Abstract: Disclosed herein is a curable composition excellent in workability, adhesion properties, rubber-like properties, storage stability, and quick curability. The curable composition comprises (A) a crosslinkable silyl group-containing organic polymer and (B) a (meth)acrylic polymer obtained by polymerizing a (meth)acrylic monomer having a polymerizable unsaturated bond in the presence of a metallocene compound and a crosslinkable silyl group-containing thiol compound, at least one end of the (meth)acrylic polymer being bonded to a residue, —S—R3 (where R3 represents a group having a crosslinkable silyl group) obtained by removing a hydrogen atom from the crosslinkable silyl group-containing thiol compound.

Abstract: To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.

Abstract: An ink-jet recording sheet comprising a substrate having thereon a porous layer formed by a process comprising the steps of: (a) coating on the substrate an aqueous coating composition containing a hydrophilic binder and inorganic particles to form the porous layer; (b) drying the porous layer over a period, wherein the period comprises at least a constant drying rate period and a falling drying rate period; and (c) incorporating a solution containing an additive into the porous layer after the completion of the constant drying rate period.

Abstract: A magnetic disk apparatus has: a magnetic disk having a magnetic film formed on a substrate; a spindle motor for rotating the magnetic disk; a magnetic head for writing/reading information on/from the magnetic disk; a supporting member for supporting the magnetic head; a driving mechanism for moving the magnetic head to a predetermined position on the magnetic disk; a magnetic writing/reading circuit for enabling the magnetic head to write/read information on/from the magnetic disk; an interface for sending/receiving signals for controlling the information to/from another information processing device, a device for detecting whether or not the magnetic disk apparatus is in operation; and mechanism for latching movable part of the magnetic disk apparatus on the basis of detection result of the detecting device.

Abstract: A machining feed rate for machining a workpiece portion to be machined by a machining tool based upon a machining program is set by reading a data of the workpiece portion, by sectionalizing the workpiece portion in an area corresponding to a workpiece shape of the workpiece portion, and by determining a shape change point based upon a workpiece shape of the workpiece portion. The machining feed rate is set for each area and for each shape change point with reference to a predetermined parameter corresponding to an attribute of the each sectionalized area and corresponding to an attribute of the each determined shape change point.

Abstract: To provide a method of manufacturing an electronic part capable of reusing the remaining conductive particles and electrically connecting the electronic part to the counterpart substrate, a method of manufacturing an electronic part includes: forming a mask on an active surface of the wafer on which electrode pads of the electronic part are formed, the mask of a predetermined height having openings provided above the electrode pads, forming bumps inside of the openings of the mask provided above the electrode pads, the bumps having a height lower than that of the mask, scattering conductive particles above the active surface of the wafer, removing the conductive particles remaining on the surface of the mask, fixing the conductive particles on the surfaces of the bumps, removing the mask, and separating the electronic part from the wafer.

Abstract: In a data recovery processing, the conventional overhead, primarily, latency due to a rotational recording media is removed. Secondary, in a signal processing or in a recording and reproducing apparatus, reliability of data reproduction is improved by repeatedly processing data. These processing are achieved that input signal, i.e., raw analog signal read from the recording media is digitized to be stored in a secondary storage such as a memory or a FIFO memory. The apparatus includes a signal processing circuit to repeatedly process the stored digital signal in the secondary storage. When detecting data, operation of the circuit is efficiently controlled by a change over detector parameters, in which characteristics for the detecting performance. Resultantly, data recovery processing speed is increased and reliability of data reproduced is improved.

Abstract: In one embodiment, a write/read apparatus includes an external interface section for data input; an external interface section for data output; a memory for temporarily storing the data that is input through the external interface section for data input and written on the recording medium and the data that is read from the recording medium and sent to the outside through the external interface section for data output; an address generating section for generating unique addresses associated with physical block addresses of the recording medium; a flag generating section for generating flags for prohibiting overwriting of the data to be written on the recording medium; and a processing section for adding the unique addresses generated in the address generating section to the data that is stored in the memory and that is to be written on the recording medium. The data with the addition of the flags generated in the flag generating section and the unique addresses is written on the recording medium.

Abstract: In a data recovery processing, the conventional overhead, primarily, latency due to a rotational recording media is removed. Secondary, in a signal processing or in a recording and reproducing apparatus, reliability of data reproduction is improved by repeatedly processing data. These processing are achieved that input signal, i.e., raw analog signal read from the recording media is digitized to be stored in a secondary storage such as a memory or a FIFO memory. The apparatus includes a signal processing circuit to repeatedly process the stored digital signal in the secondary storage. When detecting data, operation of the circuit is efficiently controlled by a change over detector parameters, in which characteristics for the detecting performance. Resultantly, data recovery processing speed is increased and reliability of data reproduced is improved.

