A frequency tunable microwave apparatus including a semiconductor TRAPATT diode generating a microwave signal at its fundamental, second and third harmonic frequencies. Energy is extracted at the second harmonic frequency and a certain impedance loading is provided at the fundamental frequency and third harmonic by a variable impedance hybrid idler circuit. The hybrid idler circuit comprises a distributed transmission line serially connected to a lumped variable capacitor. Variations in the capacitance of the variable capacitor tune the fundamental frequency without substantially varying the impedance loading conditions of the diode allowing energy to be extracted at the second harmonic frequency throughout the tunable frequency range.
    Type: Grant
    Filed: January 26, 1976
    Date of Patent: January 25, 1977
    Assignee: RCA Corporation
    Inventors: Pang-Ting Ho, Arye Rosen
  • Patent number: 3932226
    Abstract: An improved method of electrically interconnecting a plurality of spaced semiconductor elements adjacent to a substrate, each element having a mesa shape with a top surface spaced apart from the substrate and a side surface, includes coating the side surfaces of the elements with a protective material, filling in the space above the substrate and in between the elements with a temporary support material, depositing a continuous electrically-conductive layer on the support material and in electrical contact with the top surfaces of a plurality of the elements, and then removing the temporary support material to form an electrically-conductive homogeneous air-bridge. The protective material protects the elements from being exposed to the temporary support material. By this method, a plurality of metallized air-bridges can be formed simultaneously.
    Type: Grant
    Filed: December 6, 1974
    Date of Patent: January 13, 1976
    Assignee: RCA Corporation
    Inventors: Jerome Barnard Klatskin, Arye Rosen