Patents by Inventor Baoxing Chen

Baoxing Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12125630
    Abstract: Micro-scale planar-coil transformers including one or more shields are disclosed. The one or more shields can block most common-mode current from crossing from one side to another side of a transformer. Reduction of common-mode current crossing the transformer results in reduction of dipole radiation, which is the main component of electromagnetic interference (EMI) in some transformers.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: October 22, 2024
    Assignee: Analog Devices International Unlimited Company
    Inventors: Baoxing Chen, Wenhui Qin, Yuanyuan Zhao, Xin Yang, Shaoyu Ma
  • Patent number: 12080460
    Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: September 3, 2024
    Assignee: Analog Devices Global Unlimited Company
    Inventors: Paul Lambkin, Patrick J. Murphy, Bernard Patrick Stenson, Laurence B. O'Sullivan, Stephen O'Brien, Shane Geary, Baoxing Chen, Sombel Diaham
  • Publication number: 20240272015
    Abstract: The present disclosure provides a core temperature sensing assembly for measuring a core temperature of an object when positioned on a surface of the object. The sensing assembly uses a heat flux sensor in the form of a thermoelectric generator. The thermoelectric generator is provided as part of an integrated circuit. Alternatively or additionally, the sensing assembly uses the thermoelectric generator to actively heat or cool the object. Alternatively or additionally, the sensing assembly comprises a second heat flux sensor in the form of a thermoelectric generator, the first and second heat flux sensors having different thermal resistances determined by the configuration of the thermocouples.
    Type: Application
    Filed: June 14, 2022
    Publication date: August 15, 2024
    Inventors: Jane CORNETT, Yi YUAN, Baoxing CHEN, Ciaran CURTIN
  • Publication number: 20240186696
    Abstract: A digital isolator includes a receiver configured to receive digital raw data at a primary side of the digital isolator. A digital-to-digital encoder is disposed at the primary side of the digital isolator. The digital-to-digital encoder is configured to create coded data. One or more digital isolators are configured to transmit the coded data across a transformer and an isolation barrier to create output coded data. A digital-to digital decoder is disposed at a secondary side of the digital isolator. The digital-to digital decoder is configured to decode the output coded data to create decoded data, determine error in coupling across the digital isolator based on the decoded data and the digital raw data, and provide an error signal based the error in coupling across the digital isolator.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 6, 2024
    Inventors: Iku Nagai, Baoxing Chen, Jonathan Ephraim David Hurwitz, Hidetoshi Takagi, Paul Kearney, Andreas Koch
  • Publication number: 20240006469
    Abstract: Micro-scale passive devices, such as transformers and capacitors, having an insulator layer with insulative particles and/or conductive or nonlinear conductive particles disposed therein. The insulative particles disposed in the insulator layer can increase a breakdown electric field of the device, and the conductive or nonlinear conductive particles disposed in the insulator layer can reduce a maximum electric field of the device. Increasing the breakdown electric field of the device and/or reducing the maximum electric field of the device can increase the lifespan of a micro-scale passive device, and/or may allow the device to operate at a higher threshold electric field without breakdown of the device.
    Type: Application
    Filed: July 1, 2022
    Publication date: January 4, 2024
    Applicant: Analog Devices International Unlimited Company
    Inventors: Sombel Diaham, Baoxing Chen
  • Publication number: 20240006470
    Abstract: Micro-scale passive devices, such as transformers and capacitors, having an insulator layer with insulative particles and/or conductive or nonlinear conductive particles disposed therein. The insulative particles disposed in the insulator layer can increase a breakdown electric field of the device, and the conductive or nonlinear conductive particles disposed in the insulator layer can reduce a maximum electric field of the device. Increasing the breakdown electric field of the device and/or reducing the maximum electric field of the device can increase the lifespan of a micro-scale passive device, and/or may allow the device to operate at a higher threshold electric field without breakdown of the device.
    Type: Application
    Filed: July 1, 2022
    Publication date: January 4, 2024
    Applicant: Analog Devices International Unlimited Company
    Inventors: Sombel Diaham, Baoxing Chen
  • Publication number: 20230411065
    Abstract: A fully symmetrical and balanced monolithic or multi-die integrated circuit transformer device is described. The device can comprise a first and second transformer. The first and second transformer can each comprise a symmetrical bottom coil including electrically conductive crossovers between individual windings of pairs of adjacent windings. Each of the bottom coils can further comprise a first, a second differential terminal, and a center tap third terminal electrically connected to the inner-most winding of the bottom coil. Each transformer can further comprise a spiral top coil electrically connected to an encompassed inner pad and a laterally offset outer pad, the top coil, inner pad, and outer pad including a shared electrically conductive integrated circuit layer. The respective top coils of each transformer can be overlaid and separated from the respective bottom coils by an electrically insulating dielectric layer.
