Patents by Inventor Atsushi Sakai
Atsushi Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230052077Abstract: A management system includes a course data generation unit that generates course data for each of a plurality of unmanned vehicles such that loading work for the plurality of unmanned vehicles by a loader is sequentially performed on a work site where a plurality of the loaders operates; and a priority determination unit that determine a passage order at an intersection on the work site of the plurality of unmanned vehicles traveling according to the course data so as to reduce a total loading loss indicating a total of loss amounts in operation of each of the plurality of the loaders.Type: ApplicationFiled: January 14, 2021Publication date: February 16, 2023Applicants: Komatsu Ltd., NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITYInventors: Yusuke Maeda, Yudai Ogawa, Kenta Osagawa, Atsushi Sakai, Yasuchika Matsui
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Patent number: 11579289Abstract: A distance measuring apparatus includes a light source to emit light beams, an optical scanner to scan the light beams output from the light source over a predetermined range, a light receiver to receive reflected light obtained as a result of the light beams being reflected by a target object, and to output detection signals, and a control circuit to measure a distance to the target object based on the detection signals. The light source including a plurality of light-emitting device groups that are arranged in a scan direction of a scan performed by the optical scanner, and the control circuit being to make the plurality of light-emitting device groups emit light at respective different timings in a single scan, and to measure the distance to the target object based on a sum of the detection signals.Type: GrantFiled: February 8, 2019Date of Patent: February 14, 2023Assignee: RICOH COMPANY, LTD.Inventors: Shuichi Suzuki, Nobunari Tsukamoto, Tsuyoshi Ueno, Tadashi Nakamura, Naoto Jikutani, Kazuma Izumiya, Atsushi Sakai, Masayuki Yanagihashi, Yasufumi Yamada
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Patent number: 11581698Abstract: An optical device includes: a substrate having a first surface, and a second surface opposite of the first surface; a plurality of surface emitting laser elements provided on the first surface of the substrate and configured to emit light in a direction intersecting the first surface; a plurality of optical elements disposed on the second surface so as to respectively correspond to the plurality of surface emitting laser elements; and an anti-reflection structure between the substrate and the plurality of optical elements.Type: GrantFiled: March 13, 2020Date of Patent: February 14, 2023Assignee: Ricoh Company, Ltd.Inventors: Yusuke Ohta, Toshiyuki Ikeoh, Atsushi Sakai
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Patent number: 11570901Abstract: A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.Type: GrantFiled: February 22, 2018Date of Patent: January 31, 2023Assignees: NATIONAL INSTITUTE FOR MATERIALS SCIENCE, DENKA COMPANY LIMITEDInventors: Seiji Kuroda, Hiroshi Araki, Akira Hasegawa, Makoto Watanabe, Atsushi Sakai, Yoshitaka Taniguchi, Suzuya Yamada
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Publication number: 20220403169Abstract: A resin composition containing a polyimide resin particle (A) and at least one selected from the group consisting of a thermoplastic resin (B) and a thermosetting resin (C), wherein the polyimide resin particle (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %, and the polyimide resin particle (A) has a volume average particle size D50 of 5 to 200 ?m. (R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.Type: ApplicationFiled: November 17, 2020Publication date: December 22, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Atsushi SAKAI, Yuuki SATO, Naoki KANEKO
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Publication number: 20220406678Abstract: A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.Type: ApplicationFiled: November 12, 2020Publication date: December 22, 2022Applicant: Denka Company LimitedInventors: Atsushi SAKAI, Masaya YUMIBA, Kentaro NAKAYAMA, Yoshitaka TANIGUCHI
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Publication number: 20220332916Abstract: A flame-retardant polyimide molding material containing a semi-aromatic polyimide resin (A) and further containing 15 to 80 mass % of either of the following component (B1) or component (B2): (B1) graphite (B2) a combination of two or more selected from the group consisting of graphite, a fluorine resin, and carbon fiber; and a molded article including the same.Type: ApplicationFiled: June 22, 2020Publication date: October 20, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Atsushi SAKAI, Yuuki SATO
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Publication number: 20220289975Abstract: A polyimide resin composition containing a polyimide resin (A) and a fluororesin (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %, and the fluororesin (B) has a weight loss percentage measured using a differential scanning calorimeter after heating from 100° C. to 450° C. at a heating rate of 10° C.Type: ApplicationFiled: June 22, 2020Publication date: September 15, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Atsushi SAKAI, Yuuki SATO
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Publication number: 20220213269Abstract: A polyimide resin composition includes a polyimide resin (A) including a repeating structural units of formulas (1) and (2). The content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural units of the formulas (1) and (2) is 20 to 70 mol %. The polyimide resin composition further includes a fatty acid metal salt (B) including a fatty acid having 12 to 36 carbon atoms and optionally having a hydroxy group and at least one of an alkali metal, an alkaline earth metal, and a transition metal: wherein R1 represents a divalent group having 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having 6 to 22 carbon atoms containing at least one aromatic ring.Type: ApplicationFiled: May 7, 2020Publication date: July 7, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Atsushi SAKAI, Yuuki SATO, Fumihiro FUKUDA
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Publication number: 20220203651Abstract: To provide a multilayered body with high adhesion between a resin layer containing a nanofiber or the like and a metal layer, and a method for manufacturing a multilayered body. The multilayered body contains: a metal layer having an uneven region with an average length (RSm) of a contour curve element from 0.5 to 10 ?m; and a resin layer in contact with the uneven region of the metal layer, the resin layer containing a thermoplastic resin and a fibrous filler, the fibrous filler having a number average fiber diameter (F) of less than 1 ?m, and a ratio (RSm/F) of the average length (RSm) of the contour curve element of the uneven region to the number average fiber diameter (F) from 1 to 20000.Type: ApplicationFiled: March 4, 2020Publication date: June 30, 2022Inventors: Nobuhiko MATSUMOTO, Jin NAKAMURA, Yuuki SATO, Atsushi SAKAI