Abstract: A vehicle drive recorder is provided for recording a signal onto a hard disk, such signal obtained while vehicle is in operation. The recorder inhibits data recording upon receipt of an inhibit signal. Inhibit canceling signal is also available.

Abstract: An electronic component-mounted structure includes an electronic component having a bump electrode, the bump electrode including a projection made of a first resin and a conductive film covering at least a top of the projection; a substrate having a connecting terminal; and a second resin filling the space between the electronic component and the substrate, wherein the bump electrode abuts against the connecting terminal, and wherein the relationship T0<Tgr<Tgb is satisfied, where T0 is an operating temperature of the electronic component mounted on the substrate, Tgb is a glass transition temperature of the first resin, and Tgr is a glass transition temperature of the second resin.

Abstract: An end face of a transparent electrode or a backside electrode of an EL element is not bared at an end surface of an outer periphery of an EL insert molding or an end surface of an inner periphery of a through hole portion. A decorative film covers a front side of an EL element and molding resin is injected onto a backside surface of the EL element to form a molding resin portion. An end potion of the decorative film is bent to cover the end portion of the EL element and extends beyond the end portion of the EL element a distance larger than at least a thickness of the EL element.

Abstract: A shaft part is coaxially provided within a pressure release port provided in a sealing plate sealed to an opening portion of a case for a condenser or a battery, a valve body closely fitted and fixed within the pressure release port has a seal lip which is directed toward the outside of a pressure container and is closely contacted with an outer peripheral surface of the shaft part with predetermined tensional force, and in the case that internal pressure of the case is increased more than a predetermined value, the seal lip is operated so as to open the valve, thereby releasing the internal pressure to the atmospheric air.

Abstract: In a magnetic disk apparatus which is removably mounted or embedded to a host apparatus and intermittently accessed for recording/reproducing data, a RAM contained in the host apparatus is utilized for a portion or entirety of a buffer RAM for use in the intermittent access to accomplish a reduction in size and cost of the magnetic disk apparatus. In addition, the magnetic disk apparatus is controlled to rotate a magnetic disk at a variable rotational speed, and operated at a rotational speed at which the total power consumption is minimized in accordance with the capacity of the utilized buffer RAM and whether an access is made for recording or reproduction, thereby improving a power saving effect.

Abstract: Disclosed is a method of manufacturing an organic electroluminescent element comprising a substrate and provided thereon, a light emission layer and at least one layer of a hole injecting layer, a hole transporting layer, an electron injecting layer, and an electron transporting layer, two layers of the light emission layer and the at least one layer being adjacent to each other, the method comprising the steps of (a) providing a first coating solution employing a first organic solvent for one layer of the two layers and a second coating solution employing a second solvent for the other layer of the two layers, the first solvent being immiscible with the second solvent; (b) simultaneously coating the first and second coating solutions on the substrate so that the first coating solution is in contact with the second coating solution; and (c) drying the coated.

Abstract: Disclosed is a method of manufacturing an organic electroluminescent element comprising a substrate and provided thereon, a light emission layer and at least one layer of a hole injecting layer, a hole transporting layer, an electron injecting layer, and an electron transporting layer, two layers of the light emission layer and the at least one layer being adjacent to each other, the method comprising the steps of (a) providing a first coating solution employing a first organic solvent for one layer of the two layers and a second coating solution employing a second solvent for the other layer of the two layers, the first solvent being immiscible with the second solvent; (b) simultaneously coating the first and second coating solutions on the substrate so that the first coating solution is in contact with the second coating solution; and (c) drying the coated.

Abstract: An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.

Abstract: A method of manufacturing an electronic component mounting body is used for mounting an IC chip having a bumps as an external mounting terminal on a base material made of thermoplastic resin, comprising: a bump burying step of burying the bumps into the base material by heating and pressing the IC chip toward the base material to expose a portion of the bumps to a base material surface on the opposite side of the IC chip, and a step of forming a conductor conductively connected to the bump by arranging conductive material on the base material surface to which the portion of the bumps are exposed.

Abstract: A method includes forming an as-grown film of a superconductor composed of a MgB2 compound which is made by simultaneous evaporation of magnesium and boron. The as-grown film is superconductive without an annealing process to make the film superconductive. The method can be applied to fabricate an integrated circuit of the superconductor film, because a high temperature annealing process to make the as-grown film superconductive is not needed.

Abstract: An acoustic logging tool sleeve with a preferably discontinuous, alternating structure that is acoustically opaque in some zones, and acoustically transparent in others. The sleeve may be modular, with several stages connected together. The multiple stages provide a sleeve that may be useful with a variety of borehole logging tools to reduce or eliminate the transmission of noise to the receiving elements.