    Type: Application
    Filed: June 15, 2022
    Publication date: December 21, 2023
    Inventors: Ruida Yun, Dongwan Ha, Baoxing Chen
  • Publication number: 20230275118
    Abstract: The disclosed technology generally relates to lithographically defined conductive lines for integrated circuit devices formed by plating, and more particularly to conductive lines shaped to reduce the magnitude of electric field in the electric field distributions around conductive lines of integrated and monolithic transformers and isolators.
    Type: Application
    Filed: February 28, 2022
    Publication date: August 31, 2023
    Inventors: Matthew Thomas Canty, Sombel Diaham, Jan Kubik, Paul Martin Lambkin, Baoxing Chen, Yi Yuan, John G. Shanahan
  • Patent number: 11728090
    Abstract: Micro-scale devices, such as transformers and capacitors, having a floating conductive layer are disclosed. A floating conductive layer may be disposed in an insulator layer and can reduce a maximum electric field between a first planar conductor and a second planar conductor of a micro-scale passive device. Reduction of a maximum electric field between a first planar conductor and a second planar conductor can reduce undesirable effects on electrical components.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: August 15, 2023
    Assignee: Analog Devices International Unlimited Company
    Inventors: Patrick M. McGuinness, Paul Lambkin, Laurence B. O'Sullivan, Bernard Patrick Stenson, Steven Tanghe, Baoxing Chen
  • Publication number: 20230247767
    Abstract: Isolators for high frequency signals transmitted between two circuits configured to operate at different voltage domains are provided. The isolators may include resonators capable of operating at high frequencies with high bandwidth, high transfer efficiency, high isolation rating, and a small substrate footprint. In some embodiments, the isolators may operate at a frequency not less than 30 GHz, not less than 60 GHz, or between 20 GHz and 200 GHz, including any value or range of values within such range. The isolators may include isolator components galvanically isolated from and capacitively coupled to each other. The sizes and shapes of the isolator components may be configured to control the values of equivalent inductances and capacitances of the isolators to facilitate resonance in operation. The isolators are compatible to different fabrication processes including, for example, micro-fabrication and PCB manufacture processes.
    Type: Application
    Filed: February 3, 2022
    Publication date: August 3, 2023
    Applicant: Analog Devices International Unlimited Company
    Inventors: Jinglin Xu, Paul Lambkin, Ramji Lakshmanan, Baoxing Chen
  • Patent number: 11711894
    Abstract: Isolators for high frequency signals transmitted between two circuits configured to operate at different voltage domains are provided. The isolators may include resonators capable of operating at high frequencies with high bandwidth, high transfer efficiency, high isolation rating, and a small substrate footprint. In some embodiments, the isolators may operate at a frequency not less than 30 GHz, not less than 60 GHz, or between 20 GHz and 200 GHz, including any value or range of values within such range. The isolators may include isolator components galvanically isolated from and capacitively coupled to each other. The sizes and shapes of the isolator components may be configured to control the values of equivalent inductances and capacitances of the isolators to facilitate resonance in operation. The isolators are compatible to different fabrication processes including, for example, micro-fabrication and PCB manufacture processes.
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: July 25, 2023
    Assignee: Analog Devices International Unlimited Company
    Inventors: Jinglin Xu, Paul Lambkin, Ramji Lakshmanan, Baoxing Chen
  • Publication number: 20220392684
    Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
    Type: Application
    Filed: August 17, 2022
    Publication date: December 8, 2022
    Inventors: Paul Lambkin, Patrick J. Murphy, Bernard Patrick Stenson, Laurence B. O'Sullivan, Stephen O'Brien, Shane Geary, Baoxing Chen, Sombel Diaham
  • Patent number: 11450469
    Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: September 20, 2022
    Inventors: Paul Lambkin, Patrick J. Murphy, Bernard Patrick Stenson, Laurence B. O'Sullivan, Stephen O'Brien, Shane Geary, Baoxing Chen, Sombel Diaham
  • Patent number: 11398848
    Abstract: An embodiment of a communication circuit for communicating data across an isolation barrier may include an input circuit to receive a plurality of input data channels, a framing circuit to frame an input data packet from the plurality of input data channels, an encoding circuit to select a characteristic of a data symbol to represent a plurality of bits of the framed input data packet, and a driver circuit to drive one or more data symbols representing the framed input data packet onto an isolator configured to communicate data across the isolation barrier. The encoding circuit may select an amplitude, frequency or phase of the data symbol from a plurality of predetermined amplitudes, frequencies or phases, to encode the plurality of bits as the selected amplitude, frequency or phase.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: July 26, 2022
    Assignee: Analog Devices, Inc.
