Patents by Inventor Atsushi Okamoto

Atsushi Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135246
    Abstract: A data generation method for generating data for domain generalization in machine learning includes performing, with a computer, augmentation using training data as raw data usable to train a machine learning model, and extracting, with the computer, a dataset including the raw data and data generated through the augmentation as a dataset for the domain generalization.
    Type: Application
    Filed: January 18, 2022
    Publication date: April 25, 2024
    Inventors: Mami Miyamoto, Seitaro Mura, Yuki Hirohashi, Atsushi Hashimoto, Takahiro Toku, Naoki Tsuchiya, Yoshihisa Ijiri, Yamato Okamoto
  • Patent number: 11959932
    Abstract: According to one embodiment, an automatic analyzing apparatus includes a probe and a liquid level detector. The liquid level detector is electrically connected to the probe and detects contact between the probe and a liquid surface, wherein the liquid level detector comprises an adjuster configured to adjust electrostatic capacitance of one or more capacitors for circuitry for use in liquid level detection.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: April 16, 2024
    Assignee: Canon Medical Systems Corporation
    Inventors: Mitsuo Okamoto, Naoto Sato, Reiko Maruyama, Masaaki Saitou, Atsushi Hosooka, Tamaki Honda
  • Publication number: 20240082455
    Abstract: This embolic material is produced by a production method including a step for dispersing a mixture that contains a biodegradable polymer, an oil-based contrast agent, and a solvent in a hydrophilic liquid. The biodegradable polymer has a hydrophobic biodegradable polymer.
    Type: Application
    Filed: January 21, 2022
    Publication date: March 14, 2024
    Inventors: Terumitsu HASEBE, Yutaka OKAMOTO, Kenta BITO, Atsushi HOTTA
  • Patent number: 11852379
    Abstract: A water heating system includes: a refrigerant circuit that includes a compressor and in which a refrigerant flows; and a water circuit in which water flows. The refrigerant circuit shares with the water circuit a water heat exchanger that heats the water using the refrigerant discharged from the compressor. The water heat exchanger includes a first heat-exchanging unit in which the refrigerant exchanges heat with the water at a water outlet portion. The refrigerant circuit further includes a heat radiator that is disposed between the compressor and the first heat-exchanging unit and that radiates heat of the refrigerant discharged from the compressor. The heat radiator is configured to radiate heat of the refrigerant to water that flows on an upstream side of the water outlet portion.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: December 26, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hideho Sakaguchi, Masanori Ukibune, Atsushi Okamoto, Yasuhiro Kouno
  • Patent number: 11799471
    Abstract: A semiconductor device includes a first area including a logic circuit, a second area including a functional circuit, a first power line, a second power line that supplies a power to the logic circuit and the functional circuit, and a first power switch circuit connected to the first power line and the second power line, wherein the first power switch circuit includes a first transistor larger than a transistor provided in the logic circuit and being connected to the first power line and the second power line, an end cap provided in an area next to the functional circuit, and a second transistor provided between the end cap and an area including the first transistor, the second transistor being of a same size as the transistor provided in the logic circuit and being connected to the first power line and the second power line.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: October 24, 2023
    Assignee: SOCIONEXT INC.
    Inventors: Atsushi Okamoto, Hirotaka Takeno, Junji Iwahori
  • Publication number: 20230302562
    Abstract: A copper-ceramic joint body having high joint strength is provided. The copper-ceramic joint body includes: a copper member made of Cu or Cu alloy; a ceramic member joined to the copper member and made of nitride of Si or Al; and a joint layer formed on joint surfaces of the copper member and the ceramic member, and containing Cu and Mg and further containing at least one type of active metal elements selected from a group of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er, and shear strength of the joint layer is equal to or higher than 10 MPa.
