Abstract: An outphasing amplifier includes a first class-E power amplifier (16-1) having an output coupled to a first conductor (31-1) and an input receiving a first RF drive signal (S1(t)). A first reactive element (CA-1) is coupled between the first conductor and a second conductor (30-1). A second reactive element (LA-1) is coupled between the second conductor and a third conductor (32-1). A second class-E power amplifier (17-1) includes an output coupled to a fourth conductor (31-2) and an input coupled to a second RF drive signal (S2(t)), a third reactive element (CA-3) coupled between the second and fourth conductors. Outputs of the first and second power amplifiers are combined by the first, second and third reactive elements to produce an output current in a load (R). An efficiency enhancement circuit (LEEC-1) is coupled between the first and fourth conductors to improve power efficiency at back-off power levels. Power enhancement circuits (20-1,2) are coupled to the first and fourth conductors, respectively.

Abstract: At least one tone is generated. An output signal is generated in response to an input signal and the at least one tone. The output signal is modulated. The input signal and the at least one tone are represented in the modulated output signal. The at least one tone is outside a bandwidth of the input signal as represented in the modulated output signal. The modulated output signal is amplified. The at least one tone in the amplified signal is attenuated after the amplifying.

Abstract: An apparatus is provided. In the apparatus, there is an antenna package and an integrated circuit (IC). A circuit trace assembly is secured to the IC. A coupler (with an antenna assembly and a high impedance surface (HIS)) is secured to the circuit trace assembly. An antenna assembly has a window region, a conductive region that substantially surrounds the window region, a circular patch antenna that is in communication with the IC, and an elliptical patch antenna that is located within the window region, that is extends over at least a portion of the circular patch antenna, and that is in communication with the circular patch antenna. The HIS substantially surrounds the antenna assembly.

Abstract: An electronic device has a multilayer substrate that has an interface surface configured for interfacing to a dielectric waveguide. A conductive layer on the substrate is etched to form a dipole antenna disposed adjacent the interface surface to provide coupling to the dielectric waveguide. A reflector structure is formed in the substrate adjacent the dipole antenna opposite from the interface surface.

Abstract: A metallic waveguide is mounted on a multilayer substrate. The metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate. A pinnacle of the tapered end is coupled to the ground plane element, and the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line.

Abstract: At least one tone is generated. An output signal is generated in response to an input signal and the at least one tone. The output signal is modulated. The input signal and the at least one tone are represented in the modulated output signal. The at least one tone is outside a bandwidth of the input signal as represented in the modulated output signal. The modulated output signal is amplified. The at least one tone in the amplified signal is attenuated after the amplifying.

Abstract: In example embodiments disclosed herein, a primary wireless device infrequently sends a ping to a secondary device to determine if there are any communications from an access point intended for the primary wireless device. The secondary device, ideally connected to wall power, is wirelessly connected to the access point, acting as a connected proxy so that the primary wireless device, typically battery powered, does not always have to be connected. In a situation in which an incoming communication is intended for the primary device, the secondary device receives the notification and buffers whatever is sent from the access point intended for the primary wireless device and acknowledges the receipt. Then, when the primary wireless device pings the secondary device, the secondary device sends the buffered communication to the primary wireless device. As far as the access point is concerned, it thinks it is communicating directly with primary wireless device.

Abstract: A circuit includes an amplifier configured to amplify an input signal and generate an output signal. The circuit also includes a tuning network configured to tune frequency response of the amplifier. The tuning network includes at least one tunable capacitor, where the at least one tunable capacitor includes at least one micro-electro mechanical system (MEMS) capacitor. The amplifier could include a first die, the at least one MEMS capacitor could include a second die, and the first die and the second die could be integrated in a single package. The at least one MEMS capacitor could include a MEMS superstructure disposed over a control structure, where the control structure is configured to control the MEMS superstructure and tune the capacitance of the at least one MEMS capacitor.

Abstract: Conventional routers employ a wired backplane that employs “long reach” serializer/deserializer (SerDes) links, but this type of architecture is complicated, costly, and uses a considerable amount of power. To address some of these issues, a new wireless backplane architecture is provided here. This wireless backplane employs direct millimeter wave links between line cards that replaces the convention, wired switching fabric.

Abstract: An outphasing amplifier includes a first class-E power amplifier (16-1) having an output coupled to a first conductor (31-1) and an input receiving a first RF drive signal (S1(t)). A first reactive element (CA-1) is coupled between the first conductor and a second conductor (30-1). A second reactive element (LA-1) is coupled between the second conductor and a third conductor (32-1). A second class-E power amplifier (17-1) includes an output coupled to a fourth conductor (31-2) and an input coupled to a second RF drive signal (S2(t)), a third reactive element (CA-3) coupled between the second and fourth conductors. Outputs of the first and second power amplifiers are combined by the first, second and third reactive elements to produce an output current in a load (R). An efficiency enhancement circuit (LEEC-1) is coupled between the first and fourth conductors to improve power efficiency at back-off power levels. Power enhancement circuits (20-1,2) are coupled to the first and fourth conductors, respectively.

