Patents by Inventor Atsushi Saito

Atsushi Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050128627
    Abstract: A magnetic disk apparatus has: a magnetic disk having a magnetic film formed on a substrate; a spindle motor for rotating the magnetic disk; a magnetic head for writing/reading information on/from the magnetic disk; a supporting member for supporting the magnetic head; a driving mechanism for moving the magnetic head to a predetermined position on the magnetic disk; a magnetic writing/reading circuit for enabling the magnetic head to write/read information on/from the magnetic disk; an interface for sending/receiving signals for controlling the information to/from another information processing device, a device for detecting whether or not the magnetic disk apparatus is in operation; and mechanism for latching movable part of the magnetic disk apparatus on the basis of detection result of the detecting device.
    Type: Application
    Filed: January 28, 2005
    Publication date: June 16, 2005
    Inventors: Kyo Akagi, Takashi Yamaguchi, Koki Uefune, Motoyasu Tsunoda, Atsushi Saito
  • Publication number: 20050115063
    Abstract: A component mounting apparatus is proposed, which has a plurality of vacuum pick-up nozzles attached to a mount head so as to revolve about a main shaft, causing one of the vacuum pick-up nozzles to move to a location to be driven by an actuator that is provided at a designated location in the direction of revolution, and causing the vacuum pick-up nozzle to make a forward movement by the actuator for vacuum pick-up and/or mounting of a component, wherein each of the vacuum pick-up nozzles is provided with a pushed plate of a designated size in the moving direction of the vacuum pick-up nozzle at a driven portion thereof.
    Type: Application
    Filed: November 5, 2004
    Publication date: June 2, 2005
    Applicant: Sony Corporation
    Inventors: Atsushi Saito, Akira Kimura
  • Publication number: 20050083802
    Abstract: Laser light irradiation can be performed on a recordable surface in a defocused state with a high-power laser beam with safety without incurring data destruction due to erroneous data recording or overwrite recording even in the recording on an eccentric disk or regardless of occurrence of wobbling of the disk surface. Laser irradiation is performed after moving an objective lens radially inwardly beyond a PCA located at an inner peripheral portion of the disk (or radially outwardly beyond the PCA located at an outer peripheral portion of the disk) by using a tracking coil.
    Type: Application
    Filed: March 24, 2004
    Publication date: April 21, 2005
    Applicants: Hitachi, Ltd., Hitachi-LG Data Storage, Inc.
    Inventors: Kenji Akahoshi, Atsushi Saito, Makoto Nihei, Junichi Ishii
  • Publication number: 20050070046
    Abstract: A method of manufacturing an electronic device includes: mounting a plurality of electronic components to a thermoplastic resin layer so that the bump electrode is installed in the thermoplastic resin layer, each of the electronic components including a bump electrode; forming a conductor conductively connected with the bump electrode on a surface of the thermoplastic resin layer opposite to a surface on which the electronic components are mounted; and dividing the thermoplastic resin layer in units of each of the electronic components.
    Type: Application
    Filed: August 12, 2004
    Publication date: March 31, 2005
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Atsushi Saito
  • Publication number: 20050067191
    Abstract: Methods and apparatus facilitating logging-while-drilling (LWD) using a multi-pole acoustic transmitter source. The multi-pole transmitter source enables measurement of formation velocities, including shear wave velocities through formations that are slower than velocities through local fluids. The methods and apparatus are particularly well suited for LWD and wireline seismic surveys in which both the seismic or acoustic source and receivers are both deployed in a borehole, but may also be used for VSPs (vertical seismic profiling).
    Type: Application
    Filed: September 30, 2003
    Publication date: March 31, 2005
    Inventors: Kenichiro Miyamoto, Atsushi Saito
  • Publication number: 20050067635
    Abstract: A method of manufacturing an electronic component, including: forming a thermoplastic resin layer on a surface of a semiconductor substrate including a plurality of integrated circuits and a bump electrode provided on each of the integrated circuits, to bury the bump electrode; forming a conductive pattern on a surface of the thermoplastic resin layer opposite to the semiconductor substrate, and electrically connecting the conductive pattern to the bump electrode; and dividing the semiconductor substrate in units of the integrated circuits.
    Type: Application
    Filed: August 12, 2004
    Publication date: March 31, 2005
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Atsushi Saito
  • Publication number: 20050068617
    Abstract: A display front plane having an anti-reflection film in thickness uniformity and good adhesion between the anti-reflection film and the base material is supplied. Each of a display lenticular lens and a display fresnel lens having a sophisticated anti-reflection function with a high total light transmittance is also to be provided. As for the display front plane, lenticular lens, fresnel lens relating to the present invention, gas containing a gas for thin film formation is introduced into a discharge space under the atmospheric pressure or the pressure close to it and the gas is activated by applying a high frequency electric field in the discharge space mentioned above. And then, anti-reflection film at least on one side of the surface of the base material is formed by exposing the base material in the aforementioned activated gas.
