Abstract: The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.

Abstract: Methods, apparatus and computer readable medium for writing data into a flash memory device are disclosed. In some embodiments, the data is written in a writing mode selected in accordance with an extent to which the flash memory storage device or a flash die thereof is full of previously-stored data. The presently disclosed techniques may be implemented on the “device-side” (for example, by a device controller of the flash device) and/or on the “host-side.” In some embodiments, the selected writing mode is a bits-per-cell density mode. In some embodiments, the selected writing mode is a “slower” or “faster” writing mode. The presently disclosed techniques relate to SBC as well as MBC devices.

Abstract: The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.

Abstract: A method for data storage includes supplying data to and from a host to a storage memory via a secure data path. A first CPU is employed to control operation of the storage memory, and a second CPU is employed to control operation of the secure data path.

Abstract: A method for managing a memory device, a memory device so managed and a system that includes such a memory device. A value of a longevity parameter of the device is monitored after a data operation on the device in which the monitoring is performed by the device. A grade of the device is derived from the value. Preferred longevity parameters include a ratio of successfully-processed data to unsuccessfully-processed data and a deviation in a power consumption of the device. The grade serves as a forecast of a life expectancy of the memory. Preferred grades include: a comparison grade, a maximum grade, and an average grade.

Abstract: An integrated circuit has a plurality of bonding pads, at least one of which is adapted to be directly electrically connected to a bonding pad of another integrated circuit rather than to an external pin of a package that houses a semiconductor die on which the integrated circuit is fabricated. The integrated circuit is designed and offered for sale. Preferred scenarios include offering the integrated circuit for sale even before receiving an order for the semiconductor die or alternatively, only in response to receiving a first such order. Preferably the die is offered for sale as a standard item. The dies are either fabricated on demand or kept in inventory.

Abstract: Methods and systems for counting items in storage containers in an array of at least two storage containers, the method including the steps of: providing a storage array of at least two storage containers, each of the storage containers containing an unknown amount of items; providing a receiving array of at least two receiving containers, wherein the receiving containers initially contain no items; extracting a layer of the items from the storage array; inserting the layer into corresponding locations in the receiving array; repeating the steps of extracting and inserting while at least one of the storage containers is not empty; counting, for each storage container in the storage array, a productive-extraction amount; and reporting, for at least some of the storage containers, the productive-extraction amount from each storage container. Preferably, the method further includes recovering a storage identity upon recovery from a system failure that erases the productive-extraction amount.

Abstract: A computerized system is booted from a flash memory device configured to always operate one or more of its blocks only in a M-bit-per-cell mode and the rest of its blocks in a N>M-bit-per-cell mode. When the system is powered up, an initialization program is retrieved from the M-bit-per-cell block(s), corrected for errors using a first error correction method, and executed. Data accessed subsequently from the N-bit-per-cell blocks are corrected using an error correction method that corrects more errors per block than the first error correction method.

Abstract: Embodiments of the present invention relate to an apparatus, method and computer readable medium for recovering from a failed or aborted outgoing data transfer operation from a host device to a peripheral storage device. In some embodiments, before the peripheral storage device is corrupted by the failed outgoing data transfer operation, one or more recovery data objects are stored on the host-side. After the peripheral storage device is corrupted by the failed data transfer, the host device responds to a subsequent coupling with the peripheral storage device by repairing the corrupted peripheral storage device using one or more of the host-side stored recovery data objects. Optionally, the host device also restores the outgoing aborted or failed data transfer operation.

Abstract: A data storage device includes a NAND flash memory, an executable interface and a controller for receiving, from a host, via the executable interface, an instruction to access the NAND flash memory at a virtual address and for translating the virtual address to a physical address of the volatile memory. Preferably, the controller also provides boot functionality to the host.

Abstract: An inverted pyramid multi-die package provides, for each die pad on an upper die, a rigid support underneath extending to a substrate. Such configuration reduces both the wire sweep and weakening torques. A lower die, smaller than the upper die in at least one dimension, may be positioned between the upper die and the substrate. The two dice may or may not contact each other, or they may contact each other via an intermediate spacer. The lower die may be a flip chip. The multi-die package may be fashioned without the lower die or the substrate. Wire sweep is reduced, because the second die is smaller than the upper die in at least one dimension. Weakening torques are reduced, because spacers at the periphery of the upper die absorb the impact of bonding wires thereon.

