Patents by Inventor Atsushi Yusa

Atsushi Yusa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7299400
    Abstract: An error correction circuit includes a selected-bit reverse circuit, an ECC circuit, a checkbit generation circuit, an ECC data register, a bit-comparing circuit, and an address memory unit. The selected-bit reverse circuit includes memory data and check data from the memory unit. The ECC circuit corrects a one-bit error. The checkbit generation circuit generates checkbits. The ECC data register stores the corrected data and the checkdata. The bit-comparing circuit compares each bit between the output data A from the selected-bit reverse circuit and the output data A? from the ECC data register. The address memory unit stores an address corresponding to the memory data when the bit-comparing circuit detects a discrepancy among the data A and the data A?. The error data memory unit writes the discrepancy information at the bit-location. The data OR circuit generates the first signal.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: November 20, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Atsushi Yusa
  • Publication number: 20070264451
    Abstract: An electroless plating film with high adhesive strength is formed on surfaces of polymer substrates of various kinds, at low cost by providing a method of manufacturing a polymer member, including: preparing a polymer substrate having metallic fine particles impregnated on and inside a surface thereof; bringing pressurized carbon dioxide into contact with the polymer substrate to swell a surface area of the polymer substrate; and bringing an electroless plating solution containing pressurized carbon dioxide and being in a state causing a plating reaction, into contact with the polymer substrate while the surface area of the polymer substrate is swollen, to form a plating film on the polymer substrate.
    Type: Application
    Filed: May 8, 2007
    Publication date: November 15, 2007
    Applicant: HITACHI MAXELL, LTD.
    Inventors: Atsushi Yusa, Yoshiyuki Nomura, Tetsuo Mizumura, Hideo Daimon
  • Publication number: 20070190310
    Abstract: The present invention provides a method of producing a molded article, which can be perform the continuous processes and effectively impregnate a modifying material such as metal complexes in the thermoplastic resin for short period of time. The above object is achieved by providing the method of producing the thermoplastic resin molded article which includes impregnating the high-pressure fluid having a modifying material dissolved therein, in thermoplastic resin, and continuously molding the thermoplastic resin in which the modifying material has been impregnated, into the form of a film.
    Type: Application
    Filed: August 17, 2006
    Publication date: August 16, 2007
    Applicant: HITACHI MAXELL, LTD.
    Inventors: Atsushi Yusa, Yoshiyuki Nomura, Harumi Hieida
  • Publication number: 20070166530
    Abstract: A molded article includes thermoplastic resin, and an organic material different from the thermoplastic resin inside said molded article, the organic material being located on and near a surface of said molded article.
    Type: Application
    Filed: March 29, 2007
    Publication date: July 19, 2007
    Applicant: HITACHI MAXELL, LTD.
    Inventors: Atsushi Yusa, Teruo Hori
  • Publication number: 20070116930
    Abstract: To cause uniform infiltration in a thermoplastic resin surface in a short time using a small amount of a surface reforming material. A surface reforming method of a thermoplastic resin includes a step of opening a movable mold after a thermoplastic resin is molded in a cavity to form a gap between a portion of a molded product and a stationary mold, a step of introducing supercritical fluid, subcritical fluid, or high pressure gas including a surface reforming material into the gap, a step of narrowing the gap by closing the movable mold by a predetermined amount to prevent leaking of the introduced supercritical fluid, subcritical fluid, or high pressure gas from the gap, and of charging the supercritical fluid, the subcritical fluid, or the high pressure gas into a narrowed second gap, and a step of clamping and compressing the molded product.
    Type: Application
    Filed: November 21, 2006
    Publication date: May 24, 2007
    Applicants: SEIKOH GIKEN Co., Ltd., HITACHI MAXELL, Ltd.
    Inventors: Atsushi Yamada, Atsushi Yusa
  • Publication number: 20070108663
    Abstract: The present invention provides an injection molding method capable of impregnating a supercritical fluid stably and partially in molten resin in a plasticizing cylinder of an injection molding apparatus. The above object is achieved by providing the method of injection molding which includes measuring a filling amount of the molten resin in the plasticizing cylinder, introducing a supercritical fluid into the molten resin in the plasticizing cylinder while moving back the screw by a predetermined distance without rotating the screw from a position of the screw at the time of completing the measuring, detecting a pressure of the molten resin, and determining based on the pressure an injection start position for the screw.