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Patent number: 11362207Abstract: A semiconductor device according to an embodiment comprises: a cell portion in which a vertical type MOSFET is formed; and a termination portion arranged adjacent to the cell portion. The termination portion includes a connection trench gate provided along a first direction. The cell portion includes: a plurality of first column regions provided along a second direction intersecting the first direction; and a plurality of trench gates provided along the second direction such that two trench gates are arranged between the two adjacent first column regions. The plurality of trench gates extend from the cell portion to the termination portion and are connected to the connection trench gate. The plurality of first column regions extend from the cell portion to the termination portion, and the termination portion includes a plurality of second column regions different from the plurality of first column regions.Type: GrantFiled: November 11, 2020Date of Patent: June 14, 2022Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Atsushi Sakai, Satoru Tokuda, Ryuuji Umemoto, Katsumi Eikyu, Hiroshi Yanagigawa
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Publication number: 20220145010Abstract: A polyimide resin composition containing a polyimide resin (A) and a nanocarbon material (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), and a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic group.Type: ApplicationFiled: February 13, 2020Publication date: May 12, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Atsushi SAKAI, Yuuki SATO
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Publication number: 20220135742Abstract: A flame-retardant polyimide molding material and a molded article including the flame-retardant polyimide molding material, where the flame-retardant polyimide molding material includes a semi-aromatic polyimide resin (A) and carbon fiber (B), and the flame-retardant polyimide molding material includes 15 to 80 mass % of the carbon fiber (B).Type: ApplicationFiled: February 25, 2020Publication date: May 5, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Atsushi SAKAI, Yuuki SATO, Naoki KANEKO
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Publication number: 20220056214Abstract: A polyimide resin composition containing a polyimide resin (A) and an antioxidant (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %, and the antioxidant (B) contains one or more copper compounds (B1) selected from the group consisting of copper fluoride, copper bromide, copper iodide, and copper carboxylates, or a cerium-containing compound (B2); wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containinType: ApplicationFiled: March 5, 2020Publication date: February 24, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Atsushi SAKAI, Yuuki SATO
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Patent number: 11231279Abstract: A work machine management system includes: a position detecting device that detects a position of a work machine traveling in a workplace; a non-contact sensor that detects an object existing in the workplace in a non-contact manner; map data that accumulates information on existence and a position of the object existing in the workplace on the basis of detection data obtained by the position detecting device and detection data obtained by the non-contact sensor; a travel route generation unit that generates a travel route where the work machine travels; and an identifying unit that identifies perfection of map data. The travel route generation unit generates the travel route where the work machine travels on the basis of the perfection of the map data identified by the identifying unit.Type: GrantFiled: February 29, 2016Date of Patent: January 25, 2022Assignee: Komatsu LTD.Inventors: Atsushi Sakai, Masanori Minagawa, Tomonori Ozaki
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Patent number: 11160172Abstract: A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate. The disclosed method includes a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of a ceramic substrate from a nozzle, in which the first metal powder is heated to from 10° C. to 270° C. and then ejected from the nozzle 10 and a gauge pressure of the inert gas at an inlet of the nozzle 10 is from 1.5 to 5.0 MPa, a step of subjecting the first metal layer to a heat treatment in an inert gas atmosphere, and the like.Type: GrantFiled: January 16, 2018Date of Patent: October 26, 2021Assignee: DENKA COMPANY LIMITEDInventors: Atsushi Sakai, Yoshitaka Taniguchi, Suzuya Yamada
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Publication number: 20210261756Abstract: Provided is a polyimide powder composition containing a thermoplastic polyimide resin powder (A) and silica particles (B) having a volume average particle size D50 of 90 nm or less.Type: ApplicationFiled: May 8, 2019Publication date: August 26, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Atsushi SAKAI, Yuuki SATO
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Publication number: 20210253856Abstract: A polyimide resin composition containing a polyimide resin (A) and a phosphinic acid metal salt-based flame retardant (B), the polyimide resin (A) containing repeating structural units of formulae (1) and (2): wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring, and a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) is 20 to 70 mol %.Type: ApplicationFiled: May 8, 2019Publication date: August 19, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Atsushi SAKAI, Yuuki SATO
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Patent number: 11094648Abstract: A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient ?1 (×10?6/K) of the base plate and a linear thermal expansion coefficient ?2 (×10?6/K) of the ceramic insulating substrate when a temperature decreases in the range of 25° C. to 150° C. satisfy the following Expression (1).Type: GrantFiled: July 30, 2018Date of Patent: August 17, 2021Assignee: DENKA COMPANY LIMITEDInventors: Hideki Hirotsuru, Yoshitaka Taniguchi, Kohki Ichikawa, Atsushi Sakai
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Patent number: 11096278Abstract: A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value ?1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10?6 to 9×10?6/K, a ratio ?1/?2 of the ?1 to a theoretical value ?2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.Type: GrantFiled: July 30, 2018Date of Patent: August 17, 2021Assignee: DENKA COMPANY LIMITEDInventors: Atsushi Sakai, Hideki Hirotsuru, Kohki Ichikawa, Yoshitaka Taniguchi