Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: An optical apparatus, comprising a Silicon Photonics (SiP) device, with multiple optical waveguides and an array of collimating lenses, configured to receive light from the multiple optical waveguides in paths not including optical fibers and to collimate the light of the multiple optical waveguides into collimated beams. A receptacle is configured to receive an external optical device in an orientation aligned with the collimated beams from the array of collimating lenses.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: A twin axial cable structure is provided for transmitting signals that makes use of insulative materials that are not easily extruded, such as expanded polyethylene (ePE) and expanded polytetrafluoroethylene (ePTFE). The cable structure includes an insulative body portion having a pair of open channels defined through an outer longitudinal surface of the insulative body portion, in which are disposed a pair of conductive wires. A conductive sheet is disposed on the insulative body portion, and a grounding element is placed in contact with the conductive sheet, such as by applying planar conductive sheets and grounding elements and/or ground wires to the insulative body portion. Corresponding methods and apparatuses for manufacturing the same are also provided. The cable structures, methods, and apparatuses described herein can produce a cable structure for transmitting multiple differential signals within the same structure, with minimal negative effects on other, neighboring transmissions.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: Optical apparatus connecting a Silicon Photonics (SiP) device, which comprises multiple optical waveguides to an array of collimating lenses, configured to collimate light of the multiple optical waveguides into collimated beams. The optical apparatus includes a deflection element, distinct from the SiP device, including a light deflection surface which deflects light from the waveguides by an angle greater than 30 degrees, to the array of collimating lenses.

Abstract: An optical apparatus, comprising a Silicon Photonics (SiP) device, with multiple optical waveguides and an array of collimating lenses, configured to receive light from the multiple optical waveguides in paths not including optical fibers and to collimate the light of the multiple optical waveguides into collimated beams. A receptacle is configured to receive an external optical device in an orientation aligned with the collimated beams from the array of collimating lenses.

Abstract: An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: An apparatus includes a Silicon Photonics (SiP) device and a ferrule. The SiP includes multiple optical waveguides. The ferrule includes multiple optical fibers for exchanging optical signals with the respective optical waveguides of the SiP device. In some embodiments, an array of micro-lenses is configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule. In some embodiments, a polymer layer is placed between the SiP device and the ferrule, and includes multiple polymer-based Spot-Size Converters (SSCs) that are configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule.

Abstract: An apparatus includes a Silicon Photonics (SiP) device and a ferrule. The SiP includes multiple optical waveguides. The ferrule includes multiple optical fibers for exchanging optical signals with the respective optical waveguides of the SiP device. In some embodiments, an array of micro-lenses is configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule. In some embodiments, a polymer layer is placed between the SiP device and the ferrule, and includes multiple polymer-based Spot-Size Converters (SSCs) that are configured to couple the optical signals between the optical waveguides of the SiP device and the respective optical fibers of the ferrule.

Abstract: An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.