    Type: Application
    Filed: November 13, 2006
    Publication date: May 17, 2007
    Applicants: HITACHI MAXELL, LTD., SEIKOH GIKEN CO., LTD.
    Inventors: Atsushi Yusa, Yoshiyuki Nomura, Atsushi Yamada
  • Patent number: 7211207
    Abstract: A molded article includes thermoplastic resin, and an organic material different from the thermoplastic resin inside said molded article, the organic material being located on and near a surface of said molded article.
    Type: Grant
    Filed: April 7, 2005
    Date of Patent: May 1, 2007
    Assignee: Hitachi Maxell, Ltd.
    Inventors: Atsushi Yusa, Teruo Hori
  • Publication number: 20060257633
    Abstract: A method for modifying the surface of a polymer substrate is provided, which includes applying a permeating substance to predetermined region on the surface of the polymer substrate, and bringing a supercritical fluid into contact with the surface of the polymer substrate to which the permeating substance has been applied to cause the permeating substance to permeate into the polymer substrate. This method makes it possible to selectively (partially) modify a portion of the surface of the polymer substrate by an easier method.
    Type: Application
    Filed: April 26, 2006
    Publication date: November 16, 2006
    Applicant: HITACHI MAXELL, LTD.
    Inventors: Kazuko Inoue, Katsusuke Shimazaki, Atsushi Yusa, Toshinori Sugiyama
  • Publication number: 20050240004
    Abstract: A method for modifying a surface of a polymer such as a thermoplastic resin is provided, in which a supercritical fluid, especially carbon dioxide in a supercritical state is used as a solvent, and the polymer surface is further converted to have highly advanced function or high performance in a short period of time. In the method for modifying the polymer surface of the present invention, a solute is previously applied to the polymer surface. Accordingly, the solute can be permeated into the surface of the polymer swelled by the contact of the supercritical fluid. When this method is used, it is possible to permeate the solute into the polymer at a high concentration in a short period of time.
    Type: Application
    Filed: April 22, 2005
    Publication date: October 27, 2005
    Applicant: HITACHI MAXELL, LTD.
    Inventors: Atsushi Yusa, Masahiro Oshima
  • Patent number: 6955781
    Abstract: A molded article includes thermoplastic resin, and an organic material different from the thermoplastic resin inside said molded article, the organic material being located on and near a surface of said molded article.
    Type: Grant
    Filed: May 22, 2003
    Date of Patent: October 18, 2005
    Assignee: Hitachi Maxell, Ltd.
    Inventors: Atsushi Yusa, Teruo Hori
  • Publication number: 20050205492
    Abstract: An injection molding method that modifies a surface of thermoplastic resin using a supercritical fluid that contains a solute, and molds the thermoplastic resin, includes the steps of injecting the thermoplastic resin into a mold cavity in a mold, a space being formed between the mold cavity and the surface of the thermoplastic resin, introducing into the space the supercritical fluid that contains the solute, and exhausting from the space the supercritical fluid that contains the solute.
    Type: Application
    Filed: December 27, 2004
    Publication date: September 22, 2005
    Applicants: HITACHI MAXELL, LTD., SEIKOH GIKEN Co., Ltd.
    Inventors: Atsushi Yusa, Terumasa Kondo, Toshiyuki Tomita, Masami Suzuki
  • Publication number: 20050204264
    Abstract: An error correction circuit includes a selected-bit reverse circuit, an ECC circuit, a checkbit generation circuit, an ECC data register, a bit-comparing circuit, and an address memory unit. The selected-bit reverse circuit includes memory data and check data from the memory unit. The ECC circuit corrects a one-bit error. The checkbit generation circuit generates checkbits. The ECC data register stores the corrected data and the checkdata. The bit-comparing circuit compares each bit between the output data A from the selected-bit reverse circuit and the output data A? from the ECC data register. The address memory unit stores an address corresponding to the memory data when the bit-comparing circuit detects a discrepancy among the data A and the data A?. The error data memory unit writes the discrepancy information at the bit-location. The data OR circuit generates the first signal.
    Type: Application
    Filed: February 15, 2005
    Publication date: September 15, 2005
    Applicant: Oki Electric Industry Co., Ltd.
    Inventor: Atsushi Yusa
  • Publication number: 20050175849
    Abstract: A molded article includes thermoplastic resin, and an organic material different from the thermoplastic resin inside said molded article, the organic material being located on and near a surface of said molded article.