    Type: Application
    Filed: March 23, 2023
    Publication date: September 28, 2023
    Inventors: Takashi NOGAWA, Shun TAKANO, Kenji OKISHIRO, Atsushi OKAMOTO
  • Publication number: 20230223381
    Abstract: A semiconductor integrated circuit device includes first and second semiconductor chips stacked one on top of the other. First power supply lines in the first semiconductor chip are connected with second power supply lines in the second semiconductor chip through a plurality of first vias. The directions in which the first power supply lines and the second power supply lines extend are orthogonal to each other.
    Type: Application
    Filed: March 6, 2023
    Publication date: July 13, 2023
    Inventors: Atsushi OKAMOTO, Hirotaka TAKENO, Wenzhen WANG
  • Patent number: 11674695
    Abstract: A controller performs a first operation in which a heat source device directly or indirectly heats water in a first channel of a heat exchanger and a second operation in which the heat source device directly or indirectly cools the water in the first channel of the heat exchanger after the first operation ends.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: June 13, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hideho Sakaguchi, Atsushi Okamoto, Masanori Ukibune, Yasuhiro Kouno, Yurika Gotou, Qi Fang, Tim Coessens
  • Patent number: 11645003
    Abstract: According to one embodiment, a memory system includes a non-volatile memory, and a controller configured to control the non-volatile memory. The controller is configured to write data to the non-volatile memory, read the written data from the non-volatile memory after writing of the data is completed, generate parity data corresponding to the read data, and write the generated parity data to a memory for parity storage.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: May 9, 2023
    Assignee: Kioxia Corporation
    Inventors: Atsushi Okamoto, Tetsuya Yasuda, Akinori Nagaoka
  • Publication number: 20230120959
    Abstract: A semiconductor device includes a first area including a logic circuit, a second area including a functional circuit, a first power line, a second power line that supplies a power to the logic circuit and the functional circuit, and a first power switch circuit connected to the first power line and the second power line, wherein the first power switch circuit includes a first transistor larger than a transistor provided in the logic circuit and being connected to the first power line and the second power line, an end cap provided in an area next to the functional circuit, and a second transistor provided between the end cap and an area including the first transistor, the second transistor being of a same size as the transistor provided in the logic circuit and being connected to the first power line and the second power line.
    Type: Application
    Filed: December 20, 2022
    Publication date: April 20, 2023
    Inventors: Atsushi OKAMOTO, Hirotaka TAKENO, Junji IWAHORI
  • Patent number: 11626386
    Abstract: A semiconductor integrated circuit device includes first and second semiconductor chips stacked one on top of the other. First power supply lines in the first semiconductor chip are connected with second power supply lines in the second semiconductor chip through a plurality of first vias. The directions in which the first power supply lines and the second power supply lines extend are orthogonal to each other.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: April 11, 2023
    Assignee: SOCIONEXT INC.
    Inventors: Atsushi Okamoto, Hirotaka Takeno, Wenzhen Wang
  • Publication number: 20230028896
    Abstract: A water heating system includes: a refrigerant circuit that includes a compressor and in which a refrigerant flows; and a water circuit in which water flows. The refrigerant circuit shares with the water circuit a water heat exchanger that heats the water using the refrigerant discharged from the compressor. The water heat exchanger includes a first heat-exchanging unit in which the refrigerant exchanges heat with the water at a water outlet portion. The refrigerant circuit further includes a heat radiator that is disposed between the compressor and the first heat-exchanging unit and that radiates heat of the refrigerant discharged from the compressor. The heat radiator is configured to radiate heat of the refrigerant to water that flows on an upstream side of the water outlet portion.
    Type: Application
    Filed: September 30, 2022
    Publication date: January 26, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hideho Sakaguchi, Masanori Ukibune, Atsushi Okamoto, Yasuhiro Kouno
  • Patent number: 11563432
    Abstract: A semiconductor device includes a first area including a logic circuit, a second area including a functional circuit, a first power line, a second power line that supplies a power to the logic circuit and the functional circuit, and a first power switch circuit connected to the first power line and the second power line, wherein the first power switch circuit includes a first transistor larger than a transistor provided in the logic circuit and being connected to the first power line and the second power line, an end cap provided in an area next to the functional circuit, and a second transistor provided between the end cap and an area including the first transistor, the second transistor being of a same size as the transistor provided in the logic circuit and being connected to the first power line and the second power line.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: January 24, 2023
    Assignee: SOCIONEXT INC.
