Patents by Inventor Ashish Verma

Ashish Verma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11551145
    Abstract: Systems, computer-implemented methods, and computer program products that can facilitate switching a model training process from a ground truth training phase to an adversarial training phase based on performance of a model trained in the ground truth training phase are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise an analysis component that identifies a performance condition of a model trained in a model training process. The computer executable components can further comprise a trainer component that switches the model training process from a ground truth training process to an adversarial training process based on the identified performance condition.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: January 10, 2023
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sidharth Gupta, Parijat Dube, Ashish Verma
  • Patent number: 11532439
    Abstract: Described is an ultra-dense ferroelectric memory. The memory is fabricated using a patterning method by that applies atomic layer deposition with selective dry and/or wet etch to increase memory density at a given via opening. A ferroelectric capacitor in one example comprises: a first structure (e.g., first electrode) comprising metal; a second structure (e.g., a second electrode) comprising metal; and a third structure comprising ferroelectric material, wherein the third structure is between and adjacent to the first and second structures, wherein a portion of the third structure is interdigitated with the first and second structures to increase surface area of the third structure. The increased surface area allows for higher memory density.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: December 20, 2022
    Assignee: Intel Corporation
    Inventors: Chia-Ching Lin, Sou-Chi Chang, Nazila Haratipour, Seung Hoon Sung, Ashish Verma Penumatcha, Jack Kavalieros, Uygar E. Avci, Ian A. Young
  • Publication number: 20220374762
    Abstract: Techniques for distributed federated learning leverage a multi-layered defense strategy to provide for reduced information leakage. In lieu of aggregating model updates centrally, an aggregation function is decentralized into multiple independent and functionally-equivalent execution entities, each running within its own trusted executed environment (TEE). The TEEs enable confidential and remote-attestable federated aggregation. Preferably, each aggregator entity runs within an encrypted virtual machine that support runtime in-memory encryption. Each party remotely authenticates the TEE before participating in the training. By using multiple decentralized aggregators, parties are enabled to partition their respective model updates at model-parameter granularity, and can map single weights to a specific aggregator entity. Parties also can dynamically shuffle fragmentary model updates at each training iteration to further obfuscate the information dispatched to each aggregator execution entity.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 24, 2022
    Applicant: International Business Machines Corporation
    Inventors: Jayaram Kallapalayam Radhakrishnan, Ashish Verma, Zhongshu Gu, Enriquillo Valdez, Pau-Chen Cheng, Hani Talal Jamjoom
  • Publication number: 20220374763
    Abstract: Techniques for distributed federated learning leverage a multi-layered defense strategy to provide for reduced information leakage. In lieu of aggregating model updates centrally, an aggregation function is decentralized into multiple independent and functionally-equivalent execution entities, each running within its own trusted executed environment (TEE). The TEEs enable confidential and remote-attestable federated aggregation. Preferably, each aggregator entity runs within an encrypted virtual machine that support runtime in-memory encryption. Each party remotely authenticates the TEE before participating in the training. By using multiple decentralized aggregators, parties are enabled to partition their respective model updates at model-parameter granularity, and can map single weights to a specific aggregator entity. Parties also can dynamically shuffle fragmentary model updates at each training iteration to further obfuscate the information dispatched to each aggregator execution entity.
    Type: Application
    Filed: May 18, 2021
    Publication date: November 24, 2022
    Applicant: International Business Machines Corporation
    Inventors: Zhongshu Gu, Jayaram Kallapalayam Radhakrishnan, Ashish Verma, Enriquillo Valdez, Pau-Chen Cheng, Hani Talal Jamjoom, Kevin Eykholt
  • Publication number: 20220358358
    Abstract: Methods, systems, and computer program products for accelerating inference of neural network models via dynamic early exits are provided herein. A computer-implemented method includes determining a plurality of candidate exit points of a neural network model; obtaining a plurality of outputs of the neural network model for data samples in a target dataset, wherein the plurality of outputs comprises early outputs of the neural network model from the plurality of candidate exit points and regular outputs of the neural network model; and a set of one or more exit points from the plurality of candidate exits points that are dependent on the target dataset based at least in part on the plurality of outputs.