Abstract: An inverted pyramid multi-die package provides, for each die pad on an upper die, a rigid support underneath extending to a substrate. Such configuration reduces both the wire sweep and weakening torques. A lower die, smaller than the upper die in at least one dimension, may be positioned between the upper die and the substrate. The two dice may or may not contact each other, or they may contact each other via an intermediate spacer. The lower die may be a flip chip. The multi-die package may be fashioned without the lower die or the substrate. Wire sweep is reduced, because the second die is smaller than the upper die in at least one dimension. Weakening torques are reduced, because spacers at the periphery of the upper die absorb the impact of bonding wires thereon.

Abstract: The present disclosure relates to a portable digital media player, and in particular to a portable digital media player device having specific mechanical properties. In some embodiments, the portable digital media player includes a device port that is configured as a supportive port. In some embodiments, the device port is a plug. In some embodiments, a volume ratio between a minimally circumscribing rectangular prism of the digital media player and a minimally circumscribing rectangular prism of the plug is at most 10:1, or at most 5:1. In some embodiments, a media system is provided where the digital media player is mated with the host presentation device. In some embodiments, the media system provides certain mechanical properties.

Abstract: A method for managing a memory device, a memory device so managed and a system that includes such a memory device. A value of a longevity parameter of the device is monitored after a data operation on the device in which the monitoring is performed by the device. A grade of the device is derived from the value. Preferred longevity parameters include a ratio of successfully-processed data to unsuccessfully-processed data and a deviation in a power consumption of the device. The grade serves as a forecast of a life expectancy of the memory. Preferred grades include: a comparison grade, a maximum grade, and an average grade.

Abstract: The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.

Abstract: A card vending machine includes a storage area, wherein each of a plurality of memory cards to be issued by a respective one of at least two different issuers are stored. A security mechanism conditions access of each issuer to only a respective portion of the storage area upon authorization of this issuer. An interface mechanism is operated by a user to define a purchasing transaction and a controller is operative, in accordance with the interface mechanism, to customize a memory card at least in part according to the purchasing transaction.

Abstract: A method of manufacturing a non-volatile flash memory device, including setting a first number of bits stored per cell for at least one first cell less than a second number of bits stored per cell for at least one second cell such that the setting permanently fixes the first number and the second number prior to shipping the device for use. Preferably the setting is based on predicted reliabilities of the cells. Preferably, the predicted reliability of the first cells is less than the predicted reliability of the second cells. Preferably, the setting is based on respective locations within the device of the first cells and the second cells. Preferably, the setting is based on respective word lines connecting to the first cells and the second cells.

Abstract: An integrated circuit has a plurality of bonding pads, at least one of which is adapted to be directly electrically connected to a bonding pad of another integrated circuit rather than to an external pin of a package that houses a semiconductor die on which the integrated circuit is fabricated. The integrated circuit is designed and offered for sale. Preferred scenarios include offering the integrated circuit for sale even before receiving an order for the semiconductor die. or alternatively, only in response to receiving a first such order. Preferably. the die is offered for sale as a standard item. The dies are either fabricated on demand or kept in inventory.

Abstract: A computer system includes a hard disk drive and an interface for optionally operationally connecting a cache memory for the hard disk drive, via a mechanism such as a system bus that is separate from the hard disk drive or directly to a controller of the hard disk drive. A hard disk drive of the present invention includes a nonvolatile medium for storing data, a controller for reading and writing the data and an interface for optionally operationally connecting to the controller a cache memory for the nonvolatile medium. Whether data are cached depends on whether the cache memory is present. Computer systems of the present invention are configured with or without cache memories, depending on customer requirements.

Abstract: Methods, systems and devices for testing flash memory dies are disclosed. According to some embodiments, during the post-wafer sort stage of device manufacture, a plurality of flash memory devices, each of which includes a flash controller die and at least one flash memory die associated with a common housing, are subjected to a testing process, for examples, a batch testing process or a mass testing process. During testing, a respective flash controller residing on a respective flash controller die executes at least one test program to test one or more respective flash memory dies of the respective flash device. A testing system including at least 100 of the flash memory devices and a mass-testing board is disclosed. Furthermore, flash memory devices where the flash controller is operative to test one or more of the flash memory dies are disclosed. Exemplary testing includes but is not limited to bad block testing.