Abstract: Embodiments of the invention relate to a camera assembly including a rear-facing camera and a front-facing camera operatively coupled together (e.g., bonded, stacked on a common substrate). In some embodiments of the invention, a system having an array of frontside illuminated (FSI) imaging pixels is bonded to a system having an array of backside illuminated (BSI) imaging pixels, creating a camera assembly with a minimal size (e.g., a reduced thickness compared to prior art solutions). An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. According to other embodiments of the invention, two package dies, one a BSI image sensor, the other an FSI image sensor, are stacked on a common substrate such as a printed circuit board, and are operatively coupled together via redistribution layers.

Abstract: Methods, systems, and computer-readable media for facilitating coordination between a fabric controller of a cloud-computing network and a service application running in the cloud-computing network are provided. Initially, an update domain (UD) that includes role instance(s) of the service application is selected, where the service application represents a stateful application is targeted for receiving a tenant job executed thereon. The process of coordination involves preparing the UD for execution of the tenant job, disabling the role instance(s) of the UD to an offline condition, allowing the tenant job to execute, and restoring the role instance(s) to an online condition upon completing execution of the tenant job.

Abstract: Embodiments of the invention relate to a camera assembly including a rear-facing camera and a front-facing camera operatively coupled together (e.g., bonded, stacked on a common substrate). In some embodiments of the invention, a system having an array of frontside illuminated (FSI) imaging pixels is bonded to a system having an array of backside illuminated (BSI) imaging pixels, creating a camera assembly with a minimal size (e.g., a reduced thickness compared to prior art solutions). An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. According to other embodiments of the invention, two package dies, one a BSI image sensor, the other an FSI image sensor, are stacked on a common substrate such as a printed circuit board, and are operatively coupled together via redistribution layers.

Abstract: An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type.

Abstract: An image sensor includes at least one photosensitive element disposed in a semiconductor substrate. Metal conductors may be disposed on the semiconductor substrate. A filter may be disposed between at least two individual metal conductors and a micro-lens may be disposed on the filter. There may be insulator material disposed between the metal conductors and the semiconductor substrate and/or between individual metal conductors. The insulator material may be removed so that the filter may be disposed on the semiconductor substrate.

Abstract: The traditional method of pressing CFx, screen and SVO sheet assembly results in an electrode that is cupped and not flat. This results in the reduction of the effective volumetric energy density of the electrode or the addition of a process step of flattening of the cathode if at all possible. The new method of assembly effectively eliminates the cupping behavior and produces a flat electrode. In addition, the physical density of the cathode is also increased.

Abstract: A health information services provider (HISP) application includes a controller, a transaction engine, a data encryption engine, an authentication engine, a user interface engine and a registration engine. The controller manages the core functions and transmission to the different components of the HISP application. The transaction engine routes messages and requests for joining a grid. The data encryption engine encrypts or decrypts messages. The authentication engine verifies messages. The user interface engine generates a user interface for exchanging healthcare information between providers. The registration engine registers providers to exchange healthcare information with other providers.

Abstract: Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions.

Abstract: The traditional method of pressing CFx, screen and SVO sheet assembly results in an electrode that is cupped and not flat. This results in the reduction of the effective volumetric energy density of the electrode or the addition of a process step of flattening of the cathode if at all possible. The new method of assembly effectively eliminates the cupping behavior and produces a flat electrode. In addition, the physical density of the cathode is also increased.

Abstract: Embodiments described herein relate to a substrate processing system that integrates substrate edge processing capabilities. Illustrated examples of the processing system include, without limitations, a factory interface, a loadlock chamber, a transfer chamber, and one or more twin process chambers having two or more processing regions that are isolatable from each other and share a common gas supply and a common exhaust pump. The processing regions in each twin process chamber include separate gas distribution assemblies and RF power sources to provide plasma at selective regions on a substrate surface in each processing region. Each twin process chamber is thereby configured to allow multiple, isolated processes to be performed concurrently on at least two substrates in the processing regions.

Abstract: An image sensor includes an optical sensor region, a stack of dielectric and metal layers, and an embedded layer. The optical sensor is disposed within a semiconductor substrate. The stack of dielectric and metal layers are disposed on the front side of the semiconductor substrate above the optical sensor region. The embedded focusing layer is disposed on the backside of the semiconductor substrate in a Backside Illuminated (BSI) image sensor, supported by a support grid, or a support grid composed of the semiconductor substrate.

Abstract: A distributed application may be updated by using information provided by the application to determine grouping, sequencing, and whether or not to advance an update sequence. The application may provide input to an update sequence, and may cause the update sequence to repair one or more replicas prior to updating. The update mechanism may be used to change the distributed application topology as well as make changes to the application executable code, application configuration, quest operating system, virtual machine, and host systems, among others. In some cases, the distributed application may use a quorum to determine which version is current, and the quorum may change during the update process.

Abstract: Several embodiments of the present invention comprise a storage platform that provides a synchronization service that (i) allows multiple instances of the storage platform (each with its own data store) to synchronize parts of their content according to a flexible set of rules, and (ii) provides an infrastructure for third parties to synchronize the data store of the storage platform of the present invention with with other data sources that implement proprietary protocols. In various embodiments, storage-platform-to-storage-platform synchronization occurs among a group of participating “replicas.” For example, it may be desirable to provide synchronization between the data store of the storage platform with another remote data store under the control of another instance of the storage platform, perhaps running on a different computer system.

Abstract: The traditional method of building a CFx/current collector/SVO assembly is by the application of a static pressing force. However, the density of the electrode and, particularly the CFx component, can be increase by using a cyclic pressing protocol. That is where the active materials are formed into a blank or contacted to a current collector by the use of at least two pressing events separated by a period when the pressure is removed. Not only does this cyclic pressing protocol increase the density of the CFx material, it also provides an electrode that is relatively flat, and not cupped. Conventional pressing techniques often result in badly cupped electrodes, especially when disparate active materials are contacting opposite sides of the current collector. Cupping consequently reduces the effective volumetric energy density of the electrode or necessitates the addition of a process step of flattening of the cathode, if at all possible.

Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.

Abstract: The traditional method of building a CFx/current collector/SVO assembly is by the application of a static pressing force. However, the density of the electrode and, particularly the CFx component, can be increase by using a cyclic pressing protocol. That is where the active materials are formed into a blank or contacted to a current collector by the use of at least two pressing events separated by a period when the pressure is removed. Not only does this cyclic pressing protocol increase the density of the CFx material, it also provides an electrode that is relatively flat, and not cupped. Conventional pressing techniques often result in badly cupped electrodes, especially when disparate active materials are contacting opposite sides of the current collector. Cupping consequently reduces the effective volumetric energy density of the electrode or necessitates the addition of a process step of flattening of the cathode, if at all possible.

Abstract: Several embodiments of the present invention comprise a storage platform that provides a synchronization service that (i) allows multiple instances of the storage platform (each with its own data store) to synchronize parts of their content according to a flexible set of rules, and (ii) provides an infrastructure for third parties to synchronize the data store of the storage platform of the present invention with with other data sources that implement proprietary protocols. In various embodiments, storage-platform-to-storage-platform synchronization occurs among a group of participating “replicas.” For example, it may be desirable to provide synchronization between the data store of the storage platform with another remote data store under the control of another instance of the storage platform, perhaps running on a different computer system.

Abstract: An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type.

Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.

Abstract: An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type.