Patents by Inventor Bao Le

Bao Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5738530
    Abstract: A printed-circuit-type electrical contact pad having a plurality of electrically conductive metal traces and a plurality of protuberant electrical contacts projecting from the traces. The protuberances comprise an electrically conductive elastomer having a wide base portion anchored in the end of the trace by a truncated portion of the trace upstanding from the face of the pad. A denuded tip portion of the elastomer extends from the base portion for resiliently engaging a contact site on an electrical device to which the pad is coupled. A unique process for making the aforesaid pad is disclosed and claimed.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: April 14, 1998
    Assignee: Packard Hughes Interconnect Company
    Inventors: Chris M. Schreiber, Bao Le
  • Patent number: 5708557
    Abstract: The invention includes a puncture-resistant electrostatic chuck with a flat surface and a method of making the same. The electrostatic chuck includes a conductive layer such as copper foil that is laminated to a first insulation layer such as a polyimide. A puncture-resistant layer is placed over the conductive layer and includes random or woven fibers held together by a resin. The puncture-resistant layer has an uneven topography on a top surface due to the fibers contained therein. A second insulation layer overlies the puncture-resistant layer and has a top surface which is substantially flat. The flat top surface of the second insulation layer is made by laminating layers together with a mandrel which is polished and free of irregularities such as pits, dents and high spots. Preferably the mandrel has a uniform thickness over its entire surface.
    Type: Grant
    Filed: August 22, 1996
    Date of Patent: January 13, 1998
    Assignee: Packard Hughes Interconnect Company
    Inventors: Haim Feigenbaum, Bao Le, Randy Lee Thomas, Dong Vo
  • Patent number: 5657207
    Abstract: A substrate has a plurality of circuit traces having ends which terminate in raised contacts and an integrated circuit (IC) chip has a plurality of circuit traces terminating in contact ends which engage the raised contacts when the IC chip is positioned onto the substrate. The substrate also has a plurality of raised features thereon which are higher than and spaced from the raised contacts. The raised features have tapered side surfaces for engaging vertically extending surfaces on the IC chip to guide the IC chip into place of the substrate and so that its contact ends are aligned with and engage the raised contacts.
    Type: Grant
    Filed: April 29, 1996
    Date of Patent: August 12, 1997
    Assignee: Packard Hughes Interconnect Company
    Inventors: Chris M. Schreiber, Bao Le