Abstract: A metallic waveguide is mounted on a multilayer substrate. The metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate. A pinnacle of the tapered end is coupled to the ground plane element, and the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line.

Abstract: An apparatus is provided. Transmission line cells are formed in a first region. A first metallization layer is formed over the transmission line cells within a portion of the first region. At least a portion of the first metallization layer is electrically coupled to the plurality of transmission line cells. A second metallization layer is formed over the first metallization layer with an interconnect portion, and overlay portion, and a first balun. The interconnect portion at least partially extends into the first region, and the overlay portion is within the first region. The first balun winding is electrically coupled to the overlay portion and partially extends into a second region. The first region partially surrounds the second region. A third metallization layer is formed over the second metallization layer having a second balun winding within the second region, where the second winding is generally coaxial with the first balun winding.

Abstract: A rotatable coupler for dielectric wave guides is described. A first dielectric wave guide (DWG) has an interface surface at a one end of the DWG. A second DWG has a matching interface surface at an end of the second DWG. A rotatable coupling mechanism is coupled to the two DWG ends and is configured to hold the interface surface of the first DWG in axial alignment with the interface surface of the second DWG while allowing the interface surface of the first DWG to rotate axially with respect to the interface surface of the second DWG.

Abstract: At least one tone is generated. An output signal is generated in response to an input signal and the at least one tone. The output signal is modulated. The input signal and the at least one tone are represented in the modulated output signal. The at least one tone is outside a bandwidth of the input signal as represented in the modulated output signal. The modulated output signal is amplified. The at least one tone in the amplified signal is attenuated after the amplifying.

Abstract: A system for processing a signal includes a detector configured to detect a two-level stream of bits; a converter configured to generate a three-level control signal based on two adjacent values within the two-level stream of bits; and a switch configured to determine which of three different paths to couple a current source to based on a value of the three-level control signal. Thus, based on adjacent values of the output stream a three-level control signal is generated which controls coupling of the current source to one of three different paths. This type of three-level digital-to-analog converter can be, for example, part of the feedback loop of an analog-to-digital converter. Similar techniques can also be utilized in a multi-segment digital-to-analog converter in which each segment of the DAC is controlled by a 3-level control signal and the DAC is implement using PMOS devices.

Abstract: An apparatus is provided. A plurality of transceiver antennas are arranged to form a phased array, where each antenna include a differential transmit antenna and a differential receive antenna arranged in a first pattern. A plurality of transceivers are arranged in a second pattern that is substantially symmetrical, and each transceiver is associated with at least one of the transceiver antennas and includes a feed network. Each feed network has a power amplifier (PA), a first matching network that is coupled between the PA and its associated transmit antenna so as to translate the phase of each differential transmit signal, a low noise amplifier (LNA), and a second matching network that is coupled between the LNA and its associated receive antenna so as to translate the phase of each differential receive signal.

Abstract: A dielectric waveguide (DWG) has a dielectric core member that has a length L and an oblong cross section. The core member has a first dielectric constant value. A dielectric cladding surrounds the dielectric core member; the cladding has a second dielectric constant value that is lower than the first dielectric constant. A conductive shield layer surrounds a portion of the dielectric cladding.

Abstract: A rotatable coupler for dielectric wave guides is described. A first dielectric wave guide (DWG) has an interface surface at a one end of the DWG. A second DWG has a matching interface surface at an end of the second DWG. A rotatable coupling mechanism is coupled to the two DWG ends and is configured to hold the interface surface of the first DWG in axial alignment with the interface surface of the second DWG while allowing the interface surface of the first DWG to rotate axially with respect to the interface surface of the second DWG.

Abstract: An apparatus for emitting radiation is provided. The apparatus comprises an antenna formed on a substrate, and a high impedance surface (HIS). The HIS has a plurality of cells formed on the substrate that are arranged to form an array that substantially surrounds at least a portion of the antenna. Each cell generally includes a ground plane, first plate, second plate, and an interconnect. The ground plane is formed on the substrate, while the first plate (which is substantially rectangular) is formed over and coupled to the ground plane. The first plate for each cell is also arranged so as to form a first checkered pattern for the array. The second plate (which is substantially rectangular) is formed over and is substantially parallel to the first plate. The first and second plates are also substantially aligned with a central axis that extends generally perpendicular to the first and second plates hand have a interconnect formed therebetween.

Abstract: A loop antenna is provided. The apparatus comprises a substrate, a first metallization layer, and a second metallization layer. The substrate has first and second feed terminals and a ground terminal. The first metallization layer is disposed over the substrate and includes a first window conductive region, a first conductive region, a second conductive region, and a third conductive region. The first conductive region is disposed over and is in electrical contact with the first feed terminal; it is also is substantially circular and located within the first window region. The second conductive region is disposed over and is in electrical contact with the second feed terminal; it is also substantially circular and is located within the first window region. The a third conductive region is disposed over and is in electrical contact with the ground terminal, and the third conductive region substantially surrounds the first window region.