Abstract: A mounting structure includes a first electronic component, a second electronic component, and an adhesive. The first electronic component includes at least one protruding electrode including a protruding member and at least one electrically conductive layer. The protruding member is formed of resin. The at least one electrically conductive layer is disposed on the protruding member. The second electronic component has a facing electrode electrically conductively in contact with the at least one protruding electrode. The adhesive is used to adhere the first electronic component and the second electronic component to each other. The protruding member has a first area and a second area. The first area has the at least one electrically conductive layer provided thereon. The second area does not have the at least one electrically conductive layer provided thereon. The first area of the protruding member is squashed more than the second area.

Abstract: A semiconductor device includes a bump electrode including a bump made of resin, a base layer disposed on the bump, and a conductive surface layer disposed on the base layer. The base layer has ductility lower than that of the conductive surface layer and includes base regions which are spaced from each other and which are arranged at least in a top zone of the bump electrode.

Abstract: An information recording method includes the steps of carrying out an experimental write on both inner-peripheral and outer-peripheral experimental writing areas, in the case of the outer-peripheral experimental writing, a constant recording power computed on the basis of the optimum recording power is used, which is estimated by the inner-peripheral experimental writing, in addition, an optical disk apparatus operates according to this information recording method, thereby removing the fluctuation factors of the disk.

Abstract: A rotating member fixing structure includes a shaft member and a rotating member. The rotating member has an axial bore section press-fitted to the shaft member. One of the shaft member and the axial bore section of the rotating member includes a margin adjusting part dimensioned to reduce a press-fitting margin between the shaft member and the axial bore section of the rotating member from an initial press-fitting margin to an effective press-fitting margin that is less than or equal to a prescribed value when the rotating member is press-fitted to the shaft member.

Abstract: A component mounting apparatus is proposed, which has a plurality of vacuum pick-up nozzles attached to a mount head so as to revolve about a main shaft, causing one of the vacuum pick-up nozzles to move to a location to be driven by an actuator that is provided at a designated location in the direction of revolution, and causing the vacuum pick-up nozzle to make a forward movement by the actuator for vacuum pick-up and/or mounting of a component, wherein each of the vacuum pick-up nozzles is provided with a pushed plate of a designated size in the moving direction of the vacuum pick-up nozzle at a driven portion thereof.

Abstract: An acoustic logging tool sleeve with a preferably discontinuous, alternating structure that is acoustically opaque in some zones, and acoustically transparent in others. The sleeve may be modular, with several stages connected together. The multiple stages provide a sleeve that may be useful with a variety of borehole logging tools to reduce or eliminate the transmission of noise to the receiving elements.

Abstract: In a data recovery processing, the conventional overhead, primarily, latency due to a rotational recording media is removed. Secondary, in a signal processing or in a recording and reproducing apparatus, reliability of data reproduction is improved by repeatedly processing data. These processing are achieved that input signal, i.e., raw analog signal read from the recording media is digitized to be stored in a secondary storage such as a memory or a FIFO memory. The apparatus includes a signal processing circuit to repeatedly process the stored digital signal in the secondary storage. When detecting data, operation of the circuit is efficiently controlled by a change over detector parameters, in which characteristics for the detecting performance. Resultantly, data recovery processing speed is increased and reliability of data reproduced is improved.

Abstract: A superconducting filter device is disclosed that is able to prevent current concentration and improve electrical surface resistance. The superconducting filter device includes a first dielectric substrate, and a bulk superconducting resonator that is embedded in the first dielectric substrate and is formed from a bulk superconducting material.

Abstract: The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the lower surface of the substrate, to the upper surface of the substrate. A low melting point metal is connected to the connection electrodes and fills the through-hole. A bump and the low melting point metal are alloyed and bonded by heating the low melting point metal while pressing the bump formed on an electrode pad of an electronic component, with respect to a front end of the low melting point metal. The active surface of the electronic component is sealed by the upper surface of the substrate.

Abstract: A semiconductor device in which the lifetime of mounted components can be prolonged. A cooling system for controlling the temperature of a refrigerant through a heating section (1) and a radiator (2) is provided. The semiconductor device (100) is connected to the cooling system and is cooled. A variation width (?T1) of temperature controlled by the cooling system through the heating section (1) and the radiator (2) is larger than a temperature variation (?T2) of the refrigerant caused by variations in operating conditions of the semiconductor device (100) (?T1>?T2).