    Type: Application
    Filed: September 21, 2004
    Publication date: March 31, 2005
    Applicant: KONICA MINOLTA HOLDINGS, INC.
    Inventors: Wataru Mizuno, Atsushi Saito, Ichiro Kudo
  • Publication number: 20050062153
    Abstract: To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.
    Type: Application
    Filed: August 10, 2004
    Publication date: March 24, 2005
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Atsushi Saito, Shuichi Tanaka
  • Patent number: 6862505
    Abstract: A vehicle-mounted information processing apparatus such as a car-navigation system detects that a key switch of the vehicle has been set up at a Lock position (i.e., the engine is stopped). After that, the apparatus performs data reproduction of data files in an order from the oldest, then re-recording the reproduced data files with no change added thereto. Here, the above-described data files, which are stored within a magnetic disk device built in the apparatus, have been not updated for a constant time-period. This re-recording prevents a data loss caused by a thermal decay in the case where the magnetic disk device is mounted inside the vehicle that is likely to have existed under a high-temperature environment for a long time-period.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: March 1, 2005
    Assignees: Hitachi, Ltd., Xanavi Informatics Corporation
    Inventors: Naoki Satoh, Takashi Yamaguchi, Atsushi Saito, Kozo Nakamura, Mikio Tokuyama, Shigeo Nakamura, Hiroyuki Kohida, Hirohisa Miyazawa
  • Patent number: 6862153
    Abstract: A magnetic disk apparatus has: a magnetic disk having a magnetic film formed on a substrate; a spindle motor for rotating the magnetic disk; a magnetic head for writing/reading information on/from the magnetic disk; a supporting member for supporting the magnetic head; a driving mechanism for moving the magnetic head to a predetermined position on the magnetic disk; a magnetic writing/reading circuit for enabling the magnetic head to write/read information on/from the magnetic disk; an interface for sending/receiving signals for controlling the information to/from another information processing device, a device for detecting whether or not the magnetic disk apparatus is in operation; and mechanism for latching movable part of the magnetic disk apparatus on the basis of detection result of the detecting device.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: March 1, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Kyo Akagi, Takashi Yamaguchi, Koki Uefune, Motoyasu Tsunoda, Atsushi Saito
  • Publication number: 20050039806
    Abstract: A shaft part (20) is coaxially provided within a pressure release port (10) provided in a sealing plate (3) sealed to an opening portion of a case for a condenser or a battery, a valve body (30) closely fitted and fixed within the pressure release port (10) has a seal lip (33) which is directed toward the outside of a pressure container and is closely contacted with an outer peripheral surface of the shaft part (20) with predetermined tensional force, and in the case that internal pressure of the case is increased more than a predetermined value, the seal lip (33) is operated so as to open the valve, thereby releasing the internal pressure to the atmospheric air.
    Type: Application
    Filed: November 21, 2002
    Publication date: February 24, 2005
    Inventors: Junichi Nakayama, Toshihiro Mukaida, Tsuyoshi Kanda, Atsushi Saito, Kazuo Yamashita
  • Patent number: 6850004
    Abstract: A surface of a substrate which is an outer packaging case is integrated with a decorative film and an EL device. An upper case of the outer packaging case has through-holes through which a transparent electrode layer and a back electrode layer that constitute the EL device are exposed. Contact pins are elastically contacted with the transparent electrode layer and the back electrode layer via the through-holes, and the electrodes are thereby connected to an EL-driving circuit.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: February 1, 2005
    Assignee: Seiko Precision Inc.
    Inventors: Koji Yoneda, Atsushi Saito, Yasufumi Naoi
  • Patent number: 6835696
    Abstract: The present invention provides methods forming the superconductor of as-grown film of MgB2 which is made with magnesium and boron ejected from a magnesium target and a boron target, respectively, each in simultaneously sputtering process. The as-grown film composed of a compound of magnesium and boron is a superconductor without being annealed. The present invention can be applied to fabricate an integrated circuit of superconductor film, because the high temperature annealing process for the as-grown film of MgB2 is unnecessary.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: December 28, 2004
    Assignee: Communications Research Laboratory Independent Administrative Institute
    Inventors: Atsushi Saito, Akira Kawakami, Hisashi Shimakage, Zhen Wang
  • Publication number: 20040247886
    Abstract: A thin film forming method, wherein a discharge gas is introduced into a discharge space to be excited under an atmospheric or approximately atmospheric pressure, a thin film forming gas containing an orgenometallic compound with an organic group containing a fluorine atom being brought into contact with said excited discharge gas outside the discharge space to be converted into an indirectly excited gas, and a substrate is exposed to said indirectly excited gas to form a thin film on said substrate, and a thin film formed substance formed by the same.