    Type: Application
    Filed: April 7, 2005
    Publication date: August 11, 2005
    Inventors: Atsushi Yusa, Teruo Hori
  • Publication number: 20040211755
    Abstract: Provided is an imprint method that includes the steps of softening resist in an object to be processed, by using compressed gas or supercritical fluid, the object including a substrate and the resist applied onto the substrate, and transferring a predetermined pattern onto the resist by pressing a mold that forms the predetermined pattern against the resist in the object.
    Type: Application
    Filed: January 7, 2004
    Publication date: October 28, 2004
    Inventors: Atsushi Yusa, Toshinori Sugiyama
  • Publication number: 20040153783
    Abstract: This invention provides a circuit for detecting an abnormal operation of memory, an integrated circuit including the same and a method for detecting an abnormal operation capable of detecting an abnormal operation of memory before an error occurs in the integrated circuit of a micro-computer and the like due to the data wrongly output from the memory and of enhancing the reliability of integrated circuit. More specifically, this invention provides a circuit for detecting an abnormal operation of memory comprising: a delay circuit 102 for delaying an output data 123 of memory 101 for a predetermined period of time and for outputting this data as a delay data 124; and a comparison circuit 106 for outputting an incoincidence signal 127 in case that the output data 123 of the memory 101 and the delay data 124 are not coincident with each other after compared.
    Type: Application
    Filed: July 21, 2003
    Publication date: August 5, 2004
    Inventor: Atsushi Yusa
  • Publication number: 20040145086
    Abstract: An injection molding method that ensures, in the molding of optical disks and the like, accurate transferability, optical characteristics and mechanical characteristics for accurately transferring a super fine structure that could not be transferred satisfactorily by the conventional molding method, mass production of replicas, and so on, thus improving the production efficiency. It comprises the steps of using a cavity forming mold composed of at least two members, charging molten resin into the mold, obtaining a molding, wherein one of the members constituting the mold passes through a stage that is separated into at least three steps, a charging step, a press step and a molding take-out step, and molten resin is charged into the unclosed cavity of the one member in the charging step and then a molding is formed in the press step.
    Type: Application
    Filed: November 21, 2003
    Publication date: July 29, 2004
    Inventor: Atsushi Yusa
  • Publication number: 20030228485
    Abstract: A molded article includes thermoplastic resin, and an organic material different from the thermoplastic resin inside said molded article, the organic material being located on and near a surface of said molded article.
    Type: Application
    Filed: May 22, 2003
    Publication date: December 11, 2003
    Inventors: Atsushi Yusa, Teruo Hori
  • Patent number: 6445700
    Abstract: A serial communication circuit sends or receives a large amount of data speedily. A buffer 2a is connected to a serial interface circuit 1a, and a buffer 2b is connected to a serial interface circuit 1b. One end of a switch 4 is connected to the serial interface circuit 1a or the serial interface circuit 1b, and another end to a serial port 3. Switching the switch 4 sequentially to the serial interface circuit 1a and to the serial interface circuit 1b makes it possible to use the two buffers for sending data to, or receiving data from, one serial port 3.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: September 3, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Atsushi Yusa, Mitsuya Ohie
  • Patent number: 6229369
    Abstract: In a clock control circuit there are provided a counter for dividing a reference clock signal so as to generate a plurality of divided clock signals and selectors for selectively outputting one of the plurality of divided clock signals and the reference clock signal as an operation clock signal relative to a CPU or as an operation clock signal relative to a peripheral circuit.
    Type: Grant
    Filed: August 17, 1999
    Date of Patent: May 8, 2001
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Atsushi Yusa, Mitsuya Ohie, Kazutoshi Inoue
  • Patent number: 5133027
    Abstract: An optical waveguide apparatus comprising a substrate made of material the refractive index of which is changed by an electric effect, and an optical waveguide which is formed on a portion of the substrate and allows passage of guided light. In the apparatus, the optical waveguide includes an optical path changing section for periodically producing an electromotive force under the control of one of control light and guided light.
    Type: Grant
    Filed: May 9, 1991
    Date of Patent: July 21, 1992
    Assignee: Olympus Optical Co., Ltd.
    Inventors: Jun Funazaki, Yoshinori Ohta, Takashi Mizusaki, Hideo Adachi, Atsushi Yusa