    Type: Application
    Filed: May 4, 2021
    Publication date: November 10, 2022
    Inventors: Saurabh Manish Raje, Saurabh Goyal, Anamitra Roy Choudhury, Yogish Sabharwal, Ashish Verma
  • Publication number: 20220343218
    Abstract: Embodiments relate to an input-encoding technique in conjunction with federation. Participating entities are arranged in a collaborative relationship. Each participating entity trains a machine learning model with an encoder on a training data set. The performance of each of the models is measured and at least one of the models is selectively identified based on the measured performance. An encoder of the selectively identified machine learning model is shared with each of the participating entities. The shared encoder is configured to be applied by the participating entities to train the first and second machine learning models, which are configured to be merged and shared in the federated learning environment.
    Type: Application
    Filed: April 26, 2021
    Publication date: October 27, 2022
    Applicant: International Business Machines Corporation
    Inventors: Hazar Yueksel, Brian E. D. Kingsbury, Kush Raj Varshney, Pradip Bose, Dinesh C. Verma, Shiqiang Wang, Augusto Vega, ASHISH VERMA, SUPRIYO CHAKRABORTY
  • Patent number: 11418060
    Abstract: Systems, methods and apparatus for wireless charging are disclosed. A charging device has a resonant circuit comprising one or more transmitting coils, a driver circuit configured to provide a charging current to the resonant circuit, a zero-crossing detector configured to provide a zero-crossing signal that includes edges corresponding to transitions of a voltage measured across the resonant circuit through a zero volt level or corresponding to transitions of a current in the resonant circuit through a zero ampere level and a controller. The controller may be configured to cause the driver circuit to provide the charging current to the resonant circuit when a receiving device is present on a surface of the charging device, and control a level of power that is wirelessly transferred to the receiving device by phase-aligning the charging current with a phase-modulation signal generated from the zero-crossing signal.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: August 16, 2022
    Assignee: AIRA, INC.
    Inventors: Eric Heindel Goodchild, James Scott, Ashish Verma
  • Patent number: 11410083
    Abstract: Methods, systems, and computer program products for determining operating range of hyperparameters are provided herein. A computer-implemented method includes obtaining a machine learning model, a list of candidate values for a hyperparameter, and a dataset; performing one or more hyperparameter range trials based on the machine learning model, the list of candidate values for the hyperparameter, and the dataset; automatically determining an operating range of the hyperparameter based on the one or more hyperparameter range trials; and training the machine learning model to convergence based at least in part on the determined operating range.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: August 9, 2022
    Assignee: International Business Machines Corporation
    Inventors: Shrihari Vasudevan, Alind Khare, Koyel Mukherjee, Yogish Sabharwal, Ashish Verma
  • Publication number: 20220215290
    Abstract: Methods, systems, and computer program products for cognitive disambiguation of problem-solving tasks involving a power grid are provided herein. A computer-implemented method includes capturing user feedback pertaining to relevance of remote terminal unit measurements related to a grid event through user interface interactions carried out by the user, wherein the user interface is communicatively linked to at least one computing device; automatically inferring rules related to the grid event to curate remote terminal unit measurements across iterations of analysis by recognizing irrelevant data and/or distractions in a visual display associated with the user interface, wherein said automatically inferring comprises implementing machine learning via the at least one computing device based on the user feedback; and outputting candidate solutions to a problem-solving task involving the grid based on the inferred rules, wherein said outputting is carried out by the at least one computing device.
    Type: Application
    Filed: November 15, 2021
    Publication date: July 7, 2022
    Applicant: Utopus Insights, Inc.
    Inventors: Chumki Basu, Ashish Verma
  • Publication number: 20220199799
    Abstract: Thin film transistors having boron nitride integrated with two-dimensional (2D) channel materials are described. In an example, an integrated circuit structure includes a first gate stack above a substrate. A 2D channel material layer is above the first gate stack. A second gate stack is above the 2D channel material layer, the second gate stack having a first side opposite a second side. A first conductive contact is adjacent the first side of the second gate stack and in contact with the 2D channel material layer. A second conductive contact is adjacent the second side of the second gate stack and in contact with the 2D channel material layer. A hexagonal boron nitride (hBN) layer is included between the first gate stack and the 2D channel material layer, between the second gate stack and the 2D channel material layer, or both.