    Inventors: Bikiran Goswami, Baoxing Chen
  • Patent number: 11239805
    Abstract: Isolators and methods for operating the same are described for opto-isolators with improved common mode transient immunity (CMTI). In some embodiments, a pair of photodetectors are provided in the opto-isolator and configured to generate photocurrents of opposite signs or directions in response to a light signal. Photocurrents from the pair of photodetectors are combined in a differential manner to represent data transmitted in a light signal, while common mode transient noise at the two photodetectors is attenuated or eliminated.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: February 1, 2022
    Assignee: Analog Devices, Inc.
    Inventors: Check F. Lee, Baoxing Chen
  • Patent number: 11152975
    Abstract: Isolators for high frequency signals transmitted between two circuits configured to operate at different voltage domains are provided. The isolators may include resonators capable of operating at high frequencies with high transfer efficiency, high isolation rating, and a small substrate footprint. In some embodiments, the isolators may operate at a frequency not less than 20 GHz, not less than 30 GHz, not less than 65 GHz, or between 20 GHz and 100 GHz, including any value or range of values within such range. The isolators may include inductive loops with slits and capacitors integrally formed at the slits. The sizes and shapes of the inductive loops and capacitors may be configured to control the values of equivalent inductances and capacitances of the isolators. The isolators are compatible to different fabrication processes including, for example, micro-fabrication and PCB manufacture processes.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: October 19, 2021
    Assignee: Analog Devices International Unlimited Company
    Inventors: Paul Lambkin, Baoxing Chen, Jinglin Xu, Ramji Lakshmanan
  • Publication number: 20210249185
    Abstract: Micro-scale devices, such as transformers and capacitors, having a floating conductive layer are disclosed. A floating conductive layer may be disposed in an insulator layer and can reduce a maximum electric field between a first planar conductor and a second planar conductor of a micro-scale passive device. Reduction of a maximum electric field between a first planar conductor and a second planar conductor can reduce undesirable effects on electrical components.
    Type: Application
    Filed: February 10, 2020
    Publication date: August 12, 2021
    Applicant: Analog Devices International Unlimited Company
    Inventors: Patrick M. McGuinness, Paul Lambkin, Laurence B. O'Sullivan, Bernard Patrick Stenson, Steven Tanghe, Baoxing Chen
  • Publication number: 20210239405
    Abstract: A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 5, 2021
    Inventors: Marc T. Dunham, Baoxing Chen
  • Patent number: 11044022
    Abstract: Isolators having a back-to-back configuration for providing electrical isolation between two circuits are described, in which multiple isolators formed on a single, monolithic substrate are connected in series to achieve a higher amount of electrical isolation for a single substrate than for isolators formed on separate substrates connected in series. Discrete dielectric regions positioned between isolator components forming an isolator provide electrical isolation between the isolator components as well as between the isolators formed on the substrate. The back-to-back isolator may provide one or more communication channels for transfer of information and/or power between different circuits.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: June 22, 2021
    Assignee: Analog Devices Global Unlimited Company
    Inventors: Laurence B. O'Sullivan, Shane Geary, Baoxing Chen, Bernard Patrick Stenson, Paul Lambkin, Patrick M. McGuinness, Stephen O'Brien, Patrick J. Murphy
  • Patent number: 11018660
    Abstract: Power isolators with multiple selectable feedback modes are described. The power isolators may transfer a power signal from a primary side to a second side. A feedback signal may be provided from the secondary side to the primary side to control generation of the power signal on the primary side. In this manner, the power signal provided to the secondary side may be maintained within desired levels. The feedback signal may be generated by feedback circuitry configurable to operate in different modes, such that the feedback signal may be of differing types depending on which feedback mode is implemented.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: May 25, 2021
    Assignee: Analog Devices Global Unlimited Company
    Inventors: Yue Zhuo, Wenhui Qin, Yingjie Guo, Shaoyu Ma, Tianting Zhao, Baoxing Chen