Abstract: A laser welding apparatus and method reduce the effect of the fume resulting from a weld. An air injecting nozzle is installed at a laser processing head. The injecting direction of air from the air injecting nozzle is set such that the air flows across a laser beam irradiated from the laser processing head while the air flow avoids direct contact with the laser irradiating point on the work piece.

Abstract: A display front plane having an anti-reflection film in thickness uniformity and good adhesion between the anti-reflection film and the base material is supplied. Each of a display lenticular lens and a display fresnel lens having a sophisticated anti-reflection function with a high total light transmittance is also to be provided. As for the display front plane, lenticular lens, fresnel lens relating to the present invention, gas containing a gas for thin film formation is introduced into a discharge space under the atmospheric pressure or the pressure close to it and the gas is activated by applying a high frequency electric field in the discharge space mentioned above. And then, anti-reflection film at least on one side of the surface of the base material is formed by exposing the base material in the aforementioned activated gas.

Abstract: A work transfer apparatus configured to move a work to an operating position while transferring the work by a conveyor, perform predetermined processing at the operating position, and discharge a processed work, the work transfer apparatus comprising an ejector moving the work independently from the conveyor; and a stopper stopping the work at the operating position, wherein the work processed by the predetermined processing is discharged by the ejector, and a work to be moved to the operating position next by the conveyor is stopped at the operating position by the stopper.

Abstract: This invention provides a mounting method for reliably connecting mounting components electrically. Specifically, an anisotropically conductive adhesive can be composed of crushable microcapsules and a second liquid in which the microcapsules are dispersed. Each microcapsule encloses a first liquid and a conductive particle. The first liquid can react with the second liquid at normal temperatures to cure the second liquid. This anisotropically conductive adhesive can be applied on a flexible printed circuit (FPC). Then, a drive IC is mounted and pressed on the FPC to crush the microcapsules between electrode pads provided on the drive IC and electrode pads provided on the FPC, thereby bonding the electrode pads. Subsequently, the anisotropically conductive adhesive is heated to plasticize a capsule wall of each microcapsule, thereby bonding the drive IC and the FPC.

Abstract: An exhaust purification apparatus has an engine controller with a storage device that stores information regarding when it is time for regeneration of the filter. The exhaust purification apparatus carries out a regeneration process of the filter based on the information stored in the storage device when the time for regeneration of the filter has been reached. The exhaust purification apparatus also determines whether an engine operation is taking place for the first time following replacement of the engine controller, and then forcibly carries out the regeneration process of the filter upon determining that engine operation is taking place for the first time following replacement of the engine controller.

Abstract: Methods and apparatus facilitating logging-while-drilling (LWD) using a multi-pole acoustic transmitter source. The multi-pole transmitter source enables measurement of formation velocities, including shear wave velocities through formations that are slower than velocities through local fluids. The methods and apparatus may be utilized for LWD and wireline seismic surveys in which both the seismic or acoustic source and receivers are both deployed in a borehole, but may also be used for VSPs (vertical seismic profiling).

Abstract: An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.

Abstract: An electronic component-mounted structure includes an electronic component having a bump electrode, the bump electrode including a projection made of a first resin and a conductive film covering at least a top of the projection; a substrate having a connecting terminal; and a second resin filling the space between the electronic component and the substrate, wherein the bump electrode abuts against the connecting terminal, and wherein the relationship T0<Tgr<Tgb is satisfied, where T0 is an operating temperature of the electronic component mounted on the substrate, Tgb is a glass transition temperature of the first resin, and Tgr is a glass transition temperature of the second resin.

Abstract: Disclosed herein is a curable composition excellent in workability, adhesion properties, rubber-like properties, storage stability, and quick curability. The curable composition comprises (A) a crosslinkable silyl group-containing organic polymer and (B) a (meth)acrylic polymer obtained by polymerizing a (meth)acrylic monomer having a polymerizable unsaturated bond in the presence of a metallocene compound and a crosslinkable silyl group-containing thiol compound, at least one end of the (meth)acrylic polymer being bonded to a residue, —S—R3 (where R3 represents a group having a crosslinkable silyl group) obtained by removing a hydrogen atom from the crosslinkable silyl group-containing thiol compound.

Abstract: To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.