    Type: Application
    Filed: December 22, 2020
    Publication date: June 23, 2022
    Inventors: Kevin P. O'BRIEN, Chelsey DOROW, Carl NAYLOR, Kirby MAXEY, Tanay GOSAVI, Uygar E. AVCI, Ashish Verma PENUMATCHA, Chia-Ching LIN, Shriram SHIVARAMAN, Sudarat LEE
  • Publication number: 20220199812
    Abstract: Transistor structures with monocrystalline metal chalcogenide channel materials are formed from a plurality of template regions patterned over a substrate. A crystal of metal chalcogenide may be preferentially grown from a template region and the metal chalcogenide crystals then patterned into the channel region of a transistor. The template regions may be formed by nanometer-dimensioned patterning of a metal precursor, a growth promoter, a growth inhibitor, or a defected region. A metal precursor may be a metal oxide suitable, which is chalcogenated when exposed to a chalcogen precursor at elevated temperature, for example in a chemical vapor deposition process.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 23, 2022
    Applicant: Intel Corporation
    Inventors: Carl Naylor, Chelsey Dorow, Kevin O'Brien, Sudarat Lee, Kirby Maxey, Ashish Verma Penumatcha, Tanay Gosavi, Patrick Theofanis, Chia-Ching Lin, Uygar Avci, Matthew Metz, Shriram Shivaraman
  • Publication number: 20220199519
    Abstract: Metal insulator metal capacitors are described. In an example, a metal-insulator-metal (MIM) capacitor includes a first electrode plate, and a first capacitor dielectric on the first electrode plate. The first capacitor dielectric is or includes a perovskite high-k dielectric material. A second electrode plate is on the first capacitor dielectric and has a portion over and parallel with the first electrode plate, and a second capacitor dielectric is on the second electrode plate. A third electrode plate is on the second capacitor dielectric and has a portion over and parallel with the second electrode plate.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 23, 2022
    Inventors: Chia-Ching LIN, Sou-Chi CHANG, Kaan OGUZ, I-Cheng TUNG, Arnab SEN GUPTA, Ian A. YOUNG, Uygar E. AVCI, Matthew V. METZ, Ashish Verma PENUMATCHA, Anandi ROY
  • Publication number: 20220199783
    Abstract: A transistor includes a first channel layer over a second channel layer, where the first and the second channel layers include a monocrystalline transition metal dichalcogenide (TMD). The transistor structure further includes a source structure coupled to a first end of the first and second channel layers, a drain structure coupled to a second end of the first and second channel layers, a gate structure between the source material and the drain material, and between the first channel layer and the second channel layer. The transistor further includes a spacer laterally between the gate structure and the and the source structure and between the gate structure and the drain structure. A liner is between the spacer and the gate structure. The liner is in contact with the first channel layer and the second channel layer and extends between the gate structure and the respective source structure and the drain structure.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Applicant: Intel Corporation
    Inventors: Ashish Verma Penumatcha, Kevin O'Brien, Chelsey Dorow, Kirby Maxey, Carl Naylor, Tanay Gosavi, Sudarat Lee, Chia-Ching Lin, Seung Hoon Sung, Uygar Avci
  • Publication number: 20220199833
    Abstract: A memory device structure includes a transistor structure including a gate electrode over a top surface of a fin and adjacent to a sidewall of the fin, a source structure coupled to a first region of the fin and a drain structure coupled to a second region of the fin, where the gate electrode is between the first and the second region. A gate dielectric layer is between the fin and the gate electrode. The memory device structure further includes a capacitor coupled with the transistor structure, the capacitor includes the gate electrode, a ferroelectric layer on a substantially planar uppermost surface of the gate electrode and a word line on the ferroelectric layer.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Applicant: Intel Corporation
    Inventors: Shriram Shivaraman, Uygar Avci, Ashish Verma Penumatcha, Nazila Haratipour, Seung Hoon Sung, Sou-Chi Chang
  • Publication number: 20220199838
    Abstract: A transistor includes a channel layer including a transition metal dichalcogenide (TMD) material, an encapsulation layer on a first portion of the channel layer, a gate electrode above the encapsulation layer, a gate dielectric layer between the gate electrode and the encapsulation layer. The transistor further includes a source contact on a second portion of the channel layer and a drain contact on a third portion of the channel layer, where the gate structure is between drain contact and the source contact.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Applicant: Intel Corporation
    Inventors: Chelsey Dorow, Kevin O'Brien, Carl Naylor, Uygar Avci, Sudarat Lee, Ashish Verma Penumatcha, Chia-Ching LIn, Tanay Gosavi, Shriram Shivaraman, Kirby Maxey
