Abstract: To cause uniform infiltration in a thermoplastic resin surface in a short time using a small amount of a surface reforming material. A surface reforming method of a thermoplastic resin includes a step of opening a movable mold after a thermoplastic resin is molded in a cavity to form a gap between a portion of a molded product and a stationary mold, a step of introducing supercritical fluid, subcritical fluid, or high pressure gas including a surface reforming material into the gap, a step of narrowing the gap by closing the movable mold by a predetermined amount to prevent leaking of the introduced supercritical fluid, subcritical fluid, or high pressure gas from the gap, and of charging the supercritical fluid, the subcritical fluid, or the high pressure gas into a narrowed second gap, and a step of clamping and compressing the molded product.

Abstract: The present invention provides an injection molding method capable of impregnating a supercritical fluid stably and partially in molten resin in a plasticizing cylinder of an injection molding apparatus. The above object is achieved by providing the method of injection molding which includes measuring a filling amount of the molten resin in the plasticizing cylinder, introducing a supercritical fluid into the molten resin in the plasticizing cylinder while moving back the screw by a predetermined distance without rotating the screw from a position of the screw at the time of completing the measuring, detecting a pressure of the molten resin, and determining based on the pressure an injection start position for the screw.

Abstract: A molded article includes thermoplastic resin, and an organic material different from the thermoplastic resin inside said molded article, the organic material being located on and near a surface of said molded article.

Abstract: A method for modifying the surface of a polymer substrate is provided, which includes applying a permeating substance to predetermined region on the surface of the polymer substrate, and bringing a supercritical fluid into contact with the surface of the polymer substrate to which the permeating substance has been applied to cause the permeating substance to permeate into the polymer substrate. This method makes it possible to selectively (partially) modify a portion of the surface of the polymer substrate by an easier method.

Abstract: A method for modifying a surface of a polymer such as a thermoplastic resin is provided, in which a supercritical fluid, especially carbon dioxide in a supercritical state is used as a solvent, and the polymer surface is further converted to have highly advanced function or high performance in a short period of time. In the method for modifying the polymer surface of the present invention, a solute is previously applied to the polymer surface. Accordingly, the solute can be permeated into the surface of the polymer swelled by the contact of the supercritical fluid. When this method is used, it is possible to permeate the solute into the polymer at a high concentration in a short period of time.

Abstract: A molded article includes thermoplastic resin, and an organic material different from the thermoplastic resin inside said molded article, the organic material being located on and near a surface of said molded article.

Abstract: An injection molding method that modifies a surface of thermoplastic resin using a supercritical fluid that contains a solute, and molds the thermoplastic resin, includes the steps of injecting the thermoplastic resin into a mold cavity in a mold, a space being formed between the mold cavity and the surface of the thermoplastic resin, introducing into the space the supercritical fluid that contains the solute, and exhausting from the space the supercritical fluid that contains the solute.

Abstract: An error correction circuit includes a selected-bit reverse circuit, an ECC circuit, a checkbit generation circuit, an ECC data register, a bit-comparing circuit, and an address memory unit. The selected-bit reverse circuit includes memory data and check data from the memory unit. The ECC circuit corrects a one-bit error. The checkbit generation circuit generates checkbits. The ECC data register stores the corrected data and the checkdata. The bit-comparing circuit compares each bit between the output data A from the selected-bit reverse circuit and the output data A? from the ECC data register. The address memory unit stores an address corresponding to the memory data when the bit-comparing circuit detects a discrepancy among the data A and the data A?. The error data memory unit writes the discrepancy information at the bit-location. The data OR circuit generates the first signal.

Abstract: A molded article includes thermoplastic resin, and an organic material different from the thermoplastic resin inside said molded article, the organic material being located on and near a surface of said molded article.

Abstract: Provided is an imprint method that includes the steps of softening resist in an object to be processed, by using compressed gas or supercritical fluid, the object including a substrate and the resist applied onto the substrate, and transferring a predetermined pattern onto the resist by pressing a mold that forms the predetermined pattern against the resist in the object.

Abstract: This invention provides a circuit for detecting an abnormal operation of memory, an integrated circuit including the same and a method for detecting an abnormal operation capable of detecting an abnormal operation of memory before an error occurs in the integrated circuit of a micro-computer and the like due to the data wrongly output from the memory and of enhancing the reliability of integrated circuit. More specifically, this invention provides a circuit for detecting an abnormal operation of memory comprising: a delay circuit 102 for delaying an output data 123 of memory 101 for a predetermined period of time and for outputting this data as a delay data 124; and a comparison circuit 106 for outputting an incoincidence signal 127 in case that the output data 123 of the memory 101 and the delay data 124 are not coincident with each other after compared.