    Inventors: Atsushi Okamoto, Hirotaka Takeno, Junji Iwahori
  • Publication number: 20220403289
    Abstract: A fragrance composition containing a compound represented by Formula (1) as an active ingredient: where in Formula (1), R1 represents a chain hydrocarbon group having from 7 to 20 carbons, and may be linear or branched, and a saturated group or an unsaturated group, and when R1 is an unsaturated group, R1 may have one or more carbon-carbon double bond(s) or carbon-carbon triple bond(s).
    Type: Application
    Filed: December 22, 2020
    Publication date: December 22, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Atsushi OKAMOTO, Kyoko HIRAOKA, Umi YOKOBORI
  • Publication number: 20220402857
    Abstract: A fragrance composition containing a compound represented by Formula (1) as an active ingredient: where in Formula (1), R1 represents a linear, branched, or cyclic alkyl group having from 1 to 4 carbon(s); and R2 represents a linear, branched, or cyclic alkyl group having from 1 to 6 carbon(s).
    Type: Application
    Filed: December 22, 2020
    Publication date: December 22, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Atsushi OKAMOTO, Kyoko HIRAOKA, Wataru HAMAJIMA, Umi YOKOBORI
  • Patent number: 11485931
    Abstract: A fragrance composition comprising a compound represented by Formula (1) as an active ingredient: wherein, in Formula (1), R1 represents a linear, branched, or cyclic alkyl group having 1 to 6 carbon atoms.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: November 1, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Atsushi Okamoto, Eriko Kushida, Umi Yokobori
  • Patent number: 11485932
    Abstract: A fragrance composition comprising a compound represented by Formula (1) as an active ingredient: wherein, in Formula (1), R1 represents a linear, branched, or cyclic alkyl group having 1 to 5 carbon atoms.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: November 1, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Atsushi Okamoto, Eriko Kushida, Umi Yokobori, Kyoko Kimura
  • Patent number: 11479738
    Abstract: A fragrance composition comprising a compound represented by Formula (1): wherein, in Formula (1), R represents a linear or branched alkyl group having from 2 to 3 carbon atoms or a cyclic alkyl group having from 3 to 6 carbon atoms.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: October 25, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Atsushi Okamoto, Umi Yokobori, Eriko Kushida, Masaki Takemoto
  • Publication number: 20220300189
    Abstract: According to one embodiment, a memory system includes a non-volatile memory, and a controller configured to control the non-volatile memory. The controller is configured to write data to the non-volatile memory, read the written data from the non-volatile memory after writing of the data is completed, generate parity data corresponding to the read data, and write the generated party data to a memory for parity storage.
    Type: Application
    Filed: June 15, 2021
    Publication date: September 22, 2022
    Inventors: Atsushi Okamoto, Tetsuya Yasuda, Akinori Nagaoka
  • Publication number: 20220293634
    Abstract: A semiconductor device includes a first chip including a substrate and a first wiring layer formed on a first surface of the substrate; and a second wiring layer formed on a second surface of the substrate opposite to the first surface of the substrate. The second wiring layer includes a first power line to which a first power potential is applied; a second power line to which a second power potential is applied; a third power line to which a third power potential is applied; a first switch connected between the first power line and the second power line; and a second switch provided on one of the first power line or the third power line. The first chip includes a first circuit provided between the first power line and the third power line.
    Type: Application
    Filed: May 31, 2022
    Publication date: September 15, 2022
    Inventors: Atsushi OKAMOTO, Hirotaka Takeno, Wenzhen Wang