Abstract: According to one embodiment, a semiconductor memory device includes a bit line electrically connected to a memory cell, a first node electrically connected to the bit line, a first driver configured to increase a voltage of the first node to a first voltage, a first buffer circuit configured to store data based on the voltage of the first node, a bus electrically connected to the first buffer circuit, a first transistor electrically connected between the first node and the bus, and a second buffer circuit electrically connected to the bus. The first buffer circuit is electrically connected to an input terminal of the first driver. The first driver changes a voltage of the bus based on the data stored in the first buffer circuit.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A photoelectric conversion element includes: a first compound semiconductor layer 31 made of a first compound semiconductor material having a first conductivity type; a photoelectric conversion layer 34 formed on the first compound semiconductor layer 31; a second compound semiconductor layer 32 covering the photoelectric conversion layer 34 and made of a second compound semiconductor material having the first conductivity type; a second conductivity type region 35 formed at least in a part of the second compound semiconductor layer 32, having a second conductivity type different from the first conductivity type, and reaching the photoelectric conversion layer; an element isolation layer 34 surrounding a lateral surface of the photoelectric conversion layer; a first electrode 51 formed on the second conductivity type region; and a second electrode 52 electrically connected to the first compound semiconductor layer 31.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A DC power supply unit is provided that allows for improving efficiency and reducing harmonic currents. A DC power supply unit includes: a bridge rectification circuit having diodes and MOSFETs; a reactor that is arranged between the AC power supply and the bridge rectifier circuit; a smoothing capacitor that is connected to an output side of the bridge rectifier circuit and smoothes a voltage; and a converter control unit that executes, based on predetermined threshold values, a diode rectification control that uses diodes and parasitic diodes of the MOSFETs, a synchronous rectification control that switches the MOSFETs in synchronization with a polarity of the voltage of the AC power supply, a partial switching control that repeats partially short-circuiting the reactor multiple times in a half cycle of the AC power supply, or a fast switching control that short-circuits the reactor at a predetermined frequency over a full AC cycle.

Abstract: To realize miniaturization of a pixel, reduction in noise, and high quantum efficiency, and to improve short-wavelength sensitivity while suppressing inter-pixel interference and variations for each pixel. According to the present disclosure, there is provided an imaging device including: a first semiconductor layer formed in a semiconductor substrate; a second semiconductor layer of a conductivity type opposite to a conductivity type of the first semiconductor layer formed on the first semiconductor layer; a pixel separation unit which defines a pixel region including the first semiconductor layer and the second semiconductor layer; a first electrode which is connected to the first semiconductor layer from one surface side of the semiconductor substrate; and a second electrode which is connected to the second semiconductor layer from a light irradiation surface side that is the other surface of the semiconductor substrate, and is formed to correspond to a position of the pixel separation unit.

Abstract: A photoelectric conversion element includes: a first compound semiconductor layer 31 made of a first compound semiconductor material having a first conductivity type; a photoelectric conversion layer 34 formed on the first compound semiconductor layer 31; a second compound semiconductor layer 32 covering the photoelectric conversion layer 34 and made of a second compound semiconductor material having the first conductivity type; a second conductivity type region 35 formed at least in a part of the second compound semiconductor layer 32, having a second conductivity type different from the first conductivity type, and reaching the photoelectric conversion layer; an element isolation layer 34 surrounding a lateral surface of the photoelectric conversion layer; a first electrode 51 formed on the second conductivity type region; and a second electrode 52 electrically connected to the first compound semiconductor layer 31.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A DC power supply unit is provided that allows for improving efficiency and reducing harmonic currents. A DC power supply unit includes: a bridge rectification circuit having diodes and MOSFETs; a reactor that is arranged between the AC power supply and the bridge rectifier circuit; a smoothing capacitor that is connected to an output side of the bridge rectifier circuit and smoothes a voltage; and a converter control unit that executes, based on predetermined threshold values, a diode rectification control that uses diodes and parasitic diodes of the MOSFETs, a synchronous rectification control that switches the MOSFETs in synchronization with a polarity of the voltage of the AC power supply, a partial switching control that repeats partially short-circuiting the reactor multiple times in a half cycle of the AC power supply, or a fast switching control that short-circuits the reactor at a predetermined frequency over a full AC cycle.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A lens holder driving device includes a lens holder in which a lens assembly is mounted, a driving coil fixed to the lens holder at outside circumference thereof, a magnet opposite to the driving coil, a yoke including the magnet, an elastic member supporting the lens holder in a direction of an optical axis shiftably, and a base disposed at a lower side of the lens holder. The yoke includes an outer yoke including the magnet at an inner wall surface thereof. The elastic member includes an upper elastic member disposed at an upper side of the lens holder. The upper elastic member is mounted to the inner wall of the outer yoke in a state where the upper elastic member is positioned and fitted to a spacer.

Abstract: An image pickup apparatus includes an image sensor that includes a plurality of first photoelectric conversion elements, and a plurality of second photoelectric conversion elements, a plurality of micro lenses each of which is provided for each pixel on the image sensor, and a controller configured to execute still image pickup using the plurality of second photoelectric conversion elements simultaneous with motion image pickup using the plurality of first photoelectric conversion elements. Each micro lens introduces a light flux from part of an exit pupil of the image pickup optical system to at least one first photoelectric conversion element, and a light flux from another part of the exit pupil to at least one second photoelectric conversion element.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

Abstract: A post-dry etching cleaning liquid composition for cleaning a substrate after dry etching is provided, the cleaning liquid composition containing at least one type of fluorine compound, glyoxylic acid, at least one type of organic acid salt, and water. With regard to the fluorine compound, ammonium fluoride may be used. With regard to the organic acid salt, at least one of ammonium oxalate, ammonium tartarate, ammonium citrate, and ammonium acetate may be used.

Abstract: A lens holder driving device includes a lens holder in which a lens assembly is mounted, a driving coil fixed to the lens holder at outside circumference thereof, a magnet opposite to the driving coil, a yoke including the magnet, an elastic member supporting the lens holder in a direction of an optical axis shiftably, and a base disposed at a lower side of the lens holder. The yoke includes an outer yoke including the magnet at an inner wall surface thereof. The elastic member includes an upper elastic member disposed at an upper side of the lens holder. The upper elastic member is mounted to the inner wall of the outer yoke in a state where the upper elastic member is positioned and fitted to a spacer.