Abstract: An injection molding method that ensures, in the molding of optical disks and the like, accurate transferability, optical characteristics and mechanical characteristics for accurately transferring a super fine structure that could not be transferred satisfactorily by the conventional molding method, mass production of replicas, and so on, thus improving the production efficiency. It comprises the steps of using a cavity forming mold composed of at least two members, charging molten resin into the mold, obtaining a molding, wherein one of the members constituting the mold passes through a stage that is separated into at least three steps, a charging step, a press step and a molding take-out step, and molten resin is charged into the unclosed cavity of the one member in the charging step and then a molding is formed in the press step.

Abstract: A molded article includes thermoplastic resin, and an organic material different from the thermoplastic resin inside said molded article, the organic material being located on and near a surface of said molded article.

Abstract: A serial communication circuit sends or receives a large amount of data speedily. A buffer 2a is connected to a serial interface circuit 1a, and a buffer 2b is connected to a serial interface circuit 1b. One end of a switch 4 is connected to the serial interface circuit 1a or the serial interface circuit 1b, and another end to a serial port 3. Switching the switch 4 sequentially to the serial interface circuit 1a and to the serial interface circuit 1b makes it possible to use the two buffers for sending data to, or receiving data from, one serial port 3.

Abstract: In a clock control circuit there are provided a counter for dividing a reference clock signal so as to generate a plurality of divided clock signals and selectors for selectively outputting one of the plurality of divided clock signals and the reference clock signal as an operation clock signal relative to a CPU or as an operation clock signal relative to a peripheral circuit.

Abstract: An optical waveguide apparatus comprising a substrate made of material the refractive index of which is changed by an electric effect, and an optical waveguide which is formed on a portion of the substrate and allows passage of guided light. In the apparatus, the optical waveguide includes an optical path changing section for periodically producing an electromotive force under the control of one of control light and guided light.

Abstract: A solid state image pick-up device having a number of static induction transistor image sensors arranged in a matrix form, each static induction image sensor includes a drain region formed by an n+ substrate connected to the earth potential, a channel region formed by an n.sup.- epitaxial layer grown on the substrate, a ring-shaped p+ gate region formed in a surface of the epitaxial layer, an n+ source region formed in a part of the surface of the epitaxial layer surrounded by the ring-shaped gate region and a p+ overflow drain region formed in the surface of the substrate underneath the gate region. By adjusting a time duration of a shutter control signal having a positive voltage applied to the overflow drain region, a time period during which photocarriers, i.e. electrons are flown into the gate region and stored therein, can be controlled at will, and an electronic shutter function can be achieved.

Abstract: A solid state image pick-up device with a shutter function including a number of charge coupled devices of vertical overflow domain type is disclosed. A light receiving portion comprises a p.sup.- epitaxial layer arranged on a main surface of an n.sup.+ substrate and an n.sup.+ diffusion surface region is provided in a surface of the p.sup.- layer. A p.sup.+ control gate for controlling a potential barrier between the n.sup.+ diffusion surface region and the p.sup.- epitaxial layer is formed in the epitaxial layer adjacent to the light receiving portion, and a p well region is formed in the epitaxial layer adjacent to the light receiving portion. During a shutter close period, i.e. before a signal charge storing operation, a control voltage applied to the control gate and a reverse bias voltage applied across the n.sup.+ substrate and p.sup.

Abstract: A solid state image sensor comprising static induction transistors each forming a picture element.Each static induction transistor in the solid state image sensor has a lateral structure in which the source and drain regions are formed by surface regions provided on the same side in an epitaxial layer forming the channel region and a signal charge storage gate region are formed by a buried gate region provided under the channel region and a surface gate region provided on the channel region, so that the source-drain current flows in parallel to the surface of epitaxial layer and is effectively controlled between the buried and surface gate regions.

Abstract: The invention relates to a purifier for purifying an industrial raw material gas, formed by depositing a hydrogenated or a fluorinated amorphous substance of an element selected from a group consisting of Si and Ge on a carrier such as a zeolite. The industrial raw material gas to be purified is brought into contact with the purifier, which is maintained at a predetermined temperature, to remove simultaneously a small amount of oxygen and water components from the industrial raw material gas.