    Type: Application
    Filed: June 1, 2004
    Publication date: December 9, 2004
    Applicant: KONICA MINOLTA HOLDINGS, INC.
    Inventors: Ichiro Kudo, Atsushi Saito, Hiroaki Arita
  • Publication number: 20040238603
    Abstract: The invention provides a method of mounting an electronic component where an electronic component can be reliably electrically-connected to a substrate. A substrate defines a through-hole that extends through the substrate, from connection electrodes formed on the lower surface of the substrate, to the upper surface of the substrate. A low melting point metal is connected to the connection electrodes and fills the through-hole. A bump and the low melting point metal are alloyed and bonded by heating the low melting point metal while pressing the bump formed on an electrode pad of an electronic component, with respect to a front end of the low melting point metal. The active surface of the electronic component is sealed by the upper surface of the substrate.
    Type: Application
    Filed: May 6, 2004
    Publication date: December 2, 2004
    Applicant: Seiko Epson Corporation
    Inventor: Atsushi Saito
  • Publication number: 20040234763
    Abstract: This invention provides a mounting method for reliably connecting mounting components electrically. Specifically, an anisotropically conductive adhesive can be composed of crushable microcapsules and a second liquid in which the microcapsules are dispersed. Each microcapsule encloses a first liquid and a conductive particle. The first liquid can react with the second liquid at normal temperatures to cure the second liquid. This anisotropically conductive adhesive can be applied on a flexible printed circuit (FPC). Then, a drive IC is mounted and pressed on the FPC to crush the microcapsules between electrode pads provided on the drive IC and electrode pads provided on the FPC, thereby bonding the electrode pads. Subsequently, the anisotropically conductive adhesive is heated to plasticize a capsule wall of each microcapsule, thereby bonding the drive IC and the FPC.
    Type: Application
    Filed: March 30, 2004
    Publication date: November 25, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Atsushi Saito
  • Publication number: 20040224441
    Abstract: To provide a method of manufacturing an electronic part capable of reusing the remaining conductive particles and electrically connecting the electronic part to the counterpart substrate, a method of manufacturing an electronic part includes: forming a mask on an active surface of the wafer on which electrode pads of the electronic part are formed, the mask of a predetermined height having openings provided above the electrode pads, forming bumps inside of the openings of the mask provided above the electrode pads, the bumps having a height lower than that of the mask, scattering conductive particles above the active surface of the wafer, removing the conductive particles remaining on the surface of the mask, fixing the conductive particles on the surfaces of the bumps, removing the mask, and separating the electronic part from the wafer.
    Type: Application
    Filed: March 26, 2004
    Publication date: November 11, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Atsushi Saito
  • Publication number: 20040202863
    Abstract: A coating method comprising the steps of: forming liquid droplets of a liquid coating composition across a coating width in a direction perpendicular to a conveyance direction of a substrate to be coated; and spraying the liquid droplets formed toward the substrate while conveying the substrate, thereby coating the liquid coating composition onto the substrate.
    Type: Application
    Filed: February 20, 2003
    Publication date: October 14, 2004
    Applicant: KONICA CORPORATION
    Inventors: Atsushi Saito, Yuichiro Maehara
  • Patent number: 6788346
    Abstract: A video signal recording apparatus using an information recording medium, having: a unit for identifying and detecting a WO type information recording medium and a rewritable type information recording medium; a control unit for each of the WO type information recording medium and the rewritable type information recording medium; and a display apparatus for displaying a detection result of the detecting unit. In the video signal recording apparatus using the information recording medium, file management information to form a directory is recorded as intermediate information onto the information recording medium.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: September 7, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Tamotsu Ito, Tsukasa Hasegawa, Atsushi Saito, Shigemitsu Higuchi
  • Publication number: 20040157009
    Abstract: An ink-jet recording sheet comprising a substrate having thereon a porous layer formed by a process comprising the steps of:
    Type: Application
    Filed: February 6, 2004
    Publication date: August 12, 2004
    Applicant: KONICA CORPORATION
    Inventors: Keiji Ohbayashi, Atsushi Saito, Yuichiro Maehara, Yoshinori Tsubaki