  • Publication number: 20220199619
    Abstract: A complementary metal oxide semiconductor (CMOS) transistor includes a first transistor with a first gate dielectric layer above a first channel, where the first gate dielectric layer includes Hf1-xZxO2, where 0.33<x<0.5. The first transistor further includes a first gate electrode on the first gate dielectric layer and a first source region and a first drain region on opposite sides of the first gate electrode. The CMOS transistor further includes a second transistor adjacent to the first transistor. The second transistor includes a second gate dielectric layer above a second channel, where the second gate dielectric layer includes Hf1-xZxO2, where 0.5<x<0.99, a second gate electrode on the second gate dielectric layer and a second source region and a second drain region on opposite sides of the second gate electrode.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Applicant: Intel Corporation
    Inventors: Ashish Verma Penumatcha, Seung Hoon Sung, Jack Kavalieros, Uygar Avci, Tristan Tronic, Shriram Shivaraman, Devin Merrill, Tobias Brown-Heft, Kirby Maxey, Matthew Metz, Ian Young
  • Publication number: 20220188692
    Abstract: A computer-implemented method of determining an agent data attribution and selection to perform a collaborative data-related task includes computing an agent data attribution score for each agent of the plurality of agents associated with the collaborative data-related task. A subset of the plurality of agents that participate in the collaborative data-related task is selected based on the agent data attribution score. An instruction is transmitted to the selected subset of the plurality of agents for each agent to conduct a respective portion of the collaborative data-related task.
    Type: Application
    Filed: December 14, 2020
    Publication date: June 16, 2022
    Inventors: Supriyo Chakraborty, Ashish Verma, Dinesh C. Verma
  • Publication number: 20220180146
    Abstract: A system, computer program product, and method are presented for performing multi-objective automated machine learning, and, more specifically, to identifying a plurality of machine learning pipelines as Pareto-optimal solutions to optimize a plurality of objectives. The method includes receiving input data directed toward one or more subjects of interest and determining a plurality of objectives to be optimized. The method also includes ingesting at least a portion of the input data through one or more machine learning (ML) models. The method further includes aggregating the plurality of objectives into one or more aggregated single objectives. The method also includes determining a plurality of Pareto-optimal solutions, thereby defining a plurality of ML pipelines that optimize the one or more aggregated single objectives. The method further includes selecting one ML pipeline from the plurality of ML pipelines.
    Type: Application
    Filed: December 8, 2020
    Publication date: June 9, 2022
    Inventors: Vaibhav Saxena, Aswin Kannan, Saurabh Manish Raje, Parikshit Ram, Yogish Sabharwal, Ashish Verma
  • Publication number: 20220181433
    Abstract: Disclosed herein are capacitors including built-in electric fields, as well as related devices and assemblies. In some embodiments, a capacitor may include a top electrode region, a bottom electrode region, and a dielectric region between and in contact with the top electrode region and the bottom electrode region, wherein the dielectric region includes a perovskite material, and the top electrode region has a different material structure than the bottom electrode region.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 9, 2022
    Applicant: Intel Corporation
    Inventors: Sou-Chi Chang, Chia-Ching Lin, Kaan Oguz, I-Cheng Tung, Uygar E. Avci, Matthew V. Metz, Ashish Verma Penumatcha, Ian A. Young, Arnab Sen Gupta
  • Publication number: 20220149192
    Abstract: Thin film transistors having electrostatic double gates are described. In an example, an integrated circuit structure includes an insulator layer above a substrate. A first gate stack is on the insulator layer. A 2D channel material layer is on the first gate stack. A second gate stack is on a first portion of the 2D channel material layer, the second gate stack having a first side opposite a second side. A first conductive contact is adjacent the first side of the second gate stack, the first conductive contact on a second portion of the 2D channel material layer. A second conductive contact is adjacent the second side of the second gate stack, the second conductive contact on a third portion of the 2D channel material layer. A gate electrode of the first gate stack extends beneath a portion of the first conductive contact and beneath a portion of the second conductive contact.
    Type: Application
    Filed: November 9, 2020
    Publication date: May 12, 2022
    Inventors: Kirby MAXEY, Ashish Verma PENUMATCHA, Carl NAYLOR, Chelsey DOROW, Kevin P. O'BRIEN, Shriram SHIVARAMAN, Tanay GOSAVI, Uygar E. AVCI